21876B.book

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DS21876B-page 1

MCP1650/51/52/53

Features

• Output Power Capability Over 5 Watts

• Output Voltage Capability From 3.3V to Over 

100V

• 750 kHz Gated Oscillator Switching Frequency

• Adaptable Duty Cycle for Battery or Wide-Input, 

Voltage-Range Applications

• Input Voltage Range: 2.0V to 5.5V

• Capable of SEPIC and Flyback Topologies

• Shutdown Control with I

< 0.1 µA (Typical)

• Low Operating Quiescent Current: I

Q

 = 120 µA

• Voltage Feedback Tolerance (0.6%, Typical)

• Popular MSOP-8 Package

• Peak Current Limit Feature

• Two Undervoltage Lockout (UVLO) Options:

- 2.0V or 2.55V

• Operating Temperature Range: -40°C to +125°C

Applications

• High-Power Boost Applications

• High-Voltage Bias Supplies

• White LED Drivers and Flashlights

• Local 3.3V to 5.0V Supplies

• Local 3.3V to 12V Supplies

• Local 5.0V to 12V Supplies

• LCD Bias Supply

Description

The MCP1650/51/52/53 is a 750 kHz gated oscillator
boost controller packaged in an 8 or 10-pin MSOP
package. Developed for high-power, portable applica-
tions, the gated oscillator controller can deliver 5 watts
of power to the load while consuming only 120 µA of
quiescent current at no load. The MCP1650/51/52/53
can operate over a wide input voltage range (2.0V to
5.5V) to accommodate multiple primary-cell and single-
cell Li-Ion battery-powered applications, in addition to
2.8V, 3.3V and 5.0V regulated input voltages. 

An internal 750 kHz gated oscillator makes the
MCP1650/51/52/53 ideal for space-limited designs.
The high switching frequency minimizes the size of the
external inductor and capacitor, saving board space
and cost. The internal oscillator operates at two differ-
ent duty cycles depending on the level of the input volt-
age. By changing duty cycle in this fashion, the peak
input current is reduced at high input voltages, reducing
output ripple voltage and electrical stress on power
train components. When the input voltage is low, the
duty cycle changes to a larger value in order to provide
full-power capability at a wide input voltage range
typical of battery-powered, portable applications.

The MCP1650/51/52/53 was designed to drive external
switches directly using internal low-resistance
MOSFETs.

Additional features integrated on the MCP1650/51/52/
53 family include peak input current limit, adjustable
output voltage/current, low battery detection and
power-good indication.

Package Types

10-Pin MSOP

EXT

GND

CS

FB

V

IN

NC

NC

SHDN

1

2

3

4

8

7

6

5

MCP

1

6

5

0

8-Pin MSOP

GND

CS

FB

NC

PG

LBO

LBI

SHDN

2

3

4

5

9

8

7

6

MCP

1

6

5

3

EXT

V

IN

1

10

EXT

GND

CS

FB

V

IN

PG

NC

SHDN

1

2

3

4

8

7

6

5

M

C

P

1652

8-Pin MSOP

EXT

GND

CS

FB

V

IN

LBO

LBI

SHDN

1

2

3

4

8

7

6

5

MCP

1

6

5

1

8-Pin MSOP

750 kHz Boost Controller

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MCP1650/51/52/53

DS21876B-page 2

 2004-2013 Microchip Technology Inc.

MCP1650 Block Diagram

ISNS

+

 

 
 -

1.22V

1R

9R

+

-

+

 

 
 -

Internal Osc. with  
2 fixed Duty Cycles

V

HIGH

V

LOW

 

V

DUTY

+

-

V

REF

V

IN

V

HIGH

V

LOW

V

DUTY

DC = 80% V

IN

 

< 3.8V 

DC = 56% V

IN

 

> 3.8V

V

IN

+

-

Voltage Feedback

Current Limit

CS

V

IN

EXT

Osc.

SHDN

FB

V

REF

 

1.22V

S

R

Q

Pulse 

DR

Soft-
Start

ON/

OSC. OUT

GND

ON/OFF

Control

MCP1650

Latch

Ref

0.122V

OFF

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DS21876B-page 3

MCP1650/51/52/53

MCP1651/2/3 Block Diagram

Vin

CS

EXT

MCP1650/51/52/53

SHDN

GND

+

-

 Low Battery 
Comparator

1.22 Vref

LBI

LBO

+

-

Power Good
Comparators

PG

85% of Vref

VIN

+

-

115% of Vref

VIN

MCP1651 - Low Battery Detection

MCP1652 - Power Good Indication

A

MCP1650 - No Features
MCP1651 - Low Battery Detection
MCP1652 - Power Good Indication
MCP1653 - Low Battery Detection and PG

MCP1650

V

FB

Vref. (1.22V)

MCP1653 - LBI and PG Features

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MCP1650/51/52/53

DS21876B-page 4

 2004-2013 Microchip Technology Inc.

Timing Diagram 

Typical Application Circuits

Latch Truth Table

S

R

Q

0

0

Qn

0

1

1

1

0

0

1

1

1

Osc

S

R

Q

DR

EXT

MCP1650/1/2/3 Timing Diagram

R

S

Q

Q

FB

CS

SHDN

V

IN

8

2

5

6

4

7

MCP1650

GND

Input
Voltage
3.3V ±10%

C

IN

10 µF

off

on

EXT

Boost

Inductor

3.3 µH

10 µF
Ceramic

90.9 k

V

OUT

 

= 12V

I

OUT

 

= 0 to 100 mA

10 k

MOSFET/Schottky

Combination Device

R

SENSE

0.05

3.3V to 12V 100 mA Boost Converter

1

3

NC

NC

C

OUT

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 2004-2013 Microchip Technology Inc.

DS21876B-page 5

MCP1650/51/52/53

1.0

ELECTRICAL 
CHARACTERISTICS

Absolute Maximum Ratings †

V

IN

 

TO

 GND........................................................... 6.0V

CS,FB,LBI,LBO,SHDN,PG,EXT ............ GND – 0.3V to 
                                                                 V

IN

 + 0.3V

Current at EXT pin  ................................................ ±1A
Storage temperature .......................... -65°C to +150°C
Operating Junction Temperature........ -40°C to +125°C

ESD protection on all pins

 4 kV  HBM

† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply at V

IN

= +2.7V to +5.5V, SHDN = High,

T

J

= -40°C to +125°C. Typical values apply for V

IN

= 3.3V, T

A

+25°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Characteristics

Supply Voltage

V

IN

2.7

5.5

V

Undervoltage Lockout
(S Option)

UVLO

2.4

2.55

2.7

V

V

IN

 rising edge

Under Voltage Lockout
(R Option)

UVLO

1.85

2.0

2.15

V

V

IN

 rising edge

Undervoltage Hysteresis

UVLO

HYST

117

mV

Shutdown Supply Current

I

SHD

0.001

1

µA

SHDN = GND

Quiescent Supply Current

I

Q

120

220

µA

EXT = Open

Soft Start Time

T

SS

500

µs

Feedback Characteristics

Feedback Voltage

V

FB

1.18

1.22

1.26

V

All conditions

Feedback Comparator 
Hysteresis

V

HYS

12

23

mV

Feedback Input Bias Current

I

FBlk

-50

50

nA

V

FB

 < 1.3V

Current Sense Input

Current Sense Threshold

I

SNS-TH

75

114

155

mV

Delay from Current Sense to 
Output

T

dly_ISNS

80

ns

Ext Drive

EXT Driver ON Resistance 
(High Side)

R

HIGH

8

18

EXT Driver ON Resistance 
(Low Side)

R

LOW

4

12

Oscillator Characteristics

Switching Frequency

F

OSC

650

750

850

kHz

Low Duty Cycle Switch-Over 
Voltage

V

LowDuty

3.8

V

V

IN

 rising edge

Duty Cycle Switch Voltage  
Hysteresis

DC

Hyst

92

mV

Low Duty Cycle

DC

LOW

50

56

62

%

High Duty Cycle

DC

HIGH

72

80

88

%

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MCP1650/51/52/53

DS21876B-page 6

 2004-2013 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Shutdown Input

Logic High Input

V

IN-HIGH

50

% of V

IN

Logic Low Input

V

IN-Low

15

%  of  V

IN

Input Leakage Current

I

SHDN

5

100

nA

SHDN=V

IN

Low Battery Detect (MCP1651/MCP1653 Only)

Low Battery Threshold

LBI

TH

1.18

1.22

1.26

V

LBI Input falling (All Conditions)

Low Battery Threshold 
Hysteresis

LBI

THHYS

95

123

145

mV

Low Battery Input Leakage 
Current

I

LBI

10

nA

V

LBI

 = 2.5V

Low Battery Output Voltage

V

LBO

53

200

mV

I

LB

 SINK = 3.2 mA, V

LBI

 = 0V

Low Battery Output Leakage 
Current

I

LBO

0.01

1

µA

V

LBI

 = 5.5V, V

LBO

 = 5.5V

Time Delay from LBI to LBO

T

D_LBO

70

µs

L

BI

 Transitions from 

L

BITH

+ 0.1V to L

BITH

- 0.1V

Power Good Output (MCP1652/MCP1653 Only)

Power Good Threshold Low

V

PGTH-L

-20

-15

-10

%

Referenced to Feedback Voltage

Power Good Threshold High

V

PGTH-H

+10

+15

+20

%

Referenced to Feedback Voltage

Power Good Threshold 
Hysteresis

V

PGTH-HYS

5

%

Referenced to Feedback Voltage 
(Both Low and High Thresholds)

Power Good Output Voltage

V

PGOUT

53

200

mV

I

PG

 SINK = 3.2 mA, V

FB

 = 0V

Time Delay from V

FB

 out of 

regulation to Power Good 
Output transition

T

D_PG

85

µs

V

FB

 Transitions from 

V

FBTH

+ 0.1V to V

FBTH 

 -0.1V

Electrical Specifications: Unless otherwise noted, all parameters apply at V

IN 

= +2.7V to +5.5V, SHDN = High,

T

= -40°C to +125°C. Typical values apply for V

IN 

= 3.3V, T

= +25°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Storage Temperature Range

T

A

-40

+125

°C

Operating Junction Temperature 
Range

T

J

-40

+125

°C

Continuous

Thermal Package Resistances

Thermal Resistance, MSOP-8

JA

208

°C/W

Single-Layer SEMI G42-88 
Board, Natural Convection

Thermal Resistance, MSOP-10

JA

113

°C/W

4-Layer JC51-7 Standard Board, 
Natural Convection 

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, all parameters apply at V

IN

= +2.7V to +5.5V, SHDN = High,

T

J

= -40°C to +125°C. Typical values apply for V

IN

= 3.3V, T

A

+25°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

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 2004-2013 Microchip Technology Inc.

DS21876B-page 7

MCP1650/51/52/53

2.0

TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, 

V

IN

 = 3.3V, V

OUT

= 12V, C

IN

 = 10 µF (x5R or X7R Ceramic), C

OUT

 = 10 µF (X5R or X7R),

I

OUT

= 10 mA,  L = 3.3 µH,  SHDN > V

IH

, T

A

 = +25°C.

FIGURE 2-1:

Input Quiescent Current vs. 

Input Voltage.

FIGURE 2-2:

Input Quiescent Current vs. 

Ambient Temperature.

FIGURE 2-3:

Oscillator Frequency vs. 

Input Voltage.

FIGURE 2-4:

Oscillator Frequency vs. 

Ambient Temperature.

FIGURE 2-5:

Duty Cycle Switch-Over 

Voltage vs. Ambient Temperature.

FIGURE 2-6:

Duty Cycle Switch-Over 

Hysteresis Voltage vs. Ambient Temperature.

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

50

75

100

125

150

175

200

2

2.5

3

3.5

4

4.5

5

5.5

6

Input Voltage (V)

Input Quiescent C

u

rr

e

nt (µA

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

I

LOAD

 = 0 mA 

50

75

100

125

150

175

200

-40

-25

-10

5

20

35

50

65

80

95

110 125

Ambient Temperature (°C)

Input Quiescent C

u

rr

e

nt (µA

)

V

IN

 = 2.0V

I

LOAD

 = 0 mA

V

IN

 = 5.5V

V

IN

 = 4.1V

V

IN

 = 2.7V

700

720

740

760

780

800

2.7

3

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6

Input Voltage (V)

Oscillato

r F

req

u

e

n

cy (kHz)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

720

740

760

780

800

820

840

-40 -25 -10

5

20

35

50

65

80

95 110 125 140

Ambient Temperature (°C)

Oscillato

r F

req

u

e

n

cy (kHz)

V

IN

 = 2.0V

V

IN

 = 5.5V

V

IN

 = 4.1V

V

IN

 = 2.7V

3.75

3.76

3.77

3.78

3.79

3.80

3.81

3.82

3.83

3.84

3.85

-40 -25 -10

5

20

35

50

65

80

95

110 125

Ambient Temperature (°C)

D

u

ty C

ycle S

w

itch Over

 

V

o

ltage (V

)

V

IN

 = Rising 

90.0

90.5

91.0

91.5

92.0

92.5

93.0

93.5

94.0

-40 -25 -10

5

20

35

50

65

80

95

110 125

Ambient Temperature (°C)

D

u

ty C

ycle S

w

itch V

o

ltage 

H

yster

esis (m

V

)

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MCP1650/51/52/53

DS21876B-page 8

 2004-2013 Microchip Technology Inc.

Note: Unless otherwise indicated, 

V

IN

 = 3.3V, VOUT = 12V, C

IN

 = 10 µF (x5R or X7R Ceramic), C

OUT

 = 10 µF (X5R or X7R),

I

OUT

= 10 mA, L = 3.3 µH, SHDN > V

IH

, T

A

 = +25°C.

FIGURE 2-7:

EXT Sink and Source 

Current vs. Input Voltage.

FIGURE 2-8:

EXT Sink and Source 

Current vs. Ambient Temperature.

FIGURE 2-9:

EXT Rise and Fall Times vs. 

External Capacitance.

FIGURE 2-10:

Feedback Voltage vs. Input 

Voltage.

FIGURE 2-11:

Feedback Voltage 

Hysteresis vs. Input Voltage.

FIGURE 2-12:

Dynamic Load Response.

0.0

0.2

0.4

0.6

0.8

1.0

2.7

3.0

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6.0

Input Voltage (V)

E

X

T

 S

ink/

S

our

ce C

u

rr

e

nt (A

)

I

SINK 

I

SOURCE 

T

= +25°C 

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

-40

-25

-10

5

20

35

50

65

80

95

110 125

Ambient Temperature (°C)

E

X

T

 S

ink/

S

our

ce C

u

rr

e

nt (A

)

I

SINK 

I

SOURCE 

V

IN 

= 3.3V

0

10

20

30

40

50

60

70

80

100

150

200

250

300

350

400

450

500

External Capacitance (pF)

E

X

T

 Rise / F

a

ll T

im

e

 (n

S

)

5V

FALL 

2.7V

RISE 

5V

RISE 

2.7V

FALL 

1.205

1.210

1.215

1.220

1.225

1.230

2

2.5

3

3.5

4

4.5

5

5.5

6

Input Voltage (V)

V

FB

 V

o

ltage (V

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

0

2

4

6

8

10

12

14

16

18

2.7

3

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6

Input Voltage (V)

V

FB

 H

yster

esis (m

V

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

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DS21876B-page 9

MCP1650/51/52/53

Note: Unless otherwise indicated, 

V

IN

 = 3.3V, VOUT = 12V, C

IN

 = 10 µF (x5R or X7R Ceramic), C

OUT

 = 10 µF (X5R or X7R),

I

OUT

= 10 mA, L = 3.3 µH, SHDN > V

IH

, T

A

 = +25°C.

FIGURE 2-13:

Dynamic Line Response.

FIGURE 2-14:

Power-Up Timing (Input 

Voltage).

FIGURE 2-15:

Power-Up Timing 

(Shutdown).

FIGURE 2-16:

Efficiency vs. Input Voltage.

FIGURE 2-17:

Efficiency vs. Load Current.

FIGURE 2-18:

Output Voltage vs. Input 

Voltage (Line Regulation).

75

77

79

81

83

85

87

89

2.7

3.0

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6.0

Input Votlage (V)

E

fficiency (%

)

T

= 25°C

I

OUT

= 100 mA 

60

65

70

75

80

85

90

10.0

20.0

30.0

40.0

50.0

60.0

70.0

80.0

90.0

100.0

Load Current (mA)

E

fficiency (%

)

T

= 25°C

V

IN

= 3.3V 

12.10

12.11

12.12

12.13

12.14

12.15

12.16

2.7

3.0

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6.0

Input Voltage (V)

Output V

o

ltage (V

)

T

= 25°C

I

OUT

 = 100 mA 

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MCP1650/51/52/53

DS21876B-page 10

 2004-2013 Microchip Technology Inc.

Note: Unless otherwise indicated, 

V

IN

 = 3.3V, VOUT = 12V, C

IN

 = 10 µF (x5R or X7R Ceramic), C

OUT

 = 10 µF (X5R or X7R),

I

OUT

= 10 mA, L = 3.3 µH, SHDN > V

IH

, T

A

 = +25°C.

FIGURE 2-19:

Output Voltage vs. Output 

Current (Load Regulation).

FIGURE 2-20:

Output Voltage Ripple vs. 

Input Voltage.

FIGURE 2-21:

LBI Threshold Voltage vs. 

Input Voltage.

FIGURE 2-22:

LBI Hysteresis Voltage vs. 

Input Voltage.

FIGURE 2-23:

LBO Output Voltage vs. 

LBO Sink Current.

FIGURE 2-24:

LBO Output Timing.

12.10

12.11

12.12

12.13

12.14

12.15

12.16

12.17

10

20

30

40

50

60

70

80

90

100

Output Current (mA)

Output V

o

ltage (V

)

V

IN 

= 3.3V

T

= +25°C 

V

IN 

= 4.3V

0.10

0.12

0.14

0.16

0.18

0.20

0.22

0.24

0.26

2.7

3.0

3.3

3.6

3.9

4.2

4.5

4.8

5.1

5.4

5.7

6.0

Input Voltage (V)

V

OUT

 R

ippl

PK-PK

 (V

)

I

OUT 

= 100mA

T

= +25°C 

1.205

1.210

1.215

1.220

1.225

1.230

2

2.5

3

3.5

4

4.5

5

5.5

6

Input Voltage (V)

LB

I Thr

eshol

d V

o

lt

age (V

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

120

121

122

123

124

125

126

127

128

129

2

2.5

3

3.5

4

4.5

5

5.5

6

Input Votlage (V)

LB

I H

yster

esis V

o

ltage (m

V

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

0

50

100

150

200

250

0

2

4

6

8

10

LBO Sink Current (mA)

LB

O

 O

u

tput V

o

lt

age (m

V

)

T

J

 = - 40°C

T

J

 = +25°C

T

J

 = +125°C

Maker
Microchip Technology Inc.
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