2005-2014 Microchip Technology Inc.
DS20001936D-page 1
MCP1726
Features:
• 1A Output Current Capability
• Input Operating Voltage Range: 2.3V to 6.0V
• Adjustable Output Voltage Range: 0.8V to 5.0V
• Standard Fixed Output Voltages:
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
• Low Dropout Voltage: 220 mV typical at 1A
• Typical Output Voltage Tolerance: ±0.5%
• Stable with 1.0 µF Ceramic Output Capacitor
• Fast Response to Load Transients
• Low Supply Current: 140 µA (typical)
• Low Shutdown Supply Current: 0.1 µA (typical)
• Adjustable Delay on Power Good Output
• Short-Circuit Current Limiting and
Overtemperature Protection
• 3x3 DFN-8 and SOIC-8 Package Options
Applications:
• High-Speed Driver Chipset Power
• Networking Backplane Cards
• Notebook Computers
• Network Interface Cards
• Palmtop Computers
• 2.5V to 1.XV Regulators
Description:
The MCP1726 is a 1A Low Dropout (LDO) linear
regulator that provides high current and low output
voltages in a very small package. The MCP1726
comes in fixed or adjustable output voltage versions,
with an output voltage range of 0.8V to 5.0V. The 1A
output current capability and low output voltage
capability make the MCP1726 a good choice for new
sub-1.8V output voltage LDO applications that have
high current demands.
The MCP1726 is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the entire regulator
solution. Only 1 µF of output capacitance is needed to
stabilize the LDO.
Using CMOS construction, the quiescent current
consumed by the MCP1726 is typically less than
140 µA over the entire input voltage range, making it
attractive for portable computing applications that
demand high output current. When the MCP1726 is
shut down, the quiescent current is reduced to less
than 0.1 µA.
The scaled-down output voltage is internally monitored
and a Power Good (PWRGD) output is provided when
the output is within 92% of regulation (typical). An
external capacitor can be used on the C
DELAY
pin to
adjust the delay from 1 ms to 300 ms.
The overtemperature and short-circuit current limiting
provide additional protection for the LDO during system
fault conditions.
Package Types
SHDN
V
IN
GND
ADJ
C
DELAY
1
2
3
4
PWRGD
V
OUT
V
IN
8
7
6
5
MCP1726-ADJ
SOIC
SHDN
V
IN
GND
V
OUT
C
DELAY
1
2
3
4
PWRGD
V
OUT
V
IN
8
7
6
5
MCP1726-xx
SOIC
SHDN
V
IN
GND
ADJ
C
DELAY
1
2
3
4
8
7
6
5 PWRGD
V
OUT
V
IN
EP
9
MCP1726-ADJ
3x3 DFN
SHDN
V
IN
GND
V
OUT
C
DELAY
1
2
3
4
8
7
6
5 PWRGD
V
OUT
V
IN
EP
9
MCP1726-xx
3x3 DFN
1A, Low-Voltage, Low Quiescent Current LDO
Regulator
MCP1726
DS20001936D-page 2
2005-2014 Microchip Technology Inc.
Typical Application
MCP1726 Adjustable Output Voltage
1
2
3
4
5
6
7
8
1 µF
PWRGD
V
OUT
= 1.2V @ 1A
100 k
4.7 µF
V
IN
= 2.3V to 2.8V
On
Off
20 k
40 k
R
1
R
2
C
1
C
2
R
3
1000 pF
C
3
MCP1726 Fixed Output Voltage
V
IN
SHDN
GND
PWRGD
C
DELAY
V
OUT
V
OUT
1
2
3
4
5
6
7
8
PWRGD
V
OUT
= 1.8V @ 1A
V
IN
= 2.3V to 2.8V
On
Off
V
IN
1 µF
100 k
4.7 µF
C
1
C
2
R
1
1000 pF
C
3
V
IN
SHDN
GND
PWRGD
C
DELAY
ADJ
V
OUT
V
IN
2005-2014 Microchip Technology Inc.
DS20001936D-page 3
MCP1726
Functional Block Diagram
EA
+
–
V
OUT
PMOS
R
f
C
f
I
SNS
V
REF
Comp
92% of V
REF
T
DELAY
PWRGD
C
DELAY
V
IN
GND
Soft-Start
ADJ
Reference
SHDN
SHDN
SHDN
Undervoltage
Lockout
(UVLO)
Overtemperature
Sensing
Driver w/ Limit
and SHDN
V
IN
MCP1726
DS20001936D-page 4
2005-2014 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
IN
....................................................................................6.5V
Maximum Voltage on Any Pin .. (GND – 0.3V) to (V
DD
+ 0.3)V
Maximum Junction Temperature, T
J
........................... +150°C
Maximum Power Dissipation......... Internally-Limited (
Note 6
)
Storage Temperature.....................................-65°C to +150°C
† Notice:
Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise noted, V
IN
= (V
R
+ 0.5V) or 2.3V, whichever is greater, I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C. Boldface type applies for junction temperatures, T
J
(
Note 7
), of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Operating Voltage
V
IN
2.3
6.0
V
Note 1
Input Quiescent Current
I
q
—
140
220
µA
I
L
= 0 mA, V
IN
= V
R
+ 0.5V,
V
OUT
= 0.8V to 5.0V
Input Quiescent Current for
SHDN Mode
I
SHDN
—
0.1
3
µA
SHDN = GND
Maximum Output Current
I
OUT
1
—
—
A
V
IN
= 2.3V to 6.0V (
Note 1
)
Line Regulation
V
OUT
/
(V
OUT
x
V
IN
)
—
0.05
0.3
%/V
(V
R
+ 0.5)V
V
IN
6V
Load Regulation
V
OUT
/V
OUT
-1.5
±0.5
1.5
%
I
OUT
= 1 mA to 1A,
V
IN
= (V
R
+ 0.6)V (
Note 4
)
Output Short-Circuit Current
I
OUT_SC
—
1.7
—
A
V
IN
= (V
R
+ 0.5)V,
R
LOAD
< 0.1
, Peak Current
Adjust Pin Characteristics
Adjust Pin Reference Voltage
V
ADJ
0.402
0.410
0.418
V
V
IN
= 2.3V to V
IN
= 6.0V,
I
OUT
= 1 mA
Adjust Pin Leakage Current
I
ADJ
-10
±0.01
+10
nA
V
IN
= 6.0V, V
ADJ
= 0V to 6V
Adjust Temperature Coefficient
TCV
OUT
—
40
—
ppm/°C
Note 3
Fixed-Output Characteristics
Voltage Regulation
V
OUT
V
R
– 2.5%
V
R
± 0.5% V
R
+ 2.5%
V
Note 2
Dropout Characteristics
Dropout Voltage
V
IN
– V
OUT
—
220
500
mV
I
OUT
= 1A, V
IN(MIN)
= 2.3V
(
Note 5
)
Note
1:
The minimum V
IN
must meet two conditions: V
IN
2.3V and V
IN
V
R
+ 2.5%
V
DROPOUT
.
2:
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
x ((R
1
/R
2
) + 1). See
Figure 4-1
.
3:
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) x 10
6
/(V
R
x
Temperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ 0.5V.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 125°C can impact device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
2005-2014 Microchip Technology Inc.
DS20001936D-page 5
MCP1726
Power Good Characteristics
Input Voltage Operating Range
for Valid PWRGD
V
PWRGD_VIN
1.0
—
6.0
V
T
A
= +25°C
1.2
—
6.0
T
A
= -40°C to +125°C
I
SINK
= 100 µA
PWRGD Threshold Voltage
(Referenced to V
OUT
)
PWRGD_THF
88
92
96
%
V
OUT
< 2.5V, Falling Edge
89
92
95
%
V
OUT
> 2.5V, Falling Edge
PWRGD_THR
89
94
98
%
V
OUT
< 2.5V, Rising Edge
90
93
96
%
V
OUT
> 2.5V, Rising Edge
PWRGD Output Voltage Low
V
PWRGD_L
—
0.2
0.4
V
I
PWRGD SINK
= 1.2 mA
PWRGD Leakage
P
WRGD_LK
—
0.1
—
µA
V
PWRGD
= V
IN
= 6.0V
PWRGD Time Delay
T
PG
—
200
—
µs
C
DELAY
= OPEN
10
30
55
ms
C
DELAY
= 0.01 µF
—
300
—
ms
C
DELAY
= 0.1 µF
Detect Threshold to PWRGD
Active Time Delay
T
VDET-PWRGD
—
170
—
µs
Shutdown Input
Logic-High Input
V
SHDN-HIGH
45
—
—
%V
IN
V
IN
= 2.3V to 6.0V
Logic-Low Input
V
SHDN-LOW
—
—
15
%V
IN
V
IN
= 2.3V to 6.0V
SHDN Input Leakage Current
SHDN
ILK
-0.1
±0.001
+0.1
µA
V
IN
= 6V, SHDN = V
IN
,
SHDN = GND
AC Performance
Output Delay from SHDN
T
OR
100
µs
SHDN = GND to V
IN
V
OUT
= GND to 95% V
R
Output Noise
e
N
—
2.0
—
µV/
Hz I
OUT
= 200 mA, f = 1 kHz,
C
OUT
= 1 µF (X7R Ceramic),
V
OUT
= 2.5V
Power Supply Ripple Rejection
Ratio
PSRR
—
54
—
dB
f = 100 Hz, C
OUT
= 10 µF,
I
OUT
= 100 mA,
V
INAC
= 30 mV pk-pk,
C
IN
= 0 µF
Thermal Shutdown Temperature
T
SD
—
150
—
°C
I
OUT
= 100 µA,
V
OUT
= 1.8V, V
IN
= 2.8V
Thermal Shutdown Hysteresis
T
SD
—
10
—
°C
I
OUT
= 100 µA,
V
OUT
= 1.8V, V
IN
= 2.8V
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications:
Unless otherwise noted, V
IN
= (V
R
+ 0.5V) or 2.3V, whichever is greater, I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C. Boldface type applies for junction temperatures, T
J
(
Note 7
), of -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Note
1:
The minimum V
IN
must meet two conditions: V
IN
2.3V and V
IN
V
R
+ 2.5%
V
DROPOUT
.
2:
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
x ((R
1
/R
2
) + 1). See
Figure 4-1
.
3:
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) x 10
6
/(V
R
x
Temperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ 0.5V.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 125°C can impact device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
MCP1726
DS20001936D-page 6
2005-2014 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
Unless otherwise indicated, all limits apply for V
IN
= 2.3V to 6.0V.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Steady State
Maximum Junction Temperature
T
J
—
—
+150
°C
Transient
Storage Temperature Range
T
A
-65
—
+150
°C
Thermal Package Resistances
Thermal Resistance, 8L 3x3 DFN
JA
—
64
—
°C/W
4-Layer JC51-5
Standard Board with
Vias
JC
—
12
—
Thermal Resistance, 8L SOIC
JA
—
163
—
°C/W
4-Layer JC51-7
Standard Board
JC
—
42
—
2005-2014 Microchip Technology Inc.
DS20001936D-page 7
MCP1726
2.0
TYPICAL PERFORMANCE CURVES
Note:
Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V, I
OUT
= 1 mA and T
A
= +25°C.
FIGURE 2-1:
Quiescent Current vs. Input
Voltage (1.2V Adjustable).
FIGURE 2-2:
Ground Current vs. Load
Current (1.2V Adjustable).
FIGURE 2-3:
Quiescent Current vs.
Junction Temperature (1.2V Adjustable).
FIGURE 2-4:
Line Regulation vs.
Temperature (1.2V Adjustable).
FIGURE 2-5:
Load Regulation vs.
Temperature.
FIGURE 2-6:
Adjust Pin Voltage vs.
Temperature.
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
110
120
130
140
150
160
170
180
2.3
2.8
3.3
3.8
4.3
4.8
5.3
5.8
Input Voltage (V)
Quies
cent C
u
rr
ent (µA
)
-40ºC
+125°C
+25°C
V
R
= 1.2V (Adj.)
I
OUT
= 0 mA
120
140
160
180
200
220
240
260
280
300
0
200
400
600
800
1000
Load Current (mA)
G
round C
u
rrent (
µ
A
)
V
IN
= 2.5V
V
IN
= 3.3V
V
R
= 1.2V (Adj.)
100
110
120
130
140
150
160
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
Quiesc
ent
C
u
rr
ent (µA
)
V
IN
= 2.5V
V
IN
= 5.0V
V
IN
= 3.3V
V
R
= 1.2V (Adj.)
I
OUT
= 0 mA
-0.02
-0.01
0
0.01
0.02
0.03
0.04
0.05
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (°C)
Li
n
e
R
e
gu
la
ti
on
(%
/V
)
I
OUT
= 1A
I
OUT
= 500 mA
I
OUT
= 100 mA
I
OUT
= 1 mA
V
R
= 1.2V (Adj.)
V
IN
= 2.3V to 6.0V
0.10
0.20
0.30
0.40
0.50
0.60
0.70
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (°C)
L
o
ad
R
e
gu
la
ti
on (
%
)
V
R
= 0.8V
V
R
= 1.8V
V
R
= 3.3V
V
R
= 5.0V
V
IN
= V
R
+ 0.6V (or 2.3V)
I
OUT
= 1 mA to 1A
408.50
409.00
409.50
410.00
410.50
411.00
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (°C)
A
d
ju
st P
in
V
o
lt
age (m
V
)
V
IN
= 6.0V
V
IN
= 2.3V
I
OUT
= 1 mA
MCP1726
DS20001936D-page 8
2005-2014 Microchip Technology Inc.
Note:
Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V, I
OUT
= 1 mA and T
A
= +25°C.
FIGURE 2-7:
Dropout Voltage vs. Output
Current (Adjustable Version).
FIGURE 2-8:
Dropout Voltage vs.
Temperature (Adjustable Version).
FIGURE 2-9:
Power Good (PWRGD)
Time Delay vs. Temperature.
FIGURE 2-10:
Quiescent Current vs. Input
Voltage (0.8V Fixed).
FIGURE 2-11:
Quiescent Current vs. Input
Voltage (3.3V Fixed).
FIGURE 2-12:
Ground Current vs. Load
Current.
0
25
50
75
100
125
150
175
200
225
250
0
200
400
600
800
1000
Output Current (mA)
D
ro
pou
t V
o
lt
age
(m
V)
V
OUT
= 5.0V
V
OUT
= 2.5V
Adjustable Version
190
200
210
220
230
240
250
260
270
-40
-25
-10
5
20
35
50
65
80
95
110
125
Temperature (°C)
D
rop
ou
t V
o
lt
ag
e
(mV
)
V
OUT
= 5.0V
V
OUT
=2.5V
V
OUT
= 3.3V
Adjustable Version
I
OUT
= 1A
20
22
24
26
28
30
32
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
Pow
e
r G
ood Ti
me D
e
lay (ms)
V
IN
=2.3V
V
IN
=5.5V
V
IN
=3.0V
C
DELAY
= 10 nF
100
110
120
130
140
150
160
170
180
2.3
2.6
2.9
3.2
3.5
3.8
4.1
4.4
4.7
5.0
5.3
5.6
5.9
Input Voltage (V)
Quiescent C
u
rr
ent (µA
)
+25°C
-40°C
+125°C
+90°C
V
OUT
= 0.8V
I
OUT
= 0 mA
0
100
200
300
400
500
600
700
800
2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0 5.3 5.6 5.9
Input Voltage (V)
Quiescent C
u
rr
ent (µA
)
+125°C
+25°C
-40°C
V
OUT
=3.3V
I
OUT
= 0 mA
120
140
160
180
200
220
240
260
280
300
320
340
0
200
400
600
800
1000
Load Current (mA)
G
round C
u
rrent
(µA
)
V
OUT
=3.3V
V
OUT
=0.8V
V
IN
= 2.3V for 0.8V device
2005-2014 Microchip Technology Inc.
DS20001936D-page 9
MCP1726
Note:
Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V, I
OUT
= 1 mA and T
A
= +25°C.
FIGURE 2-13:
Quiescent Current vs.
Temperature.
FIGURE 2-14:
I
SHDN
vs. Temperature.
FIGURE 2-15:
Line Regulation vs.
Temperature (0.8V Fixed).
FIGURE 2-16:
Line Regulation vs.
Temperature (3.3V Fixed).
FIGURE 2-17:
Load Regulation vs.
Temperature (V
OUT
< 2.5V Fixed).
FIGURE 2-18:
Load Regulation vs.
Temperature (V
OUT
2.5V Fixed).
100
110
120
130
140
150
160
170
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
11
0
12
5
Temperature (°C)
Quiescent C
u
rr
e
nt (µ
A
)
V
OUT
=0.8V
V
OUT
=3.3V
I
OUT
= 0 mA
V
IN
= 2.3V for 0.8V Device
0
10
20
30
40
50
60
70
80
90
100
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
I
SHDN
(nA
)
V
IN
=6.0V
V
IN
=3.3V
V
IN
=2.3V
-0.025
-0.02
-0.015
-0.01
-0.005
0
0.005
0.01
0.015
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
Li
ne R
e
gul
ati
on
(%
/V)
I
OUT
=1.0A
I
OUT
=500 mA
I
OUT
=100 mA
I
OUT
=10 mA
V
OUT
= 0.8V
-0.01
-0.005
0
0.005
0.01
0.015
0.02
0.025
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
11
0
12
5
Temperature (°C)
L
ine
R
e
gul
ati
on (
%
/V)
I
OUT
=500 mA
I
OUT
=1 mA
I
OUT
=1A
I
OUT
=100 mA
V
OUT
= 3.3V
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
L
o
ad
R
e
gu
la
ti
on
(%
)
V
OUT
=1.2V
V
OUT
=0.8V
V
OUT
=1.8V
I
OUT
= 1 mA to 1000 mA
V
IN
= 2.3V
-0.70
-0.65
-0.60
-0.55
-0.50
-0.45
-0.40
-0.35
-0.30
-0.25
-0.20
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
11
0
12
5
Temperature (°C)
L
o
ad
R
e
gu
la
ti
on
(%
)
V
OUT
=5.0V
V
OUT
=3.3V
V
OUT
=2.5V
I
OUT
= 1 mA to 1000 mA
V
IN
= V
OUT
+ 0.6V
MCP1726
DS20001936D-page 10
2005-2014 Microchip Technology Inc.
Note:
Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V, I
OUT
= 1 mA and T
A
= +25°C.
FIGURE 2-19:
Dropout Voltage vs. Load
Current.
FIGURE 2-20:
Dropout Voltage vs.
Temperature.
FIGURE 2-21:
Short-Circuit Current vs.
Input Voltage.
FIGURE 2-22:
Output Noise Voltage
Density vs. Frequency.
FIGURE 2-23:
Power Supply Ripple
Rejection (PSRR) vs. Frequency (V
OUT
= 1.2V
Adjustable).
FIGURE 2-24:
Power Supply Ripple
Rejection (PSRR) vs. Frequency (V
OUT
= 1.2V
Adjustable).
0
25
50
75
100
125
150
175
200
225
250
0
200
400
600
800
1000
Load Current (mA)
D
rop
out
V
o
lt
age
(m
V)
V
OUT
=5.0V
V
OUT
=2.5V
180
190
200
210
220
230
240
250
260
270
-4
0
-2
5
-1
0
5
20
35
50
65
80
95
110
125
Temperature (°C)
D
ropo
ut Vo
lt
a
g
e
(m
V
)
V
OUT
=5.0V
V
OUT
=2.5V
V
OUT
=3.3V
I
OUT
= 1A
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2.3 2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0 5.3 5.6 5.9
Input Voltage (V)
S
h
or
t C
ir
c
ui
t C
u
rr
ent
(A
)
V
OUT
=1.2V (Fixed)
0.01
0.1
1
10
0.01
0.1
1
10
100
1000
Frequency (kHz)
Noise (µV
Hz)
V
OUT
=2.5V (Adj)
I
OUT
= 200 mA
V
OUT
=0.8V (Fixed)
I
OUT
= 100 mA
C
OUT
=1 µF
C
IN
= 10 µF
0
10
20
30
40
50
60
70
80
0.01
0.1
1
10
100
1000
Frequency (kHz)
PS
RR (
d
B)
C
OUT
=10 µF
C
IN
= 0 µF
I
OUT
= 100 mA
V
OUT
= 1.2V
V
IN
= 2.5V
0
10
20
30
40
50
60
70
80
90
0.01
0.1
1
10
100
1000
Frequency (kHz)
PS
RR (
d
B
)
C
OUT
=22 µF
C
IN
= 0 µF
I
OUT
= 100 mA
V
OUT
= 1.2V
V
IN
= 2.5V