2004 Microchip Technology Inc.
DS21817B-page 1
PS052
Features
• Hardware platform for configuration, calibration
and test of Microchip battery management
products
• Operates under control of Windows
®
based
PowerMate™ software (PS7XX) and
PowerTool™ 500 software (PS5XX) through an
RS-232 port or USB interface to the PC
• Directly connects to assembled PS7XX or PS5XX
battery pack
• SMBus communication managed by onboard
processor
• Supports loading and verification of battery
configuration parameters and 3D cell models in
memory
• Pluggable battery connector for convenience and
flexibility
• Terminals for attachment to an external load or
charger
• Powered by 12V DC external supply (included)
• Production proven EMI/ESD protection
• Overall mechanical dimensions:
- 3.938 W x 6.300 L (inches)
- 100.025 W x 160.020 L (millimeters)
Ordering Information
Development/Test Software
Part No.
Description
PS052
PowerCal™ 2 Calibration Board
Part No.
Description
PS070
PowerMate™ Software for use with PS7XX
PS050
PowerTool™ 500 Software for use with
PS5XX
PowerCal
™
2 Calibration Platform
PS052
DS21817B-page 2
2004 Microchip Technology Inc.
1.0
PRODUCT OVERVIEW
PowerCal 2 is a powerful, easy to use hardware
platform that supports configuration, calibration and
test of Microchip PS7XX and PS5XX ICs. It operates
under the control of Microchip’s development/test
software interfaced to a Windows PC.
The PowerCal 2 board facilitates serial or USB com-
munication between the PC and the SMBus battery
interface. Whether connected to the PC’s serial (RS-232)
or USB port, the PowerCal 2 board must be powered
through an external 12V DC power supply.
2.0
GENERAL SETUP
The Microchip PowerCal 2 platform facilitates com-
munication between a battery containing a Microchip
PS5XX or PS7XX IC and a PC running Microchip’s
development/test software. The information that
follows will guide you through the setup of the various
features available.
2.1
Connections
• P1 – Serial (RS-232)
• J1 – USB
• J2 – 12V DC power supply
• TBP – Pluggable terminal block for device under
test. Looking into the connector on the board, the
pins from left to right are:
- V+: Battery pack positive
- C: SMBus clock
- D: SMBus data
- T:
T-pin
- V-: Battery pack negative
• TBV – Pluggable terminal block for individual cell
voltages. Use depends on the number of series
cells in a Lithium pack. Looking into the connector
on the board, the pins from left to
right are:
- VC4: Top of fourth series cell in pack
- VC3: Top of third series cell in pack
- VC2: Top of second series cell in pack
- VC1: Battery pack positive
2.2
Jumpers
• ADR – Jumper for board address identification
TABLE 2-1:
JUMPER POSITION FOR
BOARD ADDRESS ID
Legend: O = open, X = connect
2.3
USB Setup
Connect the USB cable from J1 on the PowerCal 2
board to the USB port on the PC. Connect a 12V DC
power supply to J2 and plug it into the electrical outlet.
The board is now powered. Attach your battery to the
TBP connector and launch the Microchip development/
test software on the PC.
2.4
RS-232 Setup
Connect the serial cable from P1 on the PowerCal 2
board to the RS-232 port on the PC. Connect a 12V DC
power supply to J2 and plug it into the electrical outlet.
The board is now powered. Attach your battery to the
TBP connector and launch the Microchip development/
test software on the PC.
2.5
Individual Cell Voltage Setup
(Optional)
Connections from the individual cell voltages of a
Lithium pack can be attached at TBV to measure and
calibrate the individual cell voltages of the series cells
in the pack. Unused cell voltages should be connected
to V- during VC calibration.
Address
Jumper Position
3-4
2-5
1-6
0
X
X
X
1
X
X
O
2
X
O
X
3
X
O
O
4
O
X
X
5
O
X
O
6
O
O
X
7
O
O
O
2004 Microchip Technology Inc.
DS21817B-page 3
PS052
3.0
MECHANICAL DESCRIPTION
PCB schematics and bill of materials are included here
for completeness. To download the full size schematic
and BOM, please visit the Microchip web site.
3.1
Mechanical Dimensions
Overall Dimensions: 3.938” x 6.300”
FIGURE 3-1:
PS052 DIMENSION DETAILS
PS052
DS21817B-page 4
2004 Microchip Technology Inc.
3.2
Schematic
FIGURE 3-2:
PS052 BOARD SCHEMATIC (SHEET 1 OF 2)
A
B
C
D
D
C
B
A
1
Microchip Technology, Inc.
Pow
erSmart Products Group
2745 Dallas Parkw
ay
, Suite 400
Plano, T
X
75093
469-241-0087 Voice/469-241-0106 Fax
2
PowerCal 2 PCB
03-826160
2.1
18-Jul-2003
22:38:32
03-826160 REV 2-1-1.sch
Sheet
of
*** CO
NFI
DENTI
AL
***
THI
S DOCU
M
ENT CONTA
IN
S
PROPRIE
TARY
IN
FORMAT
ION
THA
T I
S THE I
NTEL
LE
CTU
AL
PROPE
RT
Y OF MICROCHIP
TECHNOL
OGY, I
NC.
SIZE
DRAW
ING NO.
CODE IDENT
NO.
REV
B
FILE
SCALE
NONE
TI
TL
E
APPROVALS
DAT
E
C
O
N
TR
A
C
T N
O
.
h
tt
p
:/
/www.
m
ic
ro
c
h
ip
.c
o
m
12
DRA
W
N
CHE
CK
E
D
R1IN
1
A GND 1
2
R2IN
3
R3IN
4
CAP
5
REF
6
AGND2
7
SB/BT
C
8
EXT/INT
9
D GND
10
VD
20
VA
19
PWRD
18
BUSY
17
CS
16
R/C
15
TA
G
14
DAT
A
13
D CLK
12
SY
NC
11
U5
AD977AR
+5V
C31
2.2
µ
F
C29
OPEN
C30
2.2
µ
F
R20
200
R9
10K
R19
100
R21
33.2K
+5V
R10
10K
C32
2.2
µ
F
C13
100 nF
RA0/AN0
2
RA1/AN1
3
RA2/AN2/V
REF
-
4
RA3/AN3/V
REF
+
5
RA4/T
0CKI
6
RA5/AN4/SS
7
RB0/INT
33
RB1
34
RB2
35
RB3/PGM
36
RB4
37
RB5
38
RB6/PGC
39
RB7/PGD
40
RC1/T
1OSI/CCP2
16
RC0/T
1OSO/T
1CKI
15
RC2/CCP1
17
RC3/SCK/SCL
18
RC4/SDI/SDA
23
RC5/SDO
24
RC6/T
X/CK
25
RC7/RX/DT
26
RD0/PSP0
19
RD1/PSP1
20
RD2/PSP2
21
RD3/PSP3
22
RD4/PSP4
27
RD5/PSP5
28
RD6/PSP6
29
RD7/PSP7
30
RE0/RD/AN5
8
RE1/W
R/AN6
9
RE2/CS/AN7
10
V
SS
12
V
SS
31
M
C
LR/V
PP
1
OSC1/CLKI
13
OSC2/CLKO
14
V
DD
11
V
DD
32
U1
PIC16F877
+5V
C17
100 nF
C18
100 nF
C12
100 nF
C11
100 nF
(AT
U1-12)
(AT
U1-31)
Sheet 2
03-826160 REV 2-1-2.sch
A/
D
-BUSY
A
/D-
R/
C
A
/D-
CS
COMM-RX
COMM-T
X
Sm
-D
Sm
-C
DA
C-A0
SER
-D
SER
-C
A0
A1
A2
R24
10K
R25
10K
R26
10K
+5V
8-CH. M
U
X
& OUT
P
UT
BUFFER
16-BIT
A/D
ANALOG SIGNAL CONDIT
IONING
AND PACK INT
ERFACE
SHOW
N
O
N
S
HEET
2
D/
A
-RST
RESET
1-6
2-5
0
1
2
3
XX
X
X
O
O
OO
ADDRESS
X - CONNECT
O - OPEN
ADR
1
2
3
456
BOARD ADDRESS
1
2
3
4
5
6
ADR
3-4
X
X
X
X
4
5
6
7
XX
X
X
O
O
OO
O
O
O
O
(TO MUX)
MU
X
-A0
MU
X
-A1
MU
X
-A2
R38
680
R39
680
+5V
DN
LED4
LED5
P-EN
(S
HEET 2)
(S
HEET 2)
(S
HEET 2)
(SH
EET 2)
R.
CASEBOLT
3-14-2003
K1
LED1
LED2
C41
1.0
µ
F
C44
1.0
µ
F
C42
1.0
µ
F
C43
1.0
µ
F
C45
1.0
µ
F
1
2
3
4
5
6
7
8
9
G
G
P1
V
CC
16
GND
15
DIN1
11
DIN2
10
DOUT
1
14
DOUT
2
7
ROUT
2
9
RIN1
13
RIN2
8
C1-
3
C2-
5
C2+
4
C1+
1
V+
2
V-
6
ROUT
1
12
U3
DS14C232
1
3
2
J2
+
-
TX
D
RXD
GND
EXT
. POW
ER
CONNECT
ION
(9-18 Vdc, 135mA)
+5V
RA0/AN0
2
RA1/AN1
3
RA2/AN2
4
RA3/AN3/V
REF
5
RA4/T
0CKI
6
RA5/AN4
7
RB0/INT
21
RB1
22
RB2
23
RB3
24
RB4
25
RB5
26
RB6
27
RB7
28
RC1/T
1OSI/CCP2
12
RC0/T
1OSO/T
1CKI
11
RC2/CCP1
13
V
USB
14
D-
15
D+
16
RC6/T
X/CK
17
RC7/RX/DT
18
V
SS
8
V
SS
19
M
C
LR/V
PP
1
OSC1/CLKI
9
OSC2/CLKO
10
V
DD
20
U2
PIC16C745
+5V
C38
100NF
R23
10K
10
9
8
14
7
U4C
13
12
11
14
7
U4D
T
C
74VHC125FN
C39
100 nF
+5V
C49
220 nF
R35
1.5K
1
2
3
4
G1
G2
J1
+5 V
USB
+5V
4
1
3
2
Y2
6.000 MHz
C34
22 pF
C35
22 pF
R31
10K
R33
47K
USB
CONNECT
ION
RS-232
CONNECT
ION
(DB-9)
USB COM
M
UNICAT
ION IS AUT
OM
AT
ICALLY
SELECT
ED W
H
ENEVER A USB CABLE IS
PLUGGED INT
O J1.
T
H
IS PCB IS ALW
AY
S POW
ERED BY
AN
EXT
ERNAL 5VDC "W
ALL W
A
RT
" POW
E
R
SUPPLY
AT
T
A
CHED T
O
J2. IT
IS NOT
POW
ERED FROM T
H
E USB PORT
AT
ANY
T
IM
E
.
R27
10K
RST
1
2
3
14
7
U4A
4
5
6
14
7
U4B
R32
47K
4
1
3
2
Y1
20.0000 MHz
C36
22 pF
C37
22 pF
3
1
2
D2
AZ23C5V6
R36
330
R37
330
+5V
A0
1
A1
16
A2
15
EN
2
S1
4
S2
5
S3
6
S4
7
S5
12
S6
11
S7
10
S8
9
D
8
V
DD
13
V
SS
3
GND
14
U6
ADG608BR
C10
100 nF
C9
100 nF
+5V
-5V
+5V
R5
0
C4
C3
C2
C1
C8
C7
C6
C5
TMPB
ID
B
IP
B
VPB
V1B
V2B
V3B
V4B
(----- SHEET 2 -----)
MU
X
-A0
MU
X
-A1
MU
X
-A2
(FROM
U1)
OPEN (4 PL.)
OPEN (4 PL.)
SmBUS-D
SmBUS-C
+5V
C14
100 nF
R22
10K
1
2
3
7
14
U9A
4
5
6
7
14
U9B
T
C
74VHC00FN
D/
A
-CLR
EX
P-A1
EXP-A0
K2
EX-CS
EXP-IN
A
DCRE
F
(SH
EET 2)
2
3
1
8
4
U7A
M
C
P6022
-5V
-0.25V
R16
OPEN
R6
0
2
3
1
8
4
U15A
LM
2904
FC
1
GND
3
SHDN
6
V+
8
V
OUT
5
CAP+
2
CAP-
4
OSC
7
U14
T
C1121COA
-5V
C50
C52
C54
C51
C53
C55
(10
µ
F x
3)
(10
µ
F x
3)
+5V
C16
100 nF
C15
100 nF
Q2
M
M
B
T
3906
-5V
R28
100K
R29
10K
R30
1.0
-0.25V
C33
100 nF
SER-D
SER-C
DN
P-EN
K1
EXP-A1
EXP-A0
K2
EXP-CS
EXP-IN
D/A-CLR
R34
47K
C
O
MM-SET
R2
6.8K
R63
6.8K
+5V
V
IN
1
V
OUT
3
GND
2
U16
LM
78M
05CDT
C40
100 nF
+Vs
+Vs
PW
R
R64
680
R40
10K
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
EXP1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
EXP2
+5V
+5V
232T
X
232RX
TX
RX
GND
R66
10K
R65
10K
R67
47K
+5V
R68
0
C65
22
µF
C46
22
µ
F
C64
22
µF
C63
22
µF
R69
150K
+5V
R70
OPEN
TM
2004 Microchip Technology Inc.
DS21817B-page 5
PS052
FIGURE 3-3:
PS052 BOARD SCHEMATIC (SHEET 2 OF 2)
1
2
3
4
56
A
B
C
D
6
5
4
3
2
1
D
C
B
A
2
Microchip Technology, Inc.
Pow
erSmart Products Group
2745 Dallas Parkw
ay
, Suite 400
Plano, T
X
75093
469-241-0087 Voice/469-241-0106 Fax
2
PowerCal 2 PCB
03-826160
2.1
18-Jul-2003
22:39:15
03-826160 REV 2-1-2.sch
Sheet
of
*** CO
NFI
DENTI
AL
***
THI
S DOCU
M
ENT CONTA
IN
S
PROPRIE
TA
RY
IN
FORMAT
ION
THA
T I
S THE I
NTEL
LE
CTU
AL
PROPE
RT
Y OF MICROCHIP
TECHNOL
OGY, I
NC.
SIZE
DRAW
ING NO.
CODE IDENT
NO.
REV
B
FILE
SCALE
NONE
TI
TL
E
APPROVALS
DAT
E
CONT
RACT
NO.
h
tt
p
:/
/www.
m
ic
ro
c
h
ip
.c
o
m
12
DRA
W
N
CHE
CK
E
D
R4
3.90K
C21
100 nF
C27 100 nF
-5V
+5V
PACK CURRENT
SCALING SET
FOR APPROXIM
AT
ELY
10A AT
FULL D/A OUTPUT
(+3.33V/FFFF hex
)
R12
10K
R13 10K
C62
10 nF
C61
10 nF
R58
100
C24
100 nF
C23
100 nF
+5V
-5V
(SHEET 1)
SER
-C
SER
-D
DA
C-
A
0
D/
A
-CLR
R59
4.7K
IP
B
CELL CONN.
V+ C D T V-
PACK CONN.
VC4 VC3 VC2 VC1
VC
1
VC
2
VC
3
VC
4
VP
Sm
BU
S-D
Sm
BU
S-C
ID
F1
6.3A/T
R.
CASEBOLT
3-14-2003
GND
1
2
3
4
5
6
7
8
U10
AD620AR
R11
0
+5V
C19
100 nF
+5V
C25
100 nF
R15
10K
R14
10K
C26
100 nF
R62
100K
-5V
+5V
C28 100 nF
R51
20K
R52
20K
+5V
C20
100 nF
OUT
2
GND
3
VS+
1
U13
LM
35CAZ
-5V
C48
1.0
µ
F
C47
1.0
µ
F
VPB
ID
B
V1
B
V2
B
V3
B
V4
B
TMPB
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
(SH
EET 1)
Q1
FQA33N10L
8
9
10
7
14
U9C
11
12
13
7
14
U9D
DV
DD
3
DGND
4
CS/LD
8
REFHI
11
CLK
7
CLR
9
UNI/BIP
16
V
RST
2
D
IN
5
RST
OUT
10
V
OUT
1
D
OUT
6
REFLO S
13
REFLO F
12
AV
DD
15
AV
SS
14
U8
LT
C1650CS
C22
100 nF
0.
1%
R61
33K
0.
1%
R60
11K
A
DCRE
F
(SH
EET 1)
R3
0.100
13
12
14
4
11
U11D
M
C
P609
-0.25V
R17
OPEN
R7
0
9
10
8
11
4
U11C
M
C
P609
9
10
8
11
4
U12C
M
C
P609
13
12
14
4
11
U12D
M
C
P609
2
3
1
4
11
U12A
M
C
P609
6
5
7
4
11
U12B
M
C
P609
2
3
1
4
11
U11A
M
C
P609
6
5
7
4
11
U11B
MC
P
609
-5V
-0.25V
R18
OPEN
R8
0
6
5
7
8
4
U7B
M
C
P6022
6
5
7
8
4
U15B
LM
2904
-0.25V
(SH
EET 1)
(SH
EET 1)
R53
0
R46
200K
R41
1.00M
C56
4.7 nF
R54
0
R47
200K
R42
1.00M
C57
4.7 nF
R55
0
R48
200K
R43
1.00M
C58
4.7 nF
R56
0
R49
200K
R44
1.00M
C59
4.7 nF
R57
0
R50
200K
R45
1.00M
C60
4.7 nF
1
2
3
4
5
TB
P
A
B
C
D
TB
V
R1
0.020
D1
M
B
RS340
V+
C
D
T
V-
VC1
VC2
VC3
VC4
IPB
DAC
ICTL
TM
R71
20K
PS052
DS21817B-page 6
2004 Microchip Technology Inc.
3.3
Bill of Materials
TABLE 3-1:
PS052 BILL OF MATERIALS
Symbols
Description
Manufacturer
Manufacturer PN
Qty
PCB
Raw PCB, PowerCal™ 2
Microchip
04-826160 Rev. 2.1
1
U1
Firmware Specification, PowerCal™ 2 Main MCU
None
Document
Doc.
U2
Firmware Specification, PowerInfo™/PowerCal™ USB MCU None
Document
Doc.
C61-C62
Capacitor, Ceramic, 10 nF, 50V, +/-10%, X7R dielectric, 0603 Panasonic
ECJ-1VB1H103K
2
C56-C60
Capacitor, Ceramic, 4.7 nF, 50V, +/-10%, X7R dielectric, 0603 Panasonic
ECJ-1VB1H472K
5
C34-C37
Capacitor, Ceramic, 22 pF, 50V, +/-5%, C0G dielectric, 0603
Panasonic
ECJ-1VC1H220J
4
C33, C38-C39
Capacitor, Ceramic, 100 nF, 25V, +80%/-20%,
Y5V dielectric, 0603
Panasonic
ECJ-1VF1E104Z
3
C9-C28
Capacitor, Ceramic, 100 nF, 25V, +/-10%,
X7R dielectric, 0805
Panasonic
ECJ-2VB1E104K
20
C49
Capacitor, Ceramic, 220 nF, 25V, +/-10%,
X7R dielectric, 0805
Panasonic
ECJ-2YB1E224K
1
C41-C45, C47-C48
Capacitor, Ceramic, 1.0
µ
F, 25V, +/-10%,
X7R dielectric, 1206
Panasonic
ECJ-3YB1E105K
7
C40
Capacitor, Ceramic, 100 nF, 50V, +/-10%,
X7R dielectric, 1206
BC Components
1206B104K500BT
1
C50-C55
Capacitor, Ceramic, 10
µ
F, 6.3V, +/-20%,
X5R dielectric, 1206
Panasonic
ECJ-HVB0J106M
6
C46, C63-C65
Capacitor, Ceramic, 22
µ
F, 6.3V, +/-20%,
X5R dielectric, 1206
Panasonic
ECJ-3YB0J226M
4
C30-C32
Capacitor, Ceramic, 2.2
µ
F, 25V, +80%/-20%,
Y5V dielectric, 1206
Panasonic
ECJ-3YF1E225Z
3
LED1-LED2, PWR
LED, clear green, 1206 package
Lumex
SML-LX1206GC-TR
3
D1
Schottky Diode, 40V, 3A, SMC package
International Rct.
Central Semi.
Central Semi.
MBRS340TR
CMSH3-40-PST
CMSH3-40L-PST
1
D2
Dual Zener Diode, 5.6V +/- 5%, 300 mW, common anode,
SOT-23
Diodes Inc.
General
Semiconductor
AZ23C5V6-7
AZ23-C5V6
1
F1
Fuse, 6.3A, 250V, Time delay, 5X20 mm
Littelfuse
021806.3H
1
ADR
Connector, shorting jumper, female, 2-position, 100 mil
spacing, mates with 25 mil square pins, 15-microinch gold
over nickel
AMP
382811-6
3
TBV
Header, pluggable terminal block, 5.08 mm pitch x 4
positions, 12A/250V, right-angle, closed end
Phoenix
1757268
1
TBP
Header, pluggable terminal block, 5.08 mm pitch x 5
positions, 12A/250V, right-angle, closed end
Phoenix
1757271
1
U2
IC socket, 28-pin DIP, 300 mil width
Mill-max
110-99-328-41-001
1
U1
DIP socket, 40-pin, 600 mil width, BeCu/Sn
AMP
2-641268-1
1
J2
Connector, coaxial power, female, 2.0 mm
center pin x 6.5mm sleeve, right-angle PCB mount
Cui Stack
PJ-102A
1
V-, GND
Test point, 0.125" OD, for 0.062" hole, black
Keystone
5011
2
VC1-VC4, V+
Test point, 0.125" OD, for 0.062" hole, red
Keystone
5010
5
232RX, 232TX, C,
D, DAC, ICTL, IPB,
RX, T, TX
Test point, 0.125" OD, for 0.062" hole, white
Keystone
5012
10
Note
1:
See schematic for jumper configuration details.
2:
The header used for ADR is a break-apart component – one 2 x 36 header can be broken apart to provide up to 12 of the
2 x 3 headers used for ADR.
3:
The following components are left open: C1-C8, C29, EXP1, EXP2, R16, R17, R18, R70.
2004 Microchip Technology Inc.
DS21817B-page 7
PS052
J1
Connector, USB type B, right-angle PCB mount, shielded
Mill-max
Molex
897-30-004-90-000000
67068-0000
1
F1
Fuse holder, PCB mount, for 5X20 mm fuse
Wickmann
6490000100
1
Q1
Heatsink, TO-247, PCB mount, omnidirectional,
1.81 in. W x 1.81 in. D x 1.25 in. H, modified version
of Wakefield 680-125K heatsink
Microchip
MM-825052-01
1
Flat Washer, #4, zinc-plated steel
Various
See Description
11
Q1
Hex Nut, 4-40, zinc-plated steel
Various
See Description
1
Hex standoff, 4-40, 0.375" length, 0.187" across flats,
female, zinc-plated brass
Keystone
1803
10
Internal-tooth lockwasher, #4, zinc-plated steel
Building Fasteners INT LWZ 004
10
Screw, pan head Phillips, 4-40 x 1/4", zinc-plated steel
Building Fasteners PMS 440 0025 PH
10
Q1
Screw, pan head Phillips, 4-40 x 5/16", zinc-plated steel
Various
See Description
4
Q1
Screw, pan head Phillips, 4-40 x 3/4", zinc-plated steel
Various
See Description
1
Q1
Split lock washer, #4, spring steel
Various
See Description
1
ADR
Connector, break-apart PCB header, straight,
2-row x 36-pin, 100 x 100 mil spacing, 235 mil/100 mil/
145 mil length, 25 mil square pins, 10-microinch gold
3M
929665-09-36-I
1
TBV
Pluggable terminal block, 5.08 mm pitch x 4 positions,
12A/250V
Phoenix
1757035
1
TBP
Pluggable terminal block, 5.08 mm pitch x 5 positions,
12A/250V
Phoenix
1757048
1
P1
Connector, DB9 right-angle PCB mount, female sockets
Norcomp
182-009-212-531
1
Q2
Transistor, PNP, -40V, 350 mW SOT-23
Diodes Inc.
Central Semi.
MMBT3906-7
CMPT3906-PST
1
Q1
MOSFET, N-channel enhancement mode, logic-level gate
drive, 36A, 100V, TO-3P package
Fairchild Semi.
Toshiba
FQA33N10L
2SK1381
1
R19, R58
Resistor, film, 0603, 1%, 100 ohms
Panasonic
ERJ-3EKF1000V
2
R28, R62
Resistor, film, 0603, 1%, 100 kOhms
Panasonic
ERJ-3EKF1003V
2
R9-10, R12-R15,
R22-R27, R29, R31,
R40, R65-R66
Resistor, film, 0603, 1%, 10 kOhms
Panasonic
ERJ-3EKF1002V
17
R20
Resistor, film, 0603, 1%, 200 ohms
Panasonic
ERJ-3EKF2000V
1
R51-R52, R71
Resistor, film, 0603, 1%, 20 kOhms
Panasonic
ERJ-3EKF2002V
3
R21
Resistor, film, 0603, 1%, 33.2 kOhms
Panasonic
ERJ-3EKF3322V
1
R5-R8, R11, R68
Resistor, zero ohm, 0603
Panasonic
ERJ-3GEY0R00V
6
R30
Resistor, film, 0603, 5%, 1.0 ohms
Panasonic
ERJ-3GEYJ1R0V
1
R35
Resistor, film, 0603, 5%, 1.5 kOhms
Panasonic
ERJ-3GEYJ152V
1
R69
Resistor, film, 0603, 5%, 150 kOhms
Panasonic
ERJ-3GEYJ154V
1
R32-R34, R67
Resistor, film, 0603, 5%, 47 kOhms
Panasonic
ERJ-3GEYJ473V
4
R2, R63
Resistor, film, 0603, 5%, 6.8 kOhms
Panasonic
ERJ-3GEYJ682V
2
R38-R39, R64
Resistor, film, 0603, 5%, 680 ohms
Panasonic
ERJ-3GEYJ681V
3
R4
Resistor, film, 0603, 0.5%, 3.90 kOhms, 25 ppm TC
Susumu
RR0816P-392-D
1
R53-R57
Resistor, zero ohm, 0805
Panasonic
ERJ-6GEY0R00V
5
R59
Resistor, film, 0805, 5%, 4.7 kOhms
Panasonic
ERJ-6GEYJ472V
1
R60
Resistor, film, 0805, 0.1%, 25 ppm TC, 11.0 kOhms
Panasonic
ERA-6YEB113V
1
R61
Resistor, film, 0805, 0.1%, 25 ppm TC, 33.0 kOhms
Panasonic
ERA-6YEB333V
1
R41-R45
Resistor, film, 0805, 0.5%, 1.00 mOhms, 25 ppm TC
Susumu
RR1220P-105-D
5
TABLE 3-1:
PS052 BILL OF MATERIALS (CONTINUED)
Symbols
Description
Manufacturer
Manufacturer PN
Qty
Note
1:
See schematic for jumper configuration details.
2:
The header used for ADR is a break-apart component – one 2 x 36 header can be broken apart to provide up to 12 of the
2 x 3 headers used for ADR.
3:
The following components are left open: C1-C8, C29, EXP1, EXP2, R16, R17, R18, R70.
PS052
DS21817B-page 8
2004 Microchip Technology Inc.
R46-R50
Resistor, film, 0805, 0.5%, 200 kOhms, 25 ppm TC
Susumu
RR1220P-204-D
5
R36-R37
Resistor, film, 2512, 5%, 330 ohms
Panasonic
ERJ-1TYJ331U
2
R1
Resistor, metal strip, 20 milliohms, 1%, 5W,
925 mil L x 330 mil D axial package
Vishay
Ohmite
LVR-5-0.020OHMS-1%
15FR020
1
R3
Resistor, metal strip, 100 milliohms, 5%, 5W,
925 mil L x 330mil D axial package
Huntington Elec.
ALSR-5-.10
1
RST
Switch, SPST momentary tact, surface mount,
6 mm square, 4.3 mm high, 260 g-force
E-Switch
TL3301NF260QG
1
U11, U12
IC, operational amplifier, precision low-voltage/micropower,
quad, SO-14, -40°C to +85°C
Microchip
MCP609-I/SL
2
U10
IC, instrumentation amplifier, SO-8, -40°C to +85°C
Analog Devices
AD620AR
1
U15
IC, dual operational amplifier, SO-8
National Semi.
Fairchild Semi.
LM2904M
LM2904M
1
U7
IC, dual low-voltage operational amplifier, SO-8
Microchip
MCP6022-I/SN
1
U13
IC, Linear Temperature Sensor, TO-92, -40°C to +110°C
National
Semiconductor
LM35CAZ
1
U2
IC, Microcontroller, 24 MHz, with USB Interface,
28-pin/300 mil DIP, -40°C to +85°C
Microchip
PIC16C745-I/SP
1
U1
IC, Microcontroller, 20 MHz, 40-pin DIP, 0°C to +70°C
Microchip
PIC16F877-20/P
1
U9
IC, Quad 2-input NAND gate, VHCMOS, SO-14,
-40°C to +85°C
Toshiba
TC74VHC00FN
1
U4
IC, quad buffer with tri-state outputs, VHCMOS, SO-14,
-40°C to +85°C
Toshiba
TC74VHC125FN
1
U3
IC, RS-232 transceiver, SO-16, 0°C to +70°C
National
Semiconductor
DS14C232CM
1
U8
IC, D/A converter, 16-bit, serial input, SO-16, 0°C to +70°C Linear Technology LTC1650CS
1
U6
IC, Analog multiplexer, 8-channel, single-ended, SO-16,
-40°C to +85°C
Analog Devices
ADG608BR
1
U5
IC, A/D converter, 16-bit, serial-output, 7.5 mm wide
SO-20, -40°C to +85°C
Analog Devices
AD977AR
1
U14
IC, charge pump DC/DC converter, 2.4 to 5.5 V
DC
input,
-2.4 to -5.5 V
DC
or 4.8 to 11 V
DC
output, 100 mA, SO8,
0°C to +70°C
Microchip
TC1121COA
1
U16
IC, Linear Voltage Regulator, 5V, 500 mA, TO-252,
0°C to +125°C
National
Semiconductor
LM78M05CDT
1
Y1
Crystal, 20.0000 MHz, 18 pF load capacitance,
surface-mount.
Citizen
CM309S20.000MABJTR
1
Y2
Crystal, 6.0000 MHz, 18 pF load capacitance,
surface-mount.
Citizen
CM309S6.000MABJTR
1
TABLE 3-1:
PS052 BILL OF MATERIALS (CONTINUED)
Symbols
Description
Manufacturer
Manufacturer PN
Qty
Note
1:
See schematic for jumper configuration details.
2:
The header used for ADR is a break-apart component – one 2 x 36 header can be broken apart to provide up to 12 of the
2 x 3 headers used for ADR.
3:
The following components are left open: C1-C8, C29, EXP1, EXP2, R16, R17, R18, R70.
2004 Microchip Technology Inc.
DS21817B-page 9
PS052
4.0
DEVELOPMENT TOOL
SUMMARY
Microchip provides all the necessary hardware and soft-
ware to enable easy tailoring of battery control algorithm
parameters and cell performance models to meet specific
application requirements and attain the highest accuracy
available anywhere. Table 4-1 summarizes the develop-
ment tool offering from Microchip to support the PS5XX
and PS7XX products. Please refer to the Microchip web
site for ordering information and design documentation
(including schematics) at www.microchip.com.
4.1
Reference Documents
This data sheet provides an overview of the PS052
Calibration Platform. For further information on other
products and development tool operations, please refer
to the following documents available for download at
www.microchip.com.
TABLE 4-1:
MICROCHIP DEVELOPMENT TOOL SUMMARY
TABLE 4-2:
MICROCHIP REFERENCE DOCUMENTS
Development Tool
Use
PowerInfo™ 2 hardware with development/
test software (PS051)
Read and write battery registers and memory, pack test
PowerCal™ 2 hardware with development/
test software (PS052)
Read and write battery registers and memory, pack calibration,
pack test
Document Number
Documents Available
DS21774
PS070 PowerMate™ Development Software Data Sheet
DS21885
PS050 PowerTool™ 500 Development Software User’s Guide
PS052
DS21817B-page 10
2004 Microchip Technology Inc.
NOTES: