© 2007 Microchip Technology Inc.
DS22026B-page 1
MCP1725
Features
• 500 mA Output Current Capability
• Input Operating Voltage Range: 2.3V to 6.0V
• Adjustable Output Voltage Range: 0.8V to 5.0V
• Standard Fixed Output Voltages:
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
• Other Fixed Output Voltage Options Available
Upon Request
• Low Dropout Voltage: 210 mV typical at 500 mA
• Typical Output Voltage Tolerance: 0.5%
• Stable with 1.0 µF Ceramic Output Capacitor
• Fast response to Load Transients
• Low Supply Current: 120 µA (typical)
• Low Shutdown Supply Current: 0.1 µA (typical)
• Adjustable Delay on Power Good Output
• Short Circuit Current Limiting and
Overtemperature Protection
• 2x3 DFN-8 and SOIC-8 Package Options
Applications
• High-Speed Driver Chipset Power
• Networking Backplane Cards
• Notebook Computers
• Network Interface Cards
• Palmtop Computers
• Video Graphics Adapters
• 2.5V to 1.XV Regulators
Description
The MCP1725 is a 500 mA Low Dropout (LDO) linear
regulator that provides high current and low output
voltages in a very small package. The MCP1725
comes in a fixed (or adjustable) output voltage version,
with an output voltage range of 0.8V to 5.0V. The
500 mA output current capability, combined with the
low output voltage capability, make the MCP1725 a
good choice for new sub-1.8V output voltage LDO
applications that have high current demands.
The MCP1725 is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the entire regulator
solution. Only 1 µF of output capacitance is needed to
stabilize the LDO.
Using CMOS construction, the quiescent current
consumed by the MCP1725 is typically less than
120 µA over the entire input voltage range, making it
attractive for portable computing applications that
demand high output current. When shut down, the
quiescent current is reduced to less than 0.1 µA.
The scaled-down output voltage is internally monitored
and a power good (PWRGD) output is provided when
the output is within 92% of regulation (typical). An
external capacitor can be used on the C
DELAY
pin to
adjust the delay from 200 µs to 300 ms.
The overtemperature and short circuit current-limiting
provide additional protection for the LDO during system
fault conditions.
Package Types
V
IN
V
IN
SHDN
GND
PWRGD
C
DELAY
Sense
V
OUT
V
IN
V
IN
SHDN
GND
PWRGD
C
DELAY
ADJ
V
OUT
Adjustable (SOIC-8)
Fixed (SOIC-8)
V
IN
V
IN
SHDN
GND
PWRGD
C
DELAY
Sense
V
OUT
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
Fixed (2x3 DFN)
V
IN
V
IN
SHDN
GND
PWRGD
C
DELAY
V
OUT
Adjustable (2x3 DFN)
ADJ
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Note:
DFN tab is at ground potential.
500 mA, Low Voltage, Low Quiescent Current LDO Regulator
MCP1725
DS22026B-page 2
© 2007 Microchip Technology Inc.
Typical Application
MCP1725 Adjustable Output Voltage
V
IN
SHDN
GND
PWRGD
C
DELAY
ADJ
V
OUT
1
2
3
4
5
6
7
8
1 µF
PWRGD
V
OUT
= 1.2V @ 500 mA
100 k
Ω
4.7 µF
V
IN
= 2.3V to 2.8V
On
Off
V
IN
20 k
Ω
40 k
Ω
R
1
R
2
C
1
C
2
R
3
1000 pF
C
3
MCP1725 Fixed Output Voltage
V
IN
SHDN
GND
PWRGD
C
DELAY
Sense
V
OUT
1
2
3
4
5
6
7
8
PWRGD
V
OUT
= 1.8V @ 500 mA
V
IN
= 2.3V to 2.8V
On
Off
V
IN
1 µF
100 k
Ω
4.7 µF
C
1
C
2
R
1
1000 pF
C
3
© 2007 Microchip Technology Inc.
DS22026B-page 3
MCP1725
Functional Block Diagram - Adjustable Output
EA
+
–
V
OUT
PMOS
R
f
C
f
I
SNS
Overtemperature
V
REF
Comp
92% of V
REF
T
DELAY
PWRGD
C
DELAY
V
IN
Driver w/limit
and SHDN
GND
Soft-Start
ADJ
Undervoltage
Lock Out
VIN
Reference
SHDN
SHDN
SHDN
Sensing
(UVLO)
MCP1725
DS22026B-page 4
© 2007 Microchip Technology Inc.
Functional Block Diagram - Fixed Output
EA
+
–
V
OUT
PMOS
R
f
C
f
I
SNS
Overtemperature
V
REF
Comp
92% of V
REF
T
DELAY
PWRGD
C
DELAY
V
IN
Driver w/limit
and SHDN
GND
Soft-Start
Sense
Undervoltage
Lock Out
VIN
Reference
SHDN
SHDN
SHDN
Sensing
(UVLO)
© 2007 Microchip Technology Inc.
DS22026B-page 5
MCP1725
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
IN
......................................................................... 6.5V
Maximum Voltage on Any Pin
........................................(GND – 0.3V) to (V
IN
+ 0.3)V
Maximum Power Dissipation............. Internally-Limited
(
Note 6)
Output Short Circuit Duration ..................... Continuous
Storage temperature .......................... -65°C to +150°C
Maximum Junction Temperature, T
J
................ +150°C
ESD protection on all pins (HBM/MM)
.. ≥ 2 kV; ≥ 200V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
(Note 1), V
R
= 1.8V for Adjustable Output,
I
OUT
= 1 mA, C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(
Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Operating Voltage
V
IN
2.3
6.0
V
Note 1
Input Quiescent Current
I
q
—
120
220
µA
I
L
= 0 mA, V
IN
=
Note 1,
V
OUT
= 0.8V to 5.0V
Input Quiescent Current for
SHDN Mode
I
SHDN
—
0.1
3
µA
SHDN = GND
Maximum Output Current
I
OUT
500
—
—
mA
V
IN
= 2.3V to 6.0V
V
R
= 0.8V to 5.0V,
Note 1
Line Regulation
ΔV
OUT
/
(V
OUT
x
ΔV
IN
)
—
±0.05
±
0.16
%/V
(Note 1)
≤ V
IN
≤ 6V
Load Regulation
ΔV
OUT
/V
OUT
-1.0
±0.5
1.0
%
I
OUT
= 1 mA to 500 mA,
(
Note 4)
Output Short Circuit Current
I
OUT_SC
—
1.2
—
A
R
LOAD
< 0.1
Ω, Peak Current
Adjust Pin Characteristics (Adjustable Output Only)
Adjust Pin Reference Voltage
V
ADJ
0.402
0.410
0.418
V
V
IN
= 2.3V to V
IN
= 6.0V,
I
OUT
= 1 mA
Adjust Pin Leakage Current
I
ADJ
-10
±0.01
+10
nA
V
IN
= 6.0V, V
ADJ
= 0V to 6V
Adjust Temperature Coefficient
TCV
OUT
—
40
—
ppm/°C
Note 3
Fixed-Output Characteristics (Fixed Output Only)
Voltage Regulation
V
OUT
V
R
- 2.5% V
R
±0.5%
V
R
+ 2.5%
V
Note 2
Note 1:
The minimum V
IN
must meet two conditions: V
IN
≥ 2.3V and V
IN
≥ V
OUT(MAX)
+ V
DROPOUT(MAX).
2:
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
*
((R
1
/R
2
)+1).
Figure 4-1
.
3:
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) *10
6
/ (V
R
*
ΔTemperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
OUT
= V
R
+ V
DROPOUT(MAX)
.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above +150°C can impact device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
MCP1725
DS22026B-page 6
© 2007 Microchip Technology Inc.
Dropout Characteristics
Dropout Voltage
V
IN
-V
OUT
—
210
350
mV
I
OUT
= 500 mA,
(Note 5)
V
IN(MIN)
= 2.3V
Power Good Characteristics
PWRGD Input Voltage Operat-
ing Range
V
PWRGD_VIN
1.0
—
6.0
V
T
A
= +25°C
1.2
—
6.0
T
A
= -40°C to +125°C
For V
IN
< 2.3V, I
SINK
= 100 µA
PWRGD Threshold Voltage
(Referenced to V
OUT
)
V
PWRGD_TH
—
—
—
%V
OUT
Falling Edge
89
92
95
V
OUT
< 2.5V Fixed, V
OUT
=
Adj.
90
92
94
V
OUT
>= 2.5V Fixed
PWRGD Threshold Hysteresis
V
PWRGD_HYS
1.0
2.0
3.0
%V
OUT
PWRGD Output Voltage Low
V
PWRGD_L
—
0.2
0.4
V
I
PWRGD
SINK
= 1.2 mA,
ADJ = 0V, SENSE = 0V
PWRGD Leakage
P
WRGD
_
LK
—
1
—
nA
V
PWRGD
= V
IN
= 6.0V
PWRGD Time Delay
T
PG
Rising Edge
R
PULLUP
= 10 k
Ω
I
CDELAY
= 140 nA (Typ)
—
200
—
µs
C
DELAY
= OPEN
10
30
55
ms
C
DELAY
= 0.01 µF
—
300
—
ms
C
DELAY
= 0.1 µF
Detect Threshold to PWRGD
Active Time Delay
T
VDET-PWRGD
—
200
—
µs
V
ADJ
or V
SENSE
=
V
PWRGD_TH
+ 20 mV to
V
PWRGD_TH
- 20 mV
Shutdown Input
Logic High Input
V
SHDN-HIGH
45
—
—
%V
IN
V
IN
= 2.3V to 6.0V
Logic Low Input
V
SHDN-LOW
—
—
15
%V
IN
V
IN
= 2.3V to 6.0V
SHDN Input Leakage Current
SHDN
ILK
-0.1
±0.001
+0.1
µA
V
IN
= 6V, SHDN =V
IN
,
SHDN = GND
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
(Note 1), V
R
= 1.8V for Adjustable Output,
I
OUT
= 1 mA, C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(
Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1:
The minimum V
IN
must meet two conditions: V
IN
≥ 2.3V and V
IN
≥ V
OUT(MAX)
+ V
DROPOUT(MAX).
2:
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
*
((R
1
/R
2
)+1).
Figure 4-1
.
3:
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) *10
6
/ (V
R
*
ΔTemperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
OUT
= V
R
+ V
DROPOUT(MAX)
.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above +150°C can impact device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
© 2007 Microchip Technology Inc.
DS22026B-page 7
MCP1725
TEMPERATURE SPECIFICATIONS
AC Performance
Output Delay From SHDN
T
OR
—
100
—
µs
SHDN = GND to V
IN
V
OUT
= GND to 95% V
R
Output Noise
e
N
—
2.0
—
µV/
√Hz I
OUT
= 200 mA, f = 1 kHz,
C
OUT
= 10 µF (X7R Ceramic),
V
OUT
= 2.5V
Power Supply Ripple Rejection
Ratio
PSRR
—
60
—
dB
f = 100 Hz, C
OUT
= 10 µF,
I
OUT
= 10 mA,
V
INAC
= 30 mV pk-pk,
C
IN
= 0 µF
Thermal Shutdown Temperature
T
SD
—
150
—
°C
I
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
Thermal Shutdown Hysteresis
ΔT
SD
—
10
—
°C
I
OUT
= 100 µA, V
OUT
= 1.8V,
V
IN
= 2.8V
Electrical Specifications: Unless otherwise indicated, all limits apply for V
IN
= 2.3V to 6.0V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Steady State
Maximum Junction Temperature
T
J
—
—
+150
°C
Transient
Storage Temperature Range
T
A
-65
—
+150
°C
Thermal Package Resistances
Thermal Resistance, 8LD 2x3 DFN
θ
JA
—
76
—
°C/W
4-Layer JC51-7
Standard Board with
vias
θ
JC
—
26
—
°C/W
Thermal Resistance, 8LD SOIC
θ
JA
—
163
—
°C/W
4-Layer JC51-7
Standard Board
θ
JC
—
38.8
—
°C/W
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, V
IN
= V
OUT(MAX)
+ V
DROPOUT(MAX)
(Note 1), V
R
= 1.8V for Adjustable Output,
I
OUT
= 1 mA, C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface type applies for junction temperatures, T
J
(
Note 7) of -40°C to +125°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note 1:
The minimum V
IN
must meet two conditions: V
IN
≥ 2.3V and V
IN
≥ V
OUT(MAX)
+ V
DROPOUT(MAX).
2:
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
*
((R
1
/R
2
)+1).
Figure 4-1
.
3:
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) *10
6
/ (V
R
*
ΔTemperature). V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
4:
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
OUT
= V
R
+ V
DROPOUT(MAX)
.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained
junction temperatures above +150°C can impact device reliability.
7:
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
MCP1725
DS22026B-page 8
© 2007 Microchip Technology Inc.
2.0
TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V or V
IN
= 2.3V (whichever is greater), I
OUT
= 1 mA, C
IN
= C
OUT
=
4.7 µF Ceramic (X7R), SHDN = V
IN
, C
DELAY
= Open, Fixed Output Version, and T
A
= +25°C.
Note: Junction Temperature (T
J
) is approximated by soaking the device under test to an ambient temperature equal to
the desired junction temperature. The test time is small enough such that the rise in Junction Temperature over the
Ambient temperature is not significant.
FIGURE 2-1:
Quiescent Current vs. Input
Voltage (1.8V Adjustable).
FIGURE 2-2:
Ground Current vs. Load
Current (1.2V Adjustable).
FIGURE 2-3:
Quiescent Current vs.
Junction Temperature (1.8V Adjustable).
FIGURE 2-4:
Line Regulation vs.
Temperature (1.8V Adjustable).
FIGURE 2-5:
Load Regulation vs.
Temperature (Adjustable Version).
FIGURE 2-6:
Adjust Pin Voltage vs.
Temperature.
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and
are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed.
In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power
supply range) and therefore outside the warranted range.
80
90
100
110
120
130
140
150
2
3
4
5
6
Input Voltage (V)
Qu
iesc
en
t C
u
rr
en
t (
µ
A)
-45°C
0°C
+25°C
+90°C
+130°C
I
OUT
= 0 mA
120
130
140
150
160
170
180
190
200
210
0
100
200
300
400
500
Load Current (mA)
G
rou
nd
C
u
rr
ent
(
µ
A
)
V
IN
= 5.0V
V
IN
= 3.3V
V
IN
= 2.5V
V
OUT
= 1.2V Adj
80
90
100
110
120
130
140
150
-45
-20
5
30
55
80
105
130
Temperature (°C)
Qu
ie
sce
nt
Cu
rr
en
t
(µ
A)
V
IN
= 5.0V
V
IN
= 2.3V
V
IN
= 3.3V
V
IN
= 6.0V
I
OUT
= 0 mA
0.00
0.02
0.04
0.06
0.08
0.10
0.12
-45
-20
5
30
55
80
105
130
Temperature (°C)
Li
n
e
Re
gu
la
ti
o
n
(%/
V
)
I
OUT
= 1 mA
I
OUT
= 50 mA
I
OUT
= 250 mA
I
OUT
= 100 mA
I
OUT
= 500 mA
V
IN
= 2.3V to 6.0V
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
-45
-20
5
30
55
80
105
130
Temperature (°C)
L
o
ad
Re
gula
ti
o
n
(%
)
V
OUT
= 5V
V
OUT
= 3.3V
V
OUT
= 1.8V
V
OUT
= 0.8V
I
OUT
= 1.0 mA to 500 mA
0.408
0.409
0.410
0.411
0.412
-45
-20
5
30
55
80
105
130
Temperature (°C)
A
d
ju
st
P
in
Vo
lta
g
e (V
)
V
IN
= 5.0V
V
IN
= 6.0V
V
IN
= 2.3V, 3.0V, 4.0V
I
OUT
= 1 mA
© 2007 Microchip Technology Inc.
DS22026B-page 9
MCP1725
Note: Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V or V
IN
= 2.3V (whichever is greater), I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF Ceramic (X7R), SHDN = V
IN
, C
DELAY
= Open, Fixed Output Version, and T
A
= +25°C
.
FIGURE 2-7:
Dropout Voltage vs. Load
Current (Adjustable Version).
FIGURE 2-8:
Dropout Voltage vs.
Temperature (Adjustable Version).
FIGURE 2-9:
Power Good (PWRGD)
Time Delay vs. Temperature (Adjustable
Version).
FIGURE 2-10:
Quiescent Current vs. Input
Voltage (0.8V Fixed).
FIGURE 2-11:
Quiescent Current vs. Input
Voltage (2.5V Fixed).
FIGURE 2-12:
Ground Current vs. Load
Current.
0.00
0.05
0.10
0.15
0.20
0.25
0
100
200
300
400
500
Load Current (mA)
D
rop
out
Vo
lt
ag
e (
V
)
V
OUT
= 2.5V
V
OUT
= 5.0V
0.16
0.18
0.20
0.22
0.24
0.26
0.28
-45
-20
5
30
55
80
105
130
Temperature (°C)
Dropo
ut Vo
lt
ag
e (V)
V
OUT
= 2.5V
V
OUT
= 5.0V
V
OUT
= 3.3V
I
OUT
= 500 mA
25
26
27
28
29
30
31
32
33
34
35
-45
-20
5
30
55
80
105
130
Temperature (°C)
Po
w
er
Good Time De
la
y
(ms
)
V
IN
= 2.3V
V
IN
= 3.0V
V
IN
= 5.0V
C
DELAY
= 0.01 µF
I
OUT
= 0 mA
80
90
100
110
120
130
140
150
2
3
4
5
6
Input Voltage (V)
Qui
e
sc
en
t C
u
rre
nt
(µA
)
-45°C
+130°C
+90°C
+25°C
0°C
I
OUT
= 0 mA
90
100
110
120
130
140
150
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Qu
iesc
en
t C
u
rr
en
t (
µ
A)
-45°C
0°C
+25°C +90°C
+135°C
I
OUT
= 0 mA
110
130
150
170
190
210
0
100
200
300
400
500
Load Current (mA)
Gr
ou
nd
Cu
rren
t (µA)
V
OUT
= 5.0V
V
OUT
= 2.5V
MCP1725
DS22026B-page 10
© 2007 Microchip Technology Inc.
Note: Unless otherwise indicated, V
IN
= V
OUT
+ 0.5V or V
IN
= 2.3V (whichever is greater), I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF Ceramic (X7R), SHDN = V
IN
, C
DELAY
= Open, Fixed Output Version, and T
A
= +25°C
.
FIGURE 2-13:
Quiescent Current vs.
Junction Temperature.
FIGURE 2-14:
I
SHDN
vs. Temperature.
FIGURE 2-15:
Line Regulation vs.
Temperature (0.8V Fixed).
FIGURE 2-16:
Line Regulation vs.
Temperature (2.5V Fixed).
FIGURE 2-17:
Load Regulation vs.
Temperature (V
OUT
< 2.5V Fixed).
FIGURE 2-18:
Load Regulation vs.
Temperature (V
OUT
≥
2.5V Fixed).
80
90
100
110
120
130
140
-45
-20
5
30
55
80
105
130
Junction Temperature (°C)
Qu
ie
s
ce
n
t C
u
rr
en
t (µ
A
)
V
OUT
= 0.8V
V
OUT
= 2.5V
I
OUT
= 0 mA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-45
-20
5
30
55
80
105
130
Temperature (°C)
I
SH
D
N
(µ
A
)
V
IN
= 2.3V
V
IN
= 6.0V
V
IN
= 3.3V
V
OUT
= 0.8V
0.00
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
-45
-20
5
30
55
80
105
130
Temperature (°C)
Li
n
e
Re
gu
la
ti
o
n
(%/
V
)
I
OUT
= 1 mA
I
OUT
= 500 mA
I
OUT
= 250 mA
I
OUT
= 100 mA
I
OUT
= 50 mA
V
IN
= 2.3V to 6.0V
V
OUT
= 0.8V
0.010
0.015
0.020
0.025
0.030
0.035
0.040
0.045
0.050
-45
-20
5
30
55
80
105
130
Temperature (°C)
Line
R
egulat
io
n
(%/V)
I
OUT
= 1 mA
I
OUT
= 250 mA
I
OUT
= 500 mA
I
OUT
= 100 mA
I
OUT
= 50 mA
V
OUT
= 2.5V
V
IN
= 3.0V to 6.0V
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.20
-45
-20
5
30
55
80
105
130
Temperature (°C)
Lo
ad
R
e
g
u
la
tion
(%)
V
OUT
= 1.2V
I
OUT
= 1.0 mA to 500 mA
V
OUT
= 0.8V
-0.35
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
-45
-20
5
30
55
80
105
130
Temperature (°C)
Lo
ad
Re
g
u
la
ti
on
(
%
)
V
OUT
= 2.5V
V
OUT
= 5.0V
I
OUT
= 1.0 mA to 500 mA