100V Half-Bridge MOSFET Driver with Anti-Shoot-Through Protection

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 2016 Microchip Technology Inc.

DS20005575A-page 1

MIC4102

Features

• Drives High- and Low-Side N-Channel MOSFETs 

with Single Input

• Adaptive Anti-Shoot-Through Protection
• Low-Side Drive Disable Pin
• Bootstrap Supply Voltage to 118V DC
• Supply Voltage up to 16V
• TTL Input Thresholds
• On-Chip Bootstrap Diode
• Fast 30 ns Propagation Times
• Drives 1000 pF Load with 10 ns Rise and Fall 

Times

• Low Power Consumption
• Supply Undervoltage Protection
• 2.5Ω Pull-Up, 1.5Ω Pull-Down Output Resistance
• Space Saving SOIC-8L Package
• –40°C to +125°C Junction Temperature Range

Applications

• High Voltage Buck Converters
• Networking/Telecom Power Supplies
• Automotive Power Supplies
• Current-Fed Push-Pull Power Topologies
• Ultrasonic Drivers
• Avionic Power Supplies

General Description

The MIC4102 is a high frequency, 100V half-bridge
MOSFET driver IC featuring internal anti-shoot-through
protection. The low-side and high-side gate drivers are
controlled by a single input signal to the PWM pin. The
MIC4102 implements adaptive anti-shoot-through
circuitry to optimize the switching transitions for
maximum efficiency. The single input control also
reduces system complexity and greatly simplifies the
overall design.
The MIC4102 also features a low-side drive disable
pin. This gives the MIC4102 the capability to operate in
a non-synchronous buck mode. This feature allows the
MIC4102 to start up into applications where a bias
voltage may already be present without pulling the
output voltage down.
Undervoltage protection on both the low-side and
high-side supplies forces the outputs low. An on-chip
bootstrap diode eliminates the discrete diode required
with other driver ICs. 
The MIC4102 is available in the SOIC-8L package with
a junction operating range from –40°C to +125°C.

Typical Application Schematic

MIC4102

SOIC-8L

HI

MIC4102

PWM

CONTROLLER

LS

HO

HS

LO

HB

VDD

9V TO 16V BIAS

100V SUPPLY

GND

V

OUT

100V Half-Bridge MOSFET Driver 

with Anti-Shoot-Through Protection

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MIC4102

DS20005575A-page 2

 2016 Microchip Technology Inc.

Functional Block Diagram

MIC4102

1

5

6

8

4

3

2

V

SS

DRIVER

UVLO

UVLO

LEVEL

SHIFT

DRIVER

HV

LEVEL

SHIFT

HB

HO

HS

LO

PWM

LS

7

V

DD

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 2016 Microchip Technology Inc.

DS20005575A-page 3

MIC4102

1.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage (V

DD

, V

HB

 – V

HS

) .............................................................................................................. –0.3V to +18V

Input Voltages (V

PWM

, V

LS

)...............................................................................................................–0.3V to V

DD

 + 0.3V

Voltage on LO (V

LO

)..........................................................................................................................–0.3V to V

DD

 + 0.3V

Voltage on HO (V

HO

).................................................................................................................V

HS

 – 0.3V to V

HB

 + 0.3V

Voltage on HS (Continuous).........................................................................................................................–1V to +110V
Voltage on HB ......................................................................................................................................................... +118V
Average Current in V

DD

 to HB Diode ....................................................................................................................100 mA

ESD Rating .............................................................................................................................................................

Note 1

Operating Ratings ‡

Supply Voltage (V

DD

) .................................................................................................................................... +9V to +16V

Voltage on HS ............................................................................................................................................. –1V to +100V
Voltage on HS (Repetitive Transient).......................................................................................................... –5V to +105V
HS Slew Rate........................................................................................................................................................ 50 V/ns
Voltage on HB .............................................................................................................................. V

HS

 + 8V to V

HS

 + 16V

and ............................................................................................................................................. V

DD

 – 1V to V

DD

 + 100V

 Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice:

 The device is not guaranteed to function outside its operating ratings.

Note 1:

Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.

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MIC4102

DS20005575A-page 4

 2016 Microchip Technology Inc.

TABLE 1-1:

ELECTRICAL CHARACTERISTICS

Electrical Characteristics:

 V

DD

 = V

HB

 = 12V; V

SS

 = V

HS

 = 0V; No load on LO or HO; T

A

 = +25°C; unless noted. 

Bold

 values are valid for –40°C ≤ T

J

 ≤ +125°C. (

Note 1

)

.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Supply Current

V

DD

 Quiescent Current

I

DD

150

450

µA

PWM = 0V

600

V

DD

 Operating Current

I

DDO

3

3.5

mA

f = 500 kHz

4.0

Total HB Quiescent Current

I

HB

25

150

µA

PWM = 0V

200

Total HB Operating Current

I

HBO

1.5

2.5

mA

f = 500 kHz

3

HB to V

SS

 Quiescent Current

I

HBS

0.05

1

µA

V

HS

 = V

HB

 = 110V

30

Input Pins (TTL)

Low Level Input Voltage Threshold

V

IL

0.8

1.5

V

High Level Input Voltage Threshold V

IH

1.5

2.2

V

Input Pull-Down Resistance

R

I

100

200

500

kΩ

Undervoltage Protection

V

DD

 Rising Threshold

V

DDR

6.5

7.3

8.0

V

V

DD

 Threshold Hysteresis

V

DDH

0.5

V

HB Rising Threshold

V

HBR

6.0

7.0

8.0

V

HB Threshold Hysteresis

V

HBH

0.4

V

Bootstrap Diode

Low-Current Forward Voltage

V

DL

0.4

0.55

V

I

VDD-HB

 = 100 µA

0.70

High-Current Forward Voltage

V

DH

0.7

0.8

V

I

VDD-HB

 = 100 mA

1.0

Dynamic Resistance

R

D

1.0

1.5

I

VDD-HB

 = 100 mA

2.0

LO Gate Driver

Low Level Output Voltage

V

OLL

0.18

0.3

V

I

LO

 = 160 mA

0.4

High Level Output Voltage

V

OHL

0.25

0.3

V

I

LO

 = –100 mA, 

V

OHL

 = V

DD

 – V

LO

0.45

Peak Sink Current

I

OHL

3

A

V

LO

 = 0V

Peak Source Current

I

OLL

2

A

V

LO

 = 12V

Note 1:

Specification for packaged product only.

2:

All voltages relative to Pin 7, V

SS

, unless otherwise specified.

3:

Guaranteed by design. Not production tested.

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 2016 Microchip Technology Inc.

DS20005575A-page 5

MIC4102

HO Gate Driver

Low Level Output Voltage

V

OLH

0.22

0.3

V

I

HO

 = 160 mA

0.4

High Level Output Voltage

V

OHH

0.25

0.3

V

I

HO

 = –100 mA, 

V

OHH

 = V

HB

 – V

HO

0.45

Peak Sink Current

I

OHH

3

A

V

HO

 = 0V

Peak Source Current

I

OLH

2

A

V

HO

 = 12V

Switching Specifications (Anti-Shoot-Through Circuitry)

Delay between PWM going high to 
LO going low

t

LOOFF

30

45

ns

60

Voltage threshold for LO MOSFET 
to be considered OFF

V

LOOFF

1.7

V

Delay between LO OFF to HO 
going High

t

HOON

30

50

ns

60

Delay between PWM going Low to 
HO going low

t

HOOFF

45

65

ns

70

Switch Node Voltage Threshold 
when HO turns off

V

SWth

1

2.5

4

V

Delay between HO MOSFET being 
considered off to LO turning ON

t

LOON

30

60

ns

70

Delay between LS going low and 
LO turning OFF

t

LSOFF

36

45

ns

C

L

 = 1000 pF

70

Forced LO ON, if V

LOTH

 is not 

detected

t

SWTO

120

250

450

ns

Switching Specifications

Either Output Rise Time (3V to 9V)

t

R

10

ns

C

L

 = 1000 pF

Either Output Fall Time (3V to 9V)

t

F

6

ns

C

L

 = 1000 pF

Either Output Rise Time (3V to 9V)

t

R

0.33

0.6

µs

C

L

 = 0.1 µF

0.8

Either Output Fall Time (3V to 9V)

t

F

0.2

0.3

µs

C

L

 = 0.1 µF

0.4

Minimum Input Pulse Width that 
changes the output with LS = 5V

t

PW

40

60

ns

C

L

 = 0, 

Note 3

Minimum Output Pulse Width on 
HO with min pulse width on PWM 
with LS = 5V

t

PW

15

ns

C

L

 = 0, 

Note 3

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

 V

DD

 = V

HB

 = 12V; V

SS

 = V

HS

 = 0V; No load on LO or HO; T

A

 = +25°C; unless noted. 

Bold

 values are valid for –40°C ≤ T

J

 ≤ +125°C. (

Note 1

)

.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1:

Specification for packaged product only.

2:

All voltages relative to Pin 7, V

SS

, unless otherwise specified.

3:

Guaranteed by design. Not production tested.

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MIC4102

DS20005575A-page 6

 2016 Microchip Technology Inc.

Minimum Input Pulse Width that 
changes the output with LS = 0V

t

PW

13

20

ns

C

L

 = 0, 

Note 3

Minimum Output Pulse Width on 
HO with min pulse width on PWM 
with LS = 0V

20

C

L

 = 0, 

Note 3

Bootstrap Diode Turn-On or 
Turn-Off Time

t

BS

10

ns

TABLE 1-1:

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

 V

DD

 = V

HB

 = 12V; V

SS

 = V

HS

 = 0V; No load on LO or HO; T

A

 = +25°C; unless noted. 

Bold

 values are valid for –40°C ≤ T

J

 ≤ +125°C. (

Note 1

)

.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Note 1:

Specification for packaged product only.

2:

All voltages relative to Pin 7, V

SS

, unless otherwise specified.

3:

Guaranteed by design. Not production tested.

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 2016 Microchip Technology Inc.

DS20005575A-page 7

MIC4102

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges
Max. Junction Temperature Range

T

J

–55

+150

°C

Note 1

Storage Temperature Range

T

S

–60

+150

°C

Operating Junction Temperature 
Range

T

J

–40

+125

°C

Package Thermal Resistances
Thermal Resistance, SOIC-8L

JA

140

°C/W

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable 
junction temperature and the thermal resistance from junction to air (i.e., T

A

, T

J

JA

). Exceeding the 

maximum allowable power dissipation will cause the device operating junction temperature to exceed the 
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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MIC4102

DS20005575A-page 8

 2016 Microchip Technology Inc.

2.0

TYPICAL PERFORMANCE CURVES

FIGURE 2-1:

Quiescent Current vs. 

Supply Voltage.

FIGURE 2-2:

Quiescent Current vs. 

Temperature.

FIGURE 2-3:

Operating Current vs. 

Supply Voltage.

FIGURE 2-4:

Supply Current vs. Supply 

Voltage vs. LS Level.

FIGURE 2-5:

Operating Current vs. 

Temperature.

FIGURE 2-6:

Supply Current vs. 

Frequency.

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

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 2016 Microchip Technology Inc.

DS20005575A-page 9

MIC4102

FIGURE 2-7:

Supply Current vs. 

Frequency for Pin L and H.

FIGURE 2-8:

High Level Output Voltage 

vs. Temperature.

FIGURE 2-9:

Low Level Output of 

Low-Side Driver vs. Temperature.

FIGURE 2-10:

Low Level Output of 

Low-Side Driver vs. Temperature.

FIGURE 2-11:

UVLO Thresholds vs. 

Temperature.

FIGURE 2-12:

UVLO Hysteresis vs. 

Temperature.

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MIC4102

DS20005575A-page 10

 2016 Microchip Technology Inc.

FIGURE 2-13:

Bootstrap Diode I-V 

Characteristics.

FIGURE 2-14:

Bootstrap Diode Reverse 

Current.

Maker
Microchip Technology Inc.
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