PIC18F66K80 Family High-Temperature Data Sheet

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 2012 Microchip Technology Inc.

 

DS30509A-page 1

High-Temperature Features:

• Ambient Temperature Range of -40°C to +150°C

Power-Managed Modes:

• Run: CPU on, Peripherals on
• Idle: CPU off, Peripherals on
• Sleep: CPU off, Peripherals off
• Two-Speed Oscillator Start-up
• Fail-Safe Clock Monitor (FSCM)
• Power-Saving Peripheral Module Disable (PMD)
• Ultra Low-Power Wake-up
• Fast Wake-up, 1 µs, Typical
• Low-Power WDT, 300 nA, Typical
• Run mode Currents Down to Very Low 3.8 µA, 

Typical

• Idle mode Currents Down to Very Low 880 nA, 

Typical

• Sleep mode Currents Down to Very Low 13 nA, 

Typical

ECAN Bus Module Features:

• Conforms to CAN 2.0B Active Specification
• Three Operating modes:

- Legacy mode (full backward compatibility with 

existing PIC18CXX8/FXX8 CAN modules)

- Enhanced mode
- FIFO mode or programmable TX/RX buffers

• Message Bit Rates up to 1 Mbps
• DeviceNet™ Data Byte Filter Support

ECAN Bus Module Features (Continued):

• Six Programmable Receive/Transmit Buffers
• Three Dedicated Transmit Buffers with Prioritiza-

tion

• Two Dedicated Receive Buffers
• 16 Full, 29-Bit Acceptance Filters with Dynamic 

Association

• Three Full, 29-Bit Acceptance Masks
• Automatic Remote Frame Handling
• Advanced Error Management Features

Special Microcontroller Features:

• On-Chip 3.3V Regulator
• Operating Speed up to 64 MHz
• 3.6 Kbytes of General Purpose Registers (SRAM)
• Three Internal Oscillators: 

- LF-INTOSC (31 kHz)
- MF-INTOSC (500 kHz)
- HF-INTOSC  (16 MHz)

• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):

- Programmable period from 4 ms to 4,194s

• In-Circuit Serial Programming™ (ICSP™) via Two 

Pins

• In-Circuit Debug via Two Pins
• Programmable BOR
• Programmable LVD

TABLE 1:

DEVICE COMPARISON

Device

Program 

Memory

Data 

Memory

(Bytes)

Data 

EE

(Bytes)

Pins

I/O

CTMU

1

2

-Bi

t A/

D

Cha

n

n

e

ls

CCP

/

ECCP

Ti

m

e

rs

8-

B

it

/16-

B

it

EUSAR

T

C

o

mp

arat

ors

E

CAN™

MS

S

P

BOR

M

V/

L

V

D

DSM

PIC18F25K80

32 Bytes

3,648

1,024

28

24

1

8-ch

4/1

2/3

2

2

1

1

Yes

No

PIC18F26K80

64 Bytes

3,648

1,024

28

24

1

8-ch

4/1

2/3

2

2

1

1

Yes

No

PIC18F45K80

32 Bytes

3,648

1,024

40/44

35

1

11-ch

4/1

2/3

2

2

1

1

Yes

No

PIC18F46K80

64 Bytes

3,648

1,024

40/44

35

1

11-ch

4/1

2/3

2

2

1

1

Yes

No

PIC18F65K80

32 Bytes

3,648

1,024

64

54

1

11-ch

4/1

2/3

2

2

1

1

Yes

Yes

PIC18F66K80

64 Bytes

3,648

1,024

64

54

1

11-ch

4/1

2/3

2

2

1

1

Yes

Yes

PIC18F66K80 FAMILY

28/40/44/64-Pin, High-Temperature, Enhanced Flash 

Microcontrollers with ECAN

 and nanoWatt XLP Technology

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DS30509A-page 2

 

 2012 Microchip Technology Inc.

Peripheral Highlights:

• Five CCP/ECCP modules:

- Four Capture/Compare/PWM (CCP) modules
- One Enhanced Capture/Compare/PWM 

(ECCP) module

• Five 8/16-Bit Timer/Counter modules:

- Timer0: 8/16-bit timer/counter with 8-bit 

programmable prescaler

- Timer1, Timer3: 16-bit timer/counter
- Timer2, Timer4: 8-bit timer/counter

• Two Analog Comparators
• Configurable Reference Clock Output
• Charge Time Measurement Unit (CTMU):

- Capacitance measurement
- Time measurement with 1 ns typical resolution
- Integrated voltage reference

• Up to Four External Interrupts
• One Master Synchronous Serial Port 

(MSSP) module:
- 3/4-wire SPI (supports all four SPI modes)
- I

2

C™ Master and Slave modes

• Two Enhanced Addressable USART modules:

- LIN/J2602 support
- Auto-Baud Detect (ABD)

• 12-Bit A/D Converter with up to 11 Channels:

- Auto-acquisition and Sleep operation
- Differential Input mode of operation

• Data Signal Modulator module:

- Select modulator and carrier sources from 

various module outputs

• Integrated Voltage Reference

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DS30509A-page 3

PIC18F66K80 FAMILY

Table of Contents

1.0

Device Overview .......................................................................................................................................................................... 5

2.0

Special Features of the CPU........................................................................................................................................................ 7

3.0

Electrical Characteristics .............................................................................................................................................................. 9

Appendix A: Revision History............................................................................................................................................................... 13
The Microchip Web Site....................................................................................................................................................................... 15
Customer Change Notification Service ................................................................................................................................................ 15
Customer Support................................................................................................................................................................................ 15
Reader Response ................................................................................................................................................................................ 16
Product Identification System .............................................................................................................................................................. 17

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PIC18F66K80 FAMILY

DS30509A-page 4

 

 2012 Microchip Technology Inc.

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced. 
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We
welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.

Customer Notification System

Register on our web site at www.microchip.com to receive the most current information on all of our products.

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DS30509A-page 5

PIC18F66K80 FAMILY

1.0

DEVICE OVERVIEW

This document contains device-specific information for
the following devices, operating in an ambient
temperature range between -40°C and +150°C:

This family of devices offers the advantages of all
PIC18 microcontrollers; namely, high computational
performance at an economical price. In addition to these
features, the PIC18F66K80 family introduces design
enhancements that make these microcontrollers a logical
choice for many high-performance, power-sensitive
applications.

The primary differentiating features and specifications
of the high-temperature PIC18F66K80 family devices
are:
• Above +125°C, writes are not allowed for Flash 

program memory

• All AC timing specifications are increased by 15%

This derating factor includes parameters, such as
T

PWRT

 

• Maximum HS frequency of operation is 64 MHz

• PIC18F25K80

• PIC18F46K80

• PIC18F26K80

• PIC18F65K80

• PIC18F45K80

• PIC18F66K80

Note:

This data sheet documents only the devices’
features and specifications that are in
addition to the features and specifications of
the non-specialty PIC18F66K80 devices.
For information on the features and
specifications shared by this document’s high-
temperature devices and the non-specialty
devices, see the “PIC18F66K80 Family Data
Sheet”

 (DS39977).

Note:

The test duration for AEC-Q100 reliability
testing for devices operating at +150°C is
1,000 hours. Any design operating at
+125°C to +150°C for longer than that
period is not warranted without prior written
approval from Microchip Technology Inc.

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DS30509A-page 6

 

 2012 Microchip Technology Inc.

NOTES:

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DS30509A-page 7

PIC18F66K80 FAMILY

2.0

SPECIAL FEATURES OF THE 
CPU

2.1

Device ID Registers

The Device ID registers are read-only registers. They
identify the device type and revision for device
programmers and can be read by firmware using table
reads.

TABLE 2-1:

DEVICE IDs         

Note:

For additional details on the Configuration bits,
refer to Section 28.1 “Configuration Bits” in
the  “PIC18F66K80 Family Data Sheet”
(DS39977). Device ID information presented in
this section is for the high-temperature
PIC18F66K80 family devices only.

File Name

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

Default/

Unprogrammed

Value

3FFFFEh DEVID1

(

1

)

DEV2

DEV1

DEV0

REV4

REV3

REV2

REV1

REV0

xxxx xxxx

3FFFFFh DEVID2

(

1

)

DEV10

DEV9

DEV8

DEV7

DEV6

DEV5

DEV4

DEV3

xxxx xxxx

Legend:

x

 = unknown; u = unchanged,;— = unimplemented.

Note 1:

See 

Register 2-1

 and 

Register 2-2

 for DEVIDx values. DEVIDx registers are read-only and cannot be 

programmed by the user.

REGISTER 2-1:

DEVID1: DEVICE ID REGISTER 1

R

R

R

R

R

R

R

R

DEV2

(

1

)

DEV1

(

1

)

DEV0

(

1

)

REV4

REV3

REV2

REV1

REV0

bit 7

bit 0

Legend:
R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’

-n = Value at POR

‘1’ = Bit is set

‘0’ = Bit is cleared

x = Bit is unknown

bit 7-5

DEV<2:0>:

 Device ID bits

(

1

)

111

 = PIC18F66K80

100

 = PIC18F25K80

011

 = PIC18F45K80

010

 = PIC18F65K80

001

 = PIC18F26K80

000

 = PIC18F46K80

bit 4-0

REV<4:0>:

 Revision ID bits

These bits are used to indicate the device revision.

Note 1:

These DEV<2:0> values may be shared with other devices. The specific device is always identified by 
using the entire DEV<10:0> bit sequence.

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PIC18F66K80 FAMILY

DS30509A-page 8

 

 2012 Microchip Technology Inc.

 

REGISTER 2-2:

DEVID2: DEVICE ID REGISTER 2

R

R

R

R

R

R

R

R

DEV10

(

1

)

DEV9

(

1

)

DEV8

(

1

)

DEV7

(

1

)

DEV6

(

1

)

DEV5

(

1

)

DEV4

(

1

)

DEV3

(

1

)

bit 7

bit 0

Legend:
R = Readable bit

W = Writable bit

U = Unimplemented bit, read as ‘0’

-n = Value at POR

‘1’ = Bit is set

‘0’ = Bit is cleared

x = Bit is unknown

bit 7-0

DEV<10:3>:

 Device ID bits

(

1

)

0110

 0000 = PIC18F66K80

0110

 0001 = PIC18F46K80, PIC18F26K80, PIC18F65K80, PIC18F45K80, PIC18F25K80

Note 1:

These DEV<10:3> values may be shared with other devices. The specific device is always identified by 
using the entire DEV<10:0> bit sequence.

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DS30509A-page 9

PIC18F66K80 FAMILY

3.0

ELECTRICAL CHARACTERISTICS

Unless otherwise noted, this section’s parameters assume a minimum voltage of 4.0V.

3.1

Absolute Maximum Ratings

(

)

 

Ambient temperature under bias........................................................................................................................... +150°C
Maximum current out of V

SS

 pin .............................................................................................................................60 mA

Maximum current into V

DD

 pin ................................................................................................................................60 mA

Maximum output current sunk by any I/O pin

(

1

)

........................................................................................................1 mA

Maximum output current sourced by any I/O pin

(

1

)

...................................................................................................1 mA

Maximum current sunk by all ports combined

(

1

)

.....................................................................................................10 mA

Maximum current sourced by all ports combined

(

1

)

................................................................................................10 mA

Note 1:

Maximum allowable current is a function of device maximum power dissipation (see Section 31.0 “Electrical 
Characteristics”

 in the “PIC18F66K80 Family Data Sheet”.

    

FIGURE 3-1:

PIC18F66K80 VOLTAGE-FREQUENCY GRAPH (HIGH TEMPERATURE)        

Note:

Other than some basic data, this section documents only the high-temperature PIC18F66K80 family devices’
specifications that differ from those of the non-specialty PIC18F66K80 family devices. For detailed information
on the electrical specifications shared by the high-temperature and non-specialty devices, see the
“PIC18F66K80 Family Data Sheet”

 (DS39977).

† NOTICE:

 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the 

device. This is a stress rating only and functional operation of the device at those or any other conditions above 
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions 
for extended periods may affect device reliability.

Frequency

Vo

lt

a

g

e

6.0V

5.5V

4.0V

2.0V

64 MHz

3.5V

3.0V

2.5V

4.0V

4.5V

5.0V

High-Temperature Devices

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DS30509A-page 10

 

 2012 Microchip Technology Inc.

3.2

DC Characteristics: Supply Voltage (High Temperature)

PIC18F66K80 Family
      (High Temperature)      

Standard Operating Conditions (unless otherwise stated)
Operating temperature

+125°C 

 T

A

 

 +150°C for high temperature 

Param

 No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

D001

V

DD

Supply Voltage

4.0

5.5

V

For F devices

3.3

DC Characteristics: Power Down and Supply Current (High Temperature)

PIC18F66K80 Family
      (High Temperature) 

Standard Operating Conditions (unless otherwise stated)
Operating temperature

+125°C 

 T

A

 

 +150°C for high temperature 

Param

 No.

Device

Typ

Max

Units

Conditions

PIC18FXXK80

Power-Down Current (I

PD

)

(

1

)

10

28

µA

+150°C

V

DD

 = 5V, Sleep mode 

Module Differential Currents

12

29

µA

+150°C

V

DD

 = 5V, 

Watchdog Timer Current: ΔI

WDT

 

12

28

µA

+150°C

V

DD

 = 5V, A/D Current: ΔI

AD

12

28

µA

+150°C

V

DD

 = 5V, 

High/Low-Voltage Detect: ΔI

HLVD

Supply Current (I

DD

)

(

2

,

3

)

10

32

mA

+150°C

V

DD

 = 5V, F

OSC

 = 64 MHz 

(PRI_RUN mode) 

8

mA

+150°C

V

DD

 = 5V, F

OSC

 = 4 MHz 

(PRI_RUN mode) 

3

mA

+150°C

V

DD

 = 5V, F

OSC

 = 1 MHz 

(PRI_RUN mode) 

8

mA

+150°C

V

DD

 = 5V, F

OSC

 = 64 MHz 

(PRI_IDLE mode) 

1.8

mA

+150°C

V

DD

 = 5V, F

OSC

 = 4 MHz 

(PRI_IDLE mode) 

1

mA

+150°C

V

DD

 = 5V, F

OSC

 = 1 MHz 

(PRI_IDLE mode) 

28

mA

+150°C

V

DD

 = 5V, F

OSC

 = 64 MHz 

(PRI_RUN mode, 16 MHz w/PLL) 

8

mA

+150°C

V

DD

 = 5V, F

OSC

 = 16 MHz 

(PRI_RUN mode, 4 MHz w/PLL) 

Note 1:

The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is 
measured with the part in Sleep mode, with all I/O pins in a high-impedance state and tied to V

DD

 or V

SS

and all features that add delta current are disabled (such as WDT, secondary oscillator, BOR, etc.).

2:

The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as 
I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and 
temperature, also have an impact on the current consumption.

3:

The test conditions for all I

DD

 measurements in active operation mode are:

OSC1 = External square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V

DD

;

MCLR = V

DD

; WDT is enabled/disabled as specified.

Maker
Microchip Technology Inc.
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