MRF89XAM9A Data Sheet

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 2011-2012 Microchip Technology Inc.

Preliminary

DS75017B-page 1

MRF89XAM9A

Features

• Module designed from the MRF89XA Integrated

Ultra Low-Power, Sub-GHz Transceiver IC

• Supports MiWi™ Development Environment

Proprietary Wireless Networking Protocols

• 4-Wire Serial Peripheral Interface (SPI) with

Interrupts

• Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm),

Surface Mountable – pin compatible with
MRF89XAM8A

• Integrated Crystal, Internal Voltage Regulator,

Matching Circuitry and Printed Circuit Board
(PCB) Antenna

• Easy Integration into Final Product – Minimize

Product Development, Quicker Time to Market

• Compatible with Microchip’s Microcontroller

Families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)

• Modular Device Approval for United States (FCC),

Canada (IC) and Radio Regulation Certified for
Australia/New Zealand (C-TICK)

Operational

• Operating Voltage: 2.1–3.6V (3.3V typical)
• Temperature Range: -40°C to +85°C Industrial
• Low-Current Consumption:

- Rx mode: 3 mA (typical)
- Tx mode: 25 mA at +10 dBm (typical)
- Sleep: 0.1 µA (typical)

RF/Analog Features

• ISM Band 902–928 MHz Operation
• Modulation: FSK and OOK
• Data Rate: 

- FSK: 200 kbps
- OOK: 28 kbps

• Reception sensitivity

- FSK: -105 dBm (typical) at 25 kbps
- OOK: -111 dBm (typical) at 2 kbps

• +10 dBm Typical Output Power with 21 dB Tx

Power Control Range

Media Access Controller (MAC)/
Baseband Features

• Packet handling feature with data whitening and

automatic CRC generation

• Incoming sync word (pattern) recognition
• Built-in bit synchronizer for incoming data, and clock

synchronization and recovery

• 64-byte transmit/receive FIFO with preload in Stand-by

mode

• Supports Manchester encoding/decoding 

techniques

Pin diagram

2

3

4
5
6

1

7

V

IN

GND

8

9

10

RESET

CSCON

SDO

SDI

SCK

CSDATA

IRQ1

GND

IRQ0

12
11 GND

915 MHz Ultra Low-Power Sub-GHz Transceiver Module

 

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MRF89XAM9A

DS75017B-page 2

Preliminary

 2011-2012 Microchip Technology Inc.

Table of Contents

1.0

Device Overview .......................................................................................................................................................................... 3

2.0

Circuit Description ........................................................................................................................................................................ 9

3.0

Regulatory Approval................................................................................................................................................................... 17

4.0

Electrical Characteristics ............................................................................................................................................................ 23

Appendix A: Revision History............................................................................................................................................................... 29
The Microchip Web Site ....................................................................................................................................................................... 31
Customer Change Notification Service ................................................................................................................................................ 31
Customer Support ................................................................................................................................................................................ 31
Reader Response ................................................................................................................................................................................ 32
Product Identification System............................................................................................................................................................... 33

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welcome your feedback.

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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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 2011-2012 Microchip Technology Inc.

Preliminary

DS75017B-page 3

MRF89XAM9A

1.0

DEVICE OVERVIEW

The MRF89XAM9A is an ultra low-power sub-GHz
surface mount transceiver module with integrated
crystal, internal voltage regulator, matching circuitry
and PCB antenna. The MRF89XAM9A module
operates in the United States/Canada 902–928 MHz
ISM frequency band. The integrated module design
frees the integrator from extensive RF and antenna
design, and regulatory compliance testing, ballowing
quicker time to market.
The MRF89XAM9A module is compatible with
Microchip’s MiWi™ Development Environment software
stacks. The software stacks are available as a free
download, including source code, from the Microchip’s
web site 

http://www.microchip.com/wireless

.

The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States
(FCC) and Canada (IC). Modular device approval
removes the need for expensive RF and antenna
design, and allows the user to place the MRF89XAM9A
module inside a finished product and it does not require
regulatory testing for an intentional radiator (RF
transmitter). To maintain conformance, refer to module
settings in 

Section 3.1.1, MRF89XAM9A SETTINGS

for the United States and 

Section 3.2.1, MRF89XAM9A

SETTINGS

 for Canada.

1.1

Interface description

The simplified block diagram of the MRF89XAM9A
module is shown in 

Figure 1-1

. The module is based on

the Microchip Technology MRF89XA Ultra Low-Power
Sub-GHz Transceiver Integrated Circuit (IC). The
module interfaces to many popular Microchip PIC

®

microcontrollers through a 3-wire serial SPI interface,
two chip selects (configuration and data), two interrupts
Interrupt Request 0 (IRQ0) and Interrupt Request 1
(IRQ1), Reset, power and ground as shown in

Figure 1-2

Table 1-1

 provides the pin descriptions.

Data communication and module configuration are
documented in the “MRF89XA Ultra Low-Power,
Integrated Sub-GHz Transceiver

” (DS70622) Data

Sheet. For more information on specific serial interface
protocol and general register definitions, refer to the
MRF89XA Data Sheet” and see 

Section 1.3,

Operation

 for specific register settings unique to the

MRF89XAM9A module operation to maintain
regulatory compliance.

FIGURE 1-1:

MRF89XAM9A BLOCK DIAGRAM

MRF89XA

Control

Interface

Power

Management

Baseband

RF

MRF89XAM9A Module

SPI

Digital I/O

IRQ0

Power

12.8 MHz Crystal

Matching

Circuitry

and

SAW Filter

PCB

Antenna

Loop

Filter

VCO

Tank

IRQ1

CSDATA

CSCON

RESET

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MRF89XAM9A

DS75017B-page 4

Preliminary

 2011-2012 Microchip Technology Inc.

TABLE 1-1:

PIN DESCRIPTION

FIGURE 1-2:

MICROCONTROLLER TO MRF89XAM9A INTERFACE

Pin

Symbol

Type

Description

1

GND

Power

Ground

2

RESET

DI

Reset Pin. For more information, refer to 

Section 1.3.1, Reset

3

CSCON

DI

Serial Interface Configure Chip Select 

4

IRQ0

DO

Interrupt Request Output

5

SDI

DI

Serial Interface Data Input

6

SCK

DI

Serial Interface Clock

7

SDO

DO

Serial Interface Data Output 

8

CSDATA

DI

Serial Interface Data Chip Select

9

IRQ1

DO

Interrupt Request Output

10

Vin

Power

Power Supply

11

GND

Power

Ground

12

GND

Power

Ground

PIC

®

 Microcontroller

I/O

I/O

SDO

SDI

SCK

INTx

INTx

I/O

MRF89XAM9A

CSCON

CSDATA

SDI

SDO

SCK

IRQ0

IRQ1

RESET

V

IN

GND

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 2011-2012 Microchip Technology Inc.

Preliminary

DS75017B-page 5

MRF89XAM9A

1.2

Mounting Details

The MRF89XAM9A is a surface mountable module.
The dimensions of the module are shown in 

Figure 1-

3

. The module PCB is 0.032" thick with castellated

mounting holes on the edge. 

Figure 1-4

 is the

recommended host PCB footprint for the
MRF89XAM9A.

The MRF89XAM9A has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in 

Figure 1-5

. It is recommended that the

module be mounted on the edge of the host PCB and
an area around the antenna, approximately 3.4"
(8.6 cm), be kept clear of metal objects for best
performance. A host PCB ground plane around the
MRF89XAM9A acts as a counterpoise to the PCB
antenna. It is recommended to extend the ground plane
at least 0.4" (1 cm) around the module.

FIGURE 1-3:

MODULE DETAILS

FIGURE 1-4:

RECOMMENDED PCB FOOTPRINT

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MRF89XAM9A

DS75017B-page 6

Preliminary

 2011-2012 Microchip Technology Inc.

FIGURE 1-5:

MOUNTING DETAILS

3.4”

3.4”

0.4”

0.4”

Edge of PCB

0.470”

Keep area around the antenna,
approximately 3.4” (6.8 cm), be
kept clear of metallic objects for
best performance.

Host PCB top copper ground plane
(antenna counterpoise): Extend the
host PCB top copper ground plane
under and to the left and right side
of the module at least 0.4 inches
(1 cm) for best antenna
performance.

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 2011-2012 Microchip Technology Inc.

Preliminary

DS75017B-page 7

MRF89XAM9A

1.3

Operation

The MRF89XAM9A module is based on the
Microchip’s MRF89XA Ultra Low-Power, Integrated
ISM Band Sub-GHz Transceiver IC. Data
communication and module configuration are
documented in the “MRF89XA Ultra Low-Power,
Integrated ISM Band Sub-GHz Transceiver Data
Sheet

” (DS70622).

The following section emphasizes operational settings
that are unique to the MRF89XAM9A module design
that must be followed for the operation.

1.3.1

RESET

Pin 2 of the module, Reset, allows an external reset of
the MRF89XA IC. Reset is connected to the TEST8 pin
of the MRF89XA IC. During normal operations of the
MRF89XAM9A, the Reset pin should be held in a high
impedance state. For more information on assertion of
the RESET pin, refer to “Section 3.1.2 Manual Reset
in the “MRF89XA Data Sheet” (DS70622).

1.3.2

CRYSTAL FREQUENCY

When calculating frequency deviation, bit rate, receiver
bandwidth, and PLL R, P and S values, use crystal
frequency f

xtal

 = 12.8 MHz. 

1.3.3

CLOCK OUTPUT (CLKOUT)

The CLKOUT pin 19 of the MRF89XA IC is not used on
the module. Ensure that the CLKOUT signal is disabled
to minimize current consumption.

1.3.4

FREQUENCY BAND SELECT

The Frequency Band Select bits (FBS<1:0>) in the
GCONREG<4:3> should be set for target channel
range 902–915 MHz FBS<1:0> = ‘00’ or 915–928 MHz
FBS<1:0> = ‘01’.

1.3.5

VCO TANK TRIM VALUE

The VCO Trim bits (VCOT<1:0>) in the
GCONREG<2:1> should be set for VCOT<1:0> = ‘01’
for the inductor values of the module.

1.3.6

BIT RATE

The maximum bit rate value will be limited to 28 kbps
for OOK modulation due to the crystal frequency of
12.8 MHz.

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MRF89XAM9A

DS75017B-page 8

Preliminary

 2011-2012 Microchip Technology Inc.

NOTES:

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 2011-2012 Microchip Technology Inc.

Preliminary

DS75017B-page 9

MRF89XAM9A

2.0

CIRCUIT DESCRIPTION

The MRF89XAM9A module interfaces to Microchip’s
PIC16, PIC18, PIC24, PIC32 and dsPIC33
microcontrollers with a minimum of external
components through digital only connections. An
example application schematic is shown in 

Figure 2-1

.

2.1

Module Schematic

The MRF89XAM9A module is based on the
Microchip’s MRF89XA Ultra Low-Power, Integrated
ISM Band Sub-GHz Transceiver IC. The serial I/O
(CSCON, CSDATA, SCK, SDO and SDI), Reset, IRQ0
and IRQ1 pins are routed out and available on the
module pins as shown in 

Figure 2-2

. Crystal X1 is a

12.8 MHz crystal with a frequency tolerance of
±10 ppm at 25°C. The RFIO output is matched to the
SAW filter FL1 and further matched to the PCB trace
antenna.

Figure 2-2

 illustrates the MRF89XAM9A schematics.

Table 2-1

 details the Bill of Materials (BOM).

FIGURE 2-1:

MRF89XAM9A APPLICATION SCHEMATIC

Note 1

+ C2

1 0 μF

C1

0.1 μF

To Host 

Microcontroller

To Host 

Microcontroller

U1

MRF89XAM9A-I/RM

+ 3.3V

GND

RESET

CSCON

IRQ0

SDI

SCK

GND

GND

V

IN

IRQ1

CSDATA

SDO

1

2

3

4

5

6

12

11

10

9

8

7

Note:

For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypass
capacitor to provide a low impedance during startup sequences.

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MRF89XAM9A

DS75017B-

page 10

Prelimina

ry

 2011-

2012 Microchip T

echnolo

gy Inc.

FIGURE 2-2:

MRF89XAM9A SCHEMATIC

Note:

Designators not used: C6, L5

Maker
Microchip Technology Inc.
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