MCP9501/2/3/4 - Temperature Switch with Selectable Hysteresis

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 2011-2016 Microchip Technology Inc.

DS20002268B-page 1

MCP9501/2/3/4

Features

• Factory Set Temperature Switch
• Available Temperature Switch Thresholds:

- T

SET

= -35°C, -25°C, -15°C, -5°C, +5°C,

+15°C, +25°C, +35°C, +45°C, +55°C, +65°C,
+75°C, +85°C, +95°C, +105°C, +115°C,
+125°C

• Wide Operating Voltage Range: 2.7V to 5.5V
• Low Supply Current: 25 µA (typical)
• Qualification: AEC-Q100 Rev. G, Grade 1 

(-40°C to +125°C)

• Temperature Switch Accuracy:

- ±1°C (typical)
- ±4°C (maximum) between -15°C to +75°C
- ±6°C (maximum) between -40°C to +125°C

• Switch Threshold Options (Hot/Cold):

- Rising temperature: MCP9501/2 (Hot option)
-

Falling temperature: MCP9503/4 (Cold option

)

• Output Configuration Options:

- Active-low, open-drain output: MCP9501/3
- Uses external pull-up resistor
- Active-high, push-pull output: MCP9502/4

• User-Selectable Hysteresis: +2°C or +10°C 

(typical)

• 5-Lead SOT-23 Package

Applications

• Power Supply Critical Temperature Shutdown
• Temperature Alarm
• Thermostat Control
• Fan  Control
• Base Stations
• Automotive

Typical Performance

Description

Microchip Technology’s MCP9501/2/3/4 family devices
are temperature switches with ±1°C (typical) accurate
factory set output thresholds. These devices are ideal for
high-power supply systems where an overtemperature
protection circuit is needed. These devices do not
require external components, consume 25 µA (typical),
and the factory set thresholds provide simplicity.
In addition, this family of devices provides
user-selectable +2°C and +10°C (typical) switch hyster-
esis, and various output configurations. The MCP9501/2
outputs switch for rising temperatures, while the
MCP9503/4 devices switch for falling temperatures, with
the relative hysteresis at the set thresholds. This family
of devices is also available with an active-high, push-pull
output (MCP9502/4) and an active-low, open-drain
output (MCP9501/3). The push-pull output is ideal for a
microcontroller interface, while the open-drain output
can be used for level shifting, wired-OR configuration or
as a heater on/off switch.
The MCP9501/2/3/4 devices operate from a 2.7V to 5.5V
supply. This family is available with the space-saving
5-lead SOT-23 package.

Package Types

0%

5%

10%

15%

20%

25%

30%

35%

40%

-4.0 -3.0 -2.0 -1.0

0.0

1.0

2.0

3.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = -35°C to +125°C 

V

DD

 = 4.1V  

32 Units 

4

1

2
3

5

GND

HYST

MCP9501/2/3/4

5-Lead SOT-23

GND

Output

V

DD

Temperature Switch with Selectable Hysteresis

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MCP9501/2/3/4

DS20002268B-page 2

 2011-2016 Microchip Technology Inc.

OUTPUT FUNCTIONAL DESCRIPTION

Temperature

COLD

HOT

V

Output

Hysteresis

T

HYST

MCP9501, Hot Option (Open-Drain, Active-Low)

Temperature

V

Output

COLD

HOT

Hysteresis

T

HYST

MCP9502, Hot Option (Push-Pull, Active-High)

Temperature

V

Output

COLD

HOT

T

SET

Hysteresis

MCP9503, Cold Option (Open-Drain, Active-Low)

COLD

HOT

V

Output

Hysteresis

 T

SET

MCP9504, Cold-Option (Push-Pull, Active-High)

Temperature

Note:

Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C, +35°C,
+45°C, +55°C, +65°C, +75°C, +85°C,
+95°C, +105°C, +115°C, +125°.

Note:

Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C, +35°C,
+45°C, +55°C, +65°C, +75°C, +85°C,
+95°C, +105°C, +115°C, +125°.

Note:

Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C.
Available temperature thresholds for
Option N or for falling temperature
only: -35°C, -25°C, -15°C, -5°C.
Contact Microchip for all other threshold
options.

Note:

Available temperature thresholds for
Option P or for rising temperature
only: +5°C, +15°C, +25°C.
Available temperature thresholds for
Option N or for falling temperature
only: -35°C, -25°C, -15°C, -5°C.

T

SET

T

SET

T

HYST

T

HYST

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DS20002268B-page 3

MCP9501/2/3/4

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

(

)

V

DD

......................................................................................................................................................................  6.0V

Voltage on All Input/Output Pins – GND ..................................................................................................0.3V to 6.0V
Input/Output Current ......................................................................................................................................... 20 mA
Storage Temperature ........................................................................................................................ -65°C to +150°C
Ambient Temperature with Power Applied ........................................................................................ -40°C to +125°C
Junction Temperature (T

J

) .............................................................................................................................. +150°C

ESD Protection on All Pins:

HBM....................................................................................................................................................... 4 kV
MM........................................................................................................................................................ 400V

Latch-up Current at Each Pin (+25°C) .........................................................................................................  ±200 mA

† Notice:

 Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This 

is a stress rating only and functional operation of the device at those or any other conditions above those indicated 
in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended 
periods may affect device reliability

.

DC CHARACTERISTICS

Electrical Specifications:

 Unless otherwise indicated, V

DD

= 2.7V to 5.5V, T

A

= -40°C to +125°C, GND = Ground.

Parameters

Symbol

Minimum

Typical

Maximum

Unit

Conditions

Sensor Accuracy

-4

±1

+4

°C

-15°C ≤ T

A

≤ +75°C 

(

Note 1

)

-6

±2

+6

°C

-40°C ≤ T

A

≤ +125°C

Power Supply
Operating Voltage

V

DD

2.7

5.5

V

Operating Current

I

DD

25

40

µA

Line Regulation

°C/V

0.2

°C/V V

DD

= 2.7V to 5.5V

Hysteresis
Trip Point Hysteresis

T

HYST

2

°C

HYST = GND

10

°C

HYST = V

DD

Hysteresis Select Input

V

IH

0.8 V

DD

V

V

IL

0.2  V

DD

V

I

LEAK

0.1

µA

Open-Drain Output Leakage

I

LEAK

0.1

10

µA

MCP9501/3

Output Voltage High

V

OH

0.8 V

DD

V

I

OUT

= 5 mA (MCP9502/4)

Output Voltage Low

V

OL

0.2  V

DD

V

I

OUT

 = 5 mA

Turn On Time

T

ON

1

ms

Response Time to Thermal Shock: 
SOT23-5

T

RES

1.7

s

Time to 63% (+89°C),
+25°C (air) to +125°C 
(oil bath)

Note 1:

This specification is tested at mid-supply of 4.1V for optimum operation across the supply voltage range of 
2.7V to 5.5V.

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MCP9501/2/3/4

DS20002268B-page 4

 2011-2016 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Electrical Specifications:

 Unless otherwise indicated, V

DD

= 2.7V to 5.5V, T

A

= -40°C to +125°C, GND = Ground.

Parameters

Symbol

Minimum

Typical

Maximum

Unit

Conditions

Temperature Ranges
Specified Temperature Range

T

A

-40

+125

°C

(

Note 1

)

Operating Temperature Range

T

A

-40

+125

°C

Storage Temperature Range

T

A

-65

+150

°C

Thermal Package Resistances
Thermal Resistance

JA

220.7

°C/W

Note 1:

Operation in this range must not cause T

J

 to exceed the maximum junction temperature (+150°C).

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DS20002268B-page 5

MCP9501/2/3/4

2.0

TYPICAL PERFORMANCE CURVES

Note:

 Unless otherwise indicated, V

DD

 = 2.7V to 5.5V, T

A

 = -40°C to +125°C, GND = Ground, R

PULL-UP

  =   10  k

(MCP9501/3 only) and 0.1 µF bypass capacitor.

 

FIGURE 2-1:

Temperature Accuracy.

 

FIGURE 2-2:

Hysteresis vs. Temperature.

 

FIGURE 2-3:

Supply Current vs. 

Temperature.

FIGURE 2-4:

Leakage vs. Temperature.

 

FIGURE 2-5:

V

OL

,

V

OH

 vs. Temperature.

FIGURE 2-6:

Power-on Reset Threshold 

vs. Temperature.

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

-6.0

-4.0

-2.0

0.0

2.0

4.0

6.0

-40

-20

0

20

40

60

80

100

120

Temperature Accuracy

 (

°C) 

T

A

 (°C) 

Spec. Limits 

+ St. Dev. 

Average 

- St. Dev. 

V

DD

 = 4.1V 

32 units 

6.0

7.0

8.0

9.0

10.0

11.0

12.0

13.0

14.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

-40 -20

0

20

40

60

80 100 120

HYST = 

VDD, Hy

steresis 

(°C) 

HYST = 

VSS, Hy

steresis (°

C) 

T

A

 (°C) 

HYST = V

SS 

HYST = V

DD 

 

10

15

20

25

30

35

40

-40

-20

0

20

40

60

80

100

120

I

DD

 (µA) 

T

A

 (°C) 

V

DD

 = 5.5V 

V

DD

 = 4.1V 

V

DD

 = 2.7V 

0.00

0.02

0.04

0.06

0.08

0.10

-40

-20

0

20

40

60

80

100

120

Leakage (µA) 

T

A

 (°C) 

HYST Input Pin 

Open-Drain Output 

(MCP9501/3 only) 

80%

85%

90%

95%

100%

0%

5%

10%

15%

20%

-40 -20

0

20

40

60

80 100 120

V

OH

 (%
 of 
V

DD

V

OL

 (%

 of 

V

DD

T

A

 (°C) 

V

OH

, V

DD

 = 5.5V 

V

OH

, V

DD

 = 4.1V 

V

OH

, V

DD

 = 2.7V 

V

OL

, V

DD

 = 5.5V 

V

OL

, V

DD

 = 4.1V 

V

OL

, V

DD

 = 2.7V 

-75

-65

-55

-45

-35

-25

-15

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-40

-20

0

20

40

60

80

100 120

V

POR

 Hy
steresis 

(mV) 

V

POR

 (V) 

T

A

 (°C) 

V

POR 

Hysteresis 

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MCP9501/2/3/4

DS20002268B-page 6

 2011-2016 Microchip Technology Inc.

Note:

 Unless otherwise indicated, V

DD

 = 2.7V to 5.5V, T

A

 = -40°C to +125°C, GND = Ground, R

PULL-UP

 = 10 k

(MCP9501 only) and 0.1 µF bypass capacitor.

 

FIGURE 2-7:

Temperature Accuracy 

Distribution at -15°C.

 

FIGURE 2-8:

Temperature Accuracy 

Distribution at +5°C.

 

FIGURE 2-9:

Temperature Accuracy 

Distribution at +65°C.

 

FIGURE 2-10:

Temperature Accuracy 

Distribution at +105°C.

FIGURE 2-11:

Temperature Accuracy 

Distribution at +115°C.

FIGURE 2-12:

Temperature Accuracy 

Distribution at +125°C.

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = -15°C 

V

DD

 = 4.1V 

492 Units 

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = 5°C 

V

DD

 = 4.1V 

480 Units 

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = 65°C 

V

DD

 = 4.1V 

480 Units 

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = 105°C 

V

DD

 = 4.1V 

480 Units 

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences

 

Temperature Accuracy (°C) 

T

A

 = 115°C 

V

DD

 = 4.1V 

239 Units 

0%

10%

20%

30%

40%

50%

60%

-4.0

-2.0

0.0

2.0

4.0

Occurrences 

Temperature Accuracy (°C) 

T

A

 = 125°C 

V

DD

 = 4.1V 

480 Units 

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 2011-2016 Microchip Technology Inc.

DS20002268B-page 7

MCP9501/2/3/4

3.0

PIN DESCRIPTION

The description of the pins is listed in 

Table 3-1

.

3.1

Ground (GND)

The GND pin is the system ground pin. Pin 2 must be
connected to system ground. Pin 1 can also be
connected to system ground which would provide
better thermal conduction to the die.

3.2

Hysteresis Input (HYST)

This is an input pin which can be connected to V

DD

 or

GND to select the output hysteresis. Either +2°C
(HYST = GND) or +10°C (HYST = V

DD

)

 

of the typical

hysteresis can be selected.

3.3

Power Pin (V

DD

)

The operating voltage range, as specified in the 

“DC

Characteristics”

 table, is applied to this pin.

3.4

Switch Output (Output)

This output is triggered when the temperature rises or
falls beyond the programmed trip temperature thresh-
old. MCP9501/3 devices require an external pull-up
resistor.

TABLE 3-1:

PIN FUNCTIONS

MCP9501/2/3/4

Symbol

Description

5-Lead SOT-23

1

GND

Ground

2

GND

Ground (must be connected to ground)

3

HYST

Hysteresis Selection Input:

HYST = GND

 Hysteresis is +2°C (typical)

HYST = V

DD

 Hysteresis is +10°C (typical)

4

V

DD

Power Pin

5

Output

Output Options:

MCP9501

 Open-Drain, Active-Low Output (Hot Option)

MCP9502

 Push-Pull, Active-High Output (Hot Option)

MCP9503

 Open-Drain, Active-Low Output (Cold Option)

MCP9504

 Push-Pull, Active-High Output (Cold Option)

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MCP9501/2/3/4

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NOTES:

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DS20002268B-page 9

MCP9501/2/3/4

4.0

FUNCTIONAL DESCRIPTION

The MCP9501/2/3/4 temperature switch family
integrates a thermal diode, a comparator and a
factory-selectable resistive network used to set the tem-
perature thresholds. The available output thresholds
range from -35°C to +125°C at 10°C increments. There
is no additional configuration required to operate this
device. The selectable output hysteresis is controlled
using a single input pin. When this pin is connected to
ground, the output hysteresis is +2°C (typical), and when
connected to V

DD

, the output hysteresis is +10°C

(typical). 

Figure 4-1

 shows the functional block diagram.

 

FIGURE 4-1:

Functional Block Diagram.

There are two output configurations for this family: a
push-pull, and an open-drain output with active-high
and active-low assertions. These assertion options are
referred to as Cold and Hot options, primarily due to the
direction of the selected hysteresis. For the Cold
option, temperature has to fall below the threshold for
the output to assert high and deassert low when the
temperature rises above the threshold plus the
hysteresis. For example, for a +65°C threshold and
+2°C (typical) hysteresis, when temperature falls below
+65°C, the output asserts high and deasserts low when
temperature rises above +67°C. For the Hot option, the
opposite is true. When temperature rises above +65°C,
the output asserts low and deasserts high when the
temperature falls below +63°C. 

Figure 4-2

 shows a

graphical description for the Hot and Cold options.

FIGURE 4-2:

Output Hysteresis.

The push-pull output is ideal for a microcontroller
interface using an input/output pin or an interrupt input
pin. The open-drain option can be used with multiple
sensors in a wired-OR configuration or as a level
shifter.

I

SET

R

x

+

OUT/

OUT

Thermal

Diode

Hysteresis

Select Pin

Threshold

Select

Cold

Hot

T

SET

T

HYST

Temperature

V

Ou

tp

ut

+10°C Typical Hysteresis

+2°C Typical

Hysteresis

Cold

Hot

T

SET

T

HYST

Temperature

V

Ou

tp

u

t

+10°C Typical Hysteresis

+2°C Typical

Hysteresis

Hot Option (Active-Low)

Cold Option (Active-High)

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MCP9501/2/3/4

DS20002268B-page 10

 2011-2016 Microchip Technology Inc.

4.1

Application Information

The MCP9501/2/3/4 temperature switch family
integrates a temperature sensor and a comparator
circuit, which outputs an alert signal when the factory set
temperature threshold is exceeded. No additional com-
ponent is required for device operation, which provides
simplicity to the system designer. The device output
options provide design flexibility for various applications,
such as overtemperature protection circuit or a
closed-loop temperature control unit. This device can be
interfaced to a closed-loop fan controller network without
the need for a microcontroller.

FIGURE 4-3:

Fan Controller Using 

MCP9502.

The MCP9501/2/3/4 family provides an open-drain
output, where multiple sensors from multiple PCB
hotspots, can be connected to a single processor I/O
input with a wired-OR configuration. The MCP9501
requires an external pull-up resistor, which can be used
to level shift the alert signal. For example, if the sensors
are powered with 5 V

DD

 and the controller or processor

is powered with 3 V

DD

, the external resistor can be

level shifted by connecting 3 V

DD

 to the pull-up resistor,

as shown in 

Figure 4-4

 

FIGURE 4-4:

MCP9501 Wired-OR Output 

Configuration with Level Shift.

4.1.1

LAYOUT CONSIDERATION AND 
THERMAL CONSIDERATION

This family of sensors measures temperature by
monitoring the voltage level of a thermal diode located
in the die. A low-impedance thermal path between the
die and the PCB is provided by the pins. Therefore, the
sensor effectively monitors PCB temperature. For
efficient performance, it is recommended to layout the
device as close to the heat source as possible.
When connecting an external resistor to the
MCP9501/3, the current through the pull-up resistor
must be considered to prevent self-heat due to power.
This can be determined using 

Equation 4-1

.

EQUATION 4-1:

EFFECT OF 
SELF-HEATING

For example, at room temperature, when the output
asserts active-low and the maximum I

DD

 = 50 µA,

V

DD

= 5.5V, V

OL

 = 0.3V and I

OUT

 = 5 mA (see 

“DC

Characteristics”

), the self-heating due to power

dissipation (T

J

– T

A

) is ~0.4°C.

Output

HYST

5 V

DD

12V

MCP9502

M

OUT

HYST

5 V

DD

OUT

HYST

5V

DD

I/O

R

P

U

LL_

UP

MCU

3 V

DD

MCP9501

+85°C

MCP9503

+35°C

Where:

T

J

= Junction Temperature

T

A

= Ambient Temperature

JA

= Package Thermal Resistance 

(220.7°C/W)

V

OL

= Sensor Output Low Voltage

I

OUT

= Output Current

T

J

T

A

JA

V

DD

I

DD

V

OL

I

OUT

+

=

Maker
Microchip Technology Inc.
Datasheet PDF Download