MAX500 Datasheet

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_______________General Description

The MAX500 is a quad, 8-bit, voltage-output digital-to-
analog converter (DAC) with a cascadable serial inter-
face. The IC includes four output buffer amplifiers and
input logic for an easy-to-use, two- or three-wire serial
interface. In a system with several MAX500s, only one
serial data line is required to load all the DACs by cas-
cading them. The MAX500 contains double-buffered
logic and a 10-bit shift register that allows all four DACs
to be updated simultaneously using one control signal.
There are three reference inputs so the range of two of
the DACs can be independently set while the other two
DACs track each other. 

The MAX500 achieves 8-bit performance over the full
operating temperature range without external trimming. 

________________________Applications

Minimum Component Count Analog Systems

Digital Offset/Gain Adjustment

Industrial Process Control

Arbitrary Function Generators

Automatic Test Equipment

____________________________Features

Buffered Voltage Outputs

Double-Buffered Digital Inputs

Microprocessor and TTL/CMOS Compatible

Requires No External Adjustments

Two- or Three-Wire Cascadable Serial Interface

16-Pin DIP/SO Package and 20-Pin LCC

Operates from Single or Dual Supplies

______________Ordering Information

MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

________________________________________________________________

Maxim Integrated Products

1

TOP VIEW

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

V

OUT

C

 

V

OUT

D

V

DD

V

REF

C

V

REF

A/B

V

SS

V

OUT

A

V

OUT

B

MAX500

V

REF

D

SRO

SCL

LOAD

SDA

LDAC

DGND

AGND

DIP/SO

_________________Pin Configurations

MAX500

V

OUT

A

DAC A

DAC B

DAC C

DAC D

V

REF

C

V

REF

A/B

DAC

REG A

INPUT

REG A

DAC

REG B

INPUT

REG B

DAC

REG C

INPUT
REG C

DAC

REG D

INPUT
REG D

10/11-

BIT

SHIFT

REGISTER

CONTROL

LOGIC

LOAD

SCL

SDA

V

OUT

B

V

OUT

C

V

OUT

D

SRO

V

DD

DGND V

SS

AGND

V

REF

D

DATA BUS

LDAC

________________Functional Diagram

19-1016; Rev 2; 2/96

PART

MAX500ACPE

MAX500BCPE

MAX500ACWE

0°C to +70°C

0°C to +70°C

0°C to +70°C

TEMP. RANGE PIN-PACKAGE

16 Plastic DIP

16 Plastic DIP

16 Wide SO

MAX500BCWE

0°C to +70°C

16 Wide SO

MAX500BC/D

0°C to +70°C

Dice*

MAX500AEPE -40°C to +85°C

16 Plastic DIP

MAX500BEPE -40°C to +85°C

16 Plastic DIP

MAX500AEWE -40°C to +85°C

16 Wide SO

MAX500BEWE -40°C to +85°C

16 Wide SO

MAX500AEJE -40°C to +85°C

16 CERDIP

MAX500BEJE -40°C to +85°C

16 CERDIP

MAX500AMJE -55°C to +125°C

16 CERDIP

MAX500BMJE -55°C to +125°C

16 CERDIP

ERROR (LSB)

±1

±2

±1

±2

±2

±1

±2

±1

±2

±1

±2

±1

±2

*Contact factory for dice specifications.

Pin Configurations continued on last page.

MAX500AMLP -55°C to +125°C

20 LCC

±1

MAX500BMLP -55°C to +125°C

20 LCC

±2

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MAX500

CMOS, Quad, Serial-Interface 
8-Bit DAC

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS—Dual Supplies

(V

DD

= +11.4V to +16.5V, V

SS

= -5V ±10%, AGND = DGND = 0V, V

REF

= +2V to (V

DD

- 4V), T

A

= T

MIN

to T

MAX

, unless otherwise noted.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

Power Requirements

V

DD

to AGND...........................................................-0.3V, +17V

V

DD

to DGND ..........................................................-0.3V, +17V

V

SS

to DGND ..................................................-7V, (V

DD

+ 0.3V)

V

DD

to V

SS

...............................................................-0.3V, +24V

Digital Input Voltage to DGND ....................-0.3V, (V

DD

+ 0.3V)

V

REF

to AGND .............................................-0.3V, (V

DD

+ 0.3V)

V

OUT

to AGND (Note 1)...............................-0.3V, (V

DD

+ 0.3V)

Power Dissipation (T

A

= +70°C)

Plastic DIP (derate 10.53mW/°C above +70°C) ............842mW

Wide SO (derate 9.52mW/°C above +70°C)................762mW
CERDIP (derate 10.00mW/°C above +70°C) ...............800mW
LCC (derate 9.09mW/°C above +70°C).......................727mW

Operating Temperature Ranges

MAX500_C_ _ ....................................................0°C to + 70°C
MAX500_E_ _...................................................-40°C to +85°C
MAX500_M_ _ ................................................-55°C to +125°C

Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C

T

A

= +25°C (Notes 2, 3)

T

A

= +25°C, code dependent (Note 2) 

V

REF

C, V

REF

D

V

REF

= 10V

MAX500A

T

A

= T

MIN

to T

MAX

Guaranteed monotonic

V

DD

= 15V ±5%,

V

REF

= 10V

MAX500A

T

A

= +25°C

CONDITIONS

dB

-60

Channel-to-Channel Isolation

pF

100

Reference Input Capacitance

k

11

Reference Input Resistance

V

2

V

DD

- 4

Reference Input Range

µV/°C

±30

Zero-Code Tempco

mV

±20

Zero-Code Error

±15

Bits

8

Resolution

ppm/°C

±5

Full-Scale Tempco

LSB

±1/2

Full-Scale Error

LSB

±1

Differential Nonlinearity

LSB

±1

Total Unadjusted Error

LSB

±1/2

Relative Accuracy

UNITS

MIN

TYP

MAX

SYMBOL

PARAMETER

AC Feedthrough

T

A

= +25°C (Notes 2, 3) 

-70

dB

Digital Input High Voltage

V

IH

2.4

5.5

Digital Input Low Voltage

V

IL

0.8

V

Digital Output High Voltage

V

OH

I

OUT

= -1mA, SRO only

V

DD

- 1

V

Digital Output Low Voltage

V

OL

I

OUT

= 1mA, SRO only

0.4

V

5.5

MAX500A

MAX500A

MAX500A

±20

±30

±1

±1

±2

V

STATIC PERFORMANCE

REFERENCE INPUT

DIGITAL INPUTS

MAX500B

MAX500B

MAX500B

MAX500B

MAX500B

Note 1:

The outputs may be shorted to AGND, provided that the power dissipation of the package is not exceeded.
Typical short-circuit current to AGND is 25mA

V

REF

A/B

±1

µA

Digital Input Capacitance

T

A

= +25°C (Note 2) 

8

pF

Excluding 

LOAD

30

(Note 4)

Digital Input Leakage Current

LOAD = 0V

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MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

_______________________________________________________________________________________

3

ELECTRICAL CHARACTERISTICS—Dual Supplies (continued)

(V

DD

= +11.4V to +16.5V, V

SS

= -5V ±10%, AGND = DGND = 0V, V

REF

= +2V to (V

DD

- 4V), T

A

= T

MIN

to T

MAX

, unless otherwise noted.)

Outputs unloaded

V

OUT

= 10V

Outputs unloaded

(Note 5)

(Note 5)

TA = +25°C (Note 2)

To ±1/2LSB, V

REF

= 10V, V

DD

= +15V,

2k

in parallel with 100pF load (Note 2)

For specified performance

CONDITIONS

ns

150

t

LDS

LOAD Delay from SCL

ns

150

t

LDW

LOAD Pulse Width

ns

350

t

2

SCL Low Time

ns

350

t

1

SCL High Time

ns

150

t

S1

SDA Valid to SCL Setup

ns

150

t

S1

SDA Valid to SCL Setup

mA

-10

I

SS

Negative Supply Current

-9

mA

12

I

DD

Positive Supply Current

10

V

11.4

16.5

V

DD

Positive Supply Voltage

k

2

Output Load Resistance

nV-s

50

Digital Crosstalk

nV-s

50

Digital Feedthrough

3

8

Voltage Output Slew Rate

µs

2.5

4.5

V

OUT

Settling Time

UNITS

MIN

TYP

MAX

SYMBOL

PARAMETER

LDAC Pulse Width

t

LDAC

150

ns

SRO Output Delay

t

D1

C

LOAD

= 50pF

150

ns

SCL High Time

t

1

350

ns

SDA Valid to SCL Hold

t

H

0

ns

LDAC Pulse Width

t

LDAC

150

ns

SCL Valid to SDA Setup

t

S1

Start condition

150

ns

SDA Valid to SCL Setup

t

S2

Stop condition

100

ns

T

A

= +25°C

T

A

= +25°C

V/µs

SDA Valid to Rising SCL

t

S3

125

ns

SRO Output Delay

t

D1

C

LOAD

= 50pF

150

ns

SCL High Time

t

1

350

ns

SCL Fall Time

(Note 7)

50

µs

SCL Rise Time

(Note 7)

50

µs

SCL Low Time

t

2

350

ns

T

A

= T

MIN

to T

MAX

T

A

= T

MIN

to T

MAX

For specified performance

V

11.4

16.5

V

DD

Positive Supply Voltage

(Note 7)

µs

50

SCL Rise Time

(Note 7)

µs

50

SCL Fall Time

ns

0

t

H

SDA Valid to SCL Hold

DYNAMIC PERFORMANCE

POWER SUPPLIES

SWITCHING CHARACTERISTICS (

T

A

= +25°C, Note 6)

3-Wire Mode

2-Wire Mode

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__________________________________________Typical Operating Characteristics

MAX500

CMOS, Quad, Serial-Interface 
8-Bit DAC

4

_______________________________________________________________________________________

ELECTRICAL CHARACTERISTICS—Single Supply

(V

DD

= +15V ±5%, V

SS

= AGND = DGND = 0V, V

REF

= 10V, T

A

= T

MIN

to T

MAX

, unless otherwise noted.)

Outputs unloaded

For specified performance

Guaranteed monotonic

T

A

= T

MIN

to T

MAX

V

DD

= 15V ±5%,

V

REF

= 10V

T

A

= +25°C

CONDITIONS

mA

12

I

DD

Positive Supply Current

10

V

14.25

15.75

V

DD

Positive Supply Voltage

µV/°C

±30

Zero-Code Tempco

mV

±30

Zero-Code Error

±20

±20

±15

Bits

8

Resolution

±1/2

LSB

±1

Differential Nonlinearity

LSB

±1

Relative Accuracy

±1

LSB

±2

Total Unadjusted Error

±1/2

UNITS

MIN

TYP

MAX

SYMBOL

PARAMETER

Note 2:

Guaranteed by design. Not production tested.

Note 3:

T

A

= +25°C, V

REF

= 10kHz, 10V peak-to-peak sine wave.

Note 4:

LOAD has a weak internal pull-up resistor to V

DD

.

Note 5:

DAC switched from all 1s to all 0s, and all 0s to all 1s code.

Note 6:

Sample tested at +25°C to ensure compliance.

Note 7:

Slow rise and fall times are allowed on the digital inputs to facilitate the use of opto-couplers. Only timing for SCL is given
because the other digital inputs should be stable when SCL transitions.

MAX500A

MAX500A

T

A

= +25°C

MAX500A

MAX500B

MAX500A

V

REF

= 10V

ppm/°C

±5

Full-Scale Tempco

LSB

±1

Full-Scale Error

MAX500A

MAX500B

MAX500B

MAX500B

MAX500B

T

A

= T

MIN

to T

MAX

STATIC PERFORMANCE

REFERENCE INPUT

All specifications are the same as for dual supplies.

DIGITAL INPUTS

All specifications are the same as for dual supplies.

DYNAMIC PERFORMANCE

All specifications are the same as for dual supplies.

POWER SUPPLIES

SWITCHING CHARACTERISTICS

All specifications are the same as for dual supplies.

1.0

2

0

0.5

MAX500-04

-0.5

4

0

6

8

10

12

14

V

REF 

(V)

-1.0

RELATIVE ACCURACY (LSB)

RELATIVE ACCURACY vs. REFERENCE VOLTAGE

T

A

 = +25°C, V

SS

 = -5V

V

DD

 = 15V

V

DD

 = 12V

1.0

2

0

0.5

MAX500-05

-0.5

4

0

6

8

10

12

14

V

REF 

(V)

-1.0

DIFFERENTIAL NONLINEARITY (LSB)

DIFFERENTIAL NONLINEARITY vs. REFERENCE VOLTAGE

V

DD

 = 15V

T

A

 = +25°C, V

SS

 = -5V

V

DD

 = 12V

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MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

_______________________________________________________________________________________

5

12

0

0

OUTPUT SINK CURRENT

vs. OUTPUT VOLTAGE

2

10

MAX500-01

V

OUT

 (V)

I

SINK

 (mA)

8

6

4

2

6

10

8

4

14

16

V

SS

 = -5V

R

O

 

 200

V

SS

 = 0V

10

-6

SUPPLY CURRENT

vs. TEMPERATURE

-4

6

MAX500-02

TEMPERATURE (°C)

SUPPLY CURRENT (mA)

0

-2

4

2

8

12

-55

125

25

-25

0

75

50

100

I

DD

I

SS

1.5

-2.0

ZERO-CODE ERROR
vs. TEMPERATURE

-1.5

1.0

MAX500-03

TEMPERATURE (°C)

ZERO-CODE ERROR (mV)

0.0

-1.0

0.5

-0.5

2.0

-55

125

25

-25

0

75

50

100

V

SS

 = -5V

V

OUT

A

V

OUT

B

V

OUT

C

V

OUT

D

____________________________Typical Operating Characteristics (continued)

_______________Detailed Description

The MAX500 has four matched voltage-output digital-to-
analog converters (DACs). The DACs are “inverted”
R-2R ladder networks which convert 8 digital bits into
equivalent analog output voltages in proportion to the
applied reference voltage(s). Two DACs in the MAX500
have a separate reference input while the other two
DACs share one reference input. A simplified circuit
diagram of one of the four DACs is provided in Figure 1. 

V

REF

Input

The voltage at the V

REF

pins (pins 4, 12, and 13) sets

the full-scale output of the DAC. The input impedance

of the V

REF

inputs is code dependent. The lowest

value, approximately 11k

(5.5k

for V

REF

A/B), occurs

when the input code is 01010101. The maximum value
of infinity occurs when the input code is 00000000.
Because the input resistance at V

REF

is code depen-

dent, the DAC’s reference sources should have an out-
put impedance of no more than 20

(no more than

10

for V

REF

A/B). The input capacitance at V

REF

is

also code dependent and typically varies from 15pF to
35pF (30pF to 70pF for V

REF

A/B). V

OUT

A, V

OUT

B,

V

OUT

C, and V

OUT

D can be represented by a digitally

programmable voltage source as: 

V

OUT

= N

b

x V

REF

/ 256

where N

b

is the numeric value of the DAC’s binary

input code.

Output Buffer Amplifiers

All voltage outputs are internally buffered by precision
unity-gain followers, which slew at greater than 3V/µs.
When driving 2k

in parallel with 100pF with a full-scale

transition (0V to +10V or +10V to 0V), the output settles
to ±1/2LSB in less than 4µs. The buffers will also drive
2k

in parallel with 500pF to 10V levels without oscilla-

tion. Typical dynamic response and settling perfor-
mance of the MAX500 is shown in Figures 2 and 3.

A simplified circuit diagram of an output buffer is
shown in Figure 4. Input common-mode range to
AGND is provided by a PMOS input structure. The out-
put circuitry incorporates a pull-down circuit to actively
drive V

OUT

to within +15mV of the negative supply

(V

SS

). The buffer circuitry allows each DAC output to

R

R

R

2R

2R

2R

2R

2R

V

REF

AGND

V

OUT

DB0

DB5

DB6

DB7

DB0

DB5

DB6

DB7

Figure 1.  Simplified DAC Circuit Diagram

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MAX500

sink, as well as source up to 5mA. This is especially
important in single-supply applications, where V

SS

is

connected to AGND, so that the zero error is kept at or
under 1/2LSB (V

REF

= +10V). A plot of the Output Sink

Current vs. Output Voltage is shown in the 

Typical

Operating Characteristics section.

Digital Inputs

and Interface Logic

The digital inputs are compatible with both TTL and 5V
CMOS logic; however, the power-supply current (I

DD

)

is somewhat dependent on the input logic level. Supply
current is specified for TTL input levels (worst case) but
is reduced (by about 150µA) when the logic inputs are
driven near DGND or 4V above DGND.

Do not drive the digital inputs directly from CMOS logic
running from a power supply exceeding 5V. When driv-

ing SCL through an opto-isolator, use a Schmitt trigger
to ensure fast SCL rise and fall times.

The MAX500 allows the user to choose between a
3-wire serial interface and a 2-wire serial interface.
The choice between the 2-wire and the 3-wire inter-
face is set by the 

LOAD signal. If the LOAD is allowed

to float (it has a weak internal pull-up resistor to V

DD

),

the 2-wire interface is selected. If the 

LOAD signal is

kept to a TTL-logic high level, the 3-wire interface
is selected.

3-Wire Interface

The 3-wire interface uses the classic Serial Data (SDA),
Serial Clock (SCL), and 

LOAD signals that are used

in standard shift registers. The data is clocked in on
the falling edge of SCL until all 10 bits (8 data bits and
2 address bits) are entered into the shift register.

CMOS, Quad, Serial-Interface 
8-Bit DAC

6

_______________________________________________________________________________________

INPUT

(5V/div)

OUTPUT

(20mV/div)

DYNAMIC RESPONSE

(V

SS

 = -5V or 0V) 

2

µ

s/div

LDAC
5V/div

OUTPUT
5V/div

V

SS

V

DD

PMOS

(+)

FROM

INVERTED

DAC

OUTPUT

INPUTS

C

C

(-)

NPN

EMITTER

FOLLOWER

PULL-UP

V

OUT

NMOS

ACTIVE

PULL-DOWN

CIRCUIT

Figure 2.  Positive and Negative Settling Times

Figure 3.  Dynamic Response

Figure 4.  Simplified Output Buffer Circuit

POSITIVE STEP 

(V

SS

 = -5V or 0V)

1

µ

s/div

LDAC
5V/div

OUTPUT
100mV/div

NEGATIVE STEP 

(V

SS

 = -5V or 0V)

1

µ

s/div

LDAC
5V/div

OUTPUT
100mV/div

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MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

_______________________________________________________________________________________

7

SCL

LOAD

LDAC

t

LDS

t

LDW

t

LDS

t

LDAC

SCL

SDA

SRO

t

2

t

1

t

S1

t

H

t

D1

SCL

SDA

LOAD

LDAC

SRO

(SERIAL OUTPUT)

A1

A0

D7

MSB

D6

D5

D4

D3

D2

D1

D0

LSB

A1

A0

D7

MSB

D6

D5

D4

D3

D2

D1

D0

LSB

SDA

LDAC

SCL

SDA

SRO

SCL

SDA

LDAC

SRO

(SERIAL OUTPUT)

SCL

t

2

t

1

t

S1

t

S3

t

D1

t

D1

t

S2

t

LDS

t

LDAC

Figure 5.  3-Wire Mode

Figure 6.  2-Wire Mode

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MAX500

A low level on 

LOAD line initiates the transfer of data

from the shift register to the addressed input register.
The data can stay in this register until all four of the
input registers are updated. Then all of the DAC regis-
ters can be simultaneously updated using the 

LDAC

(load DAC) signal. When 

LDAC is low, the input regis-

ter’s data is loaded into the DAC registers (see Figure 5
for timing diagram). This mode is cascadable by con-
necting Serial Output (SRO) to the second chip’s SDA
pin. The delay of the SRO pin from SCL does not cause
setup/hold time violations, no matter how many
MAX500s are cascaded. Restrict the voltage at 

LDAC

and 

LOAD to +5.5V for a logic high.

2-Wire Interface

The 2-wire interface uses SDA and SCL only. 

LOAD

must be floating or tied to V

DD

. Each data frame (8 data

bits and 2 address bits) is synchronized by a timing
relationship between SDA and SCL (see Figure 6 for
the timing diagram). Both SDA and SCL should normal-
ly be high when inactive. A falling edge of SDA (while
SCL is high) followed by a falling edge of SCL (while
SDA is low) is the start condition. This always loads a 0
into the first bit of the shift register. The shift register is
extended to 11 bits so this “data” will not affect the
input register information. The timing now follows the 3-
wire interface, except the SDA line is not allowed to
change when SCL is high (this prevents the MAX500
from retriggering its start condition). After the last data
bit is entered, the SDA line should go low (while the
SCL line is low), then the SCL line should rise followed
by the SDA line rising. This is defined as the stop con-
dition, or end of frame.

Cascading the 2-wire interface can be done, but the
user must be careful of both timing and formatting.
Timing must take into account the intrinsic delay of the
SRO pin from the internally generated start/stop condi-
tions. The t

S2

value should be increased by n times t

D1

(where n = number of cascaded MAX500s). The t

LDS

value should also be increased by n times t

D1

. No other

timing parameters need to be modified. A more serious
concern is one of formatting. Generally, since each
frame has a start/stop condition, each chip that has
data cascaded through it will accept that data as if it
were its own data. Therefore, to circumvent this limita-
tion, the user should not generate a stop bit until all
DACs have been loaded. For example, if there are
three MAX500s cascaded in the 2-wire mode, the data
transfer should begin with a start condition, followed by
10 data bits, a zero bit, 10 data bits, a zero bit, 10 data
bits, and then a stop condition. This will prevent each
MAX500 from decoding the middle data for itself.

The data is entered into the shift register in the follow-
ing order:

A1  A0  D7  D6  D5  D4  D3  D2  D1  D0

(First)    (MSB)                                       (Last)

where address bits A1 and A0 select which DAC regis-
ter receives data from the internal shift register. Table 1
lists the channel addresses. D7 (MSB) through D0 is
the data byte.

Since

LDAC is asynchronous with respect to SCL, SDA,

and 

LOAD,  care must be taken to assure that incorrect

data is not latched through to the DAC registers. If the
3-wire serial interface is used,

LDAC can be either tied

low permanently or tied to 

LOAD as long as t

LDS

is

always maintained. However, if the 2-wire interface is
used, 

LDAC should not fall before the stop condition is

internally detected. (This is the reason for the t

LDS

delay of 

LDAC after the last rising edge of SDA.)

CMOS, Quad, Serial-Interface 
8-Bit DAC

8

_______________________________________________________________________________________

A1

A0

SELECTED INPUT REGISTER

L

L

DAC A Input Register

L

H

DAC B Input Register

H

L

DAC C Input Register

H

H

DAC D Input Register

SCL

SDA

LOAD LDAC

FUNCTION

F

Data

V

DD

H

Latching data into 
shift register (2W)

H

Data

V

DD

H

Data should not be 
changing (2W)

L

X

V

DD

H

Data is allowed to 
change (2W)

F

Data

M

H

Latching data into 
shift register (3W)

H

X

M

H

Data is allowed to 
change (3W)

L

X

M

H

Data is allowed to 
change (3W)

H

X

L

H

Loads input register 
from shift register (3W)

H

X

L

L

DAC register reflects 
data held in their respective
input registers

Notes:

H = Logic High

2W = 2-Wire

L = Logic Low

3W = 3-Wire

M = TTL Logic High

F = Falling Edge

X = Don’t Care

Table 1. DAC Addressing

Table 2. Logic Input Truth Table 

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background image

The SRO output swings from V

DD

to DGND. Cascading

to other MAX500s poses no problem. If SRO is used to
drive a TTL-compatible input, use a clamp diode
between TTL +5V and V

DD

and the current-limiting

resistor to prevent potential latchup problems with
the 5V supply.

Table 2 shows the truth table for SDA, SCL, 

LOAD, and

LDAC operation. Figures 5 and 6 show the timing dia-
grams for the MAX500.

__________Applications Information

Power-Supply and Reference

Operating Ranges

The MAX500 is fully specified to operate with V

DD

between +12V ±5% and +15V ±10% (+11.4V to
+16.5V), and with V

SS

from 0V to -5.5V. 8-bit perfor-

mance is also guaranteed for single-supply operation
(V

SS

= 0V), however, zero-code error is reduced when

V

SS

is -5V (see 

Output Buffer Amplifiers section).

For an adequate DAC and buffer operating range, the
V

REF

voltage must always be at least 4V below V

DD

.

The MAX500 is specified to operate with a reference
input range of +2V to V

DD

- 4V.

Ground Management

Digital or AC transient signals between AGND and
DGND will create noise at the analog outputs. It is rec-
ommended that AGND and DGND be tied together at
the DAC and that this point be tied to the highest quali-
ty ground available. If separate ground buses are used,
then two clamp diodes (1N914 or equivalent) should be
connected between AGND and DGND to keep the two

ground buses within one diode drop of each other. To
avoid parasitic device turn-on, AGND must not be
allowed to be more negative than DGND. DGND should
be used as supply ground for bypassing purposes.

MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

_______________________________________________________________________________________

9

Figure 7.  Suggested MAX500 PC Board Layout for
Minimizing Crosstalk

Figure 8.  MAX500 Unipolar Output Circuit

COMPONENT SIDE (TOP VIEW)

V

OUT

C

V

OUT

D

V

DD

V

REF

C

V

REF

D

SYSTEM GND

V

OUT

B

V

OUT

A

V

SS

V

REF

A/B

AGND

DGND

V

REF

D

DAC A

DAC B

DAC C

DAC D

V

REF

C

V

REF

A/B

MAX500

V

OUT

A

V

OUT

B

V

OUT

C

V

OUT

D

DIGITAL

INPUTS

NOT

SHOWN

REFERENCE INPUTS

2

1

16

15

V

DD

+15V

13

12

4

14

3

-5V (OR GND)

5

6

V

SS

AGND

DGND

V

REF

DAC
OUTPUT
FROM MAX500

R1

R2

+15V

-15V

R1 = R2 = 10k

 ±0.1%

NOTE: V

REF

 IS THE REFERENCE INPUT FOR THE MAX500

V

OUT

Figure 9.  Bipolar Output Circuit

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background image

MAX500

Careful PC board ground layout techniques should be
used to minimize crosstalk between DAC outputs, the
reference input(s), and the digital inputs. This is partic-
ularly important if the reference is driven from an AC
source. Figure 7 shows suggested PC board layouts for
minimizing crosstalk.

Unipolar Output

In unipolar operation, the output voltages and the refer-
ence input(s) are the same polarity. The unipolar circuit
configuration is shown in Figure 8 for the MAX500. The
device can be operated from a single supply with a
slight increase in zero error (see 

Output Buffer

Amplifiers section). To avoid parasitic device turn-on,
the voltage at V

REF

must always be positive with

respect to AGND. The unipolar code table is given in
Table 3.

Bipolar Output

Each DAC output may be configured for bipolar opera-
tion using the circuit in Figure 9. One op amp and two
resistors are required per channel. With R1 = R2:

V

OUT

= V

REF

(2D

A

- 1)

where D

A

is a fractional representation of the digital

word in Register A.

Table 4 shows the digital code versus output voltage
for the circuit in Figure 9.

Offsetting AGND

AGND can be biased above DGND to provide an arbi-
trary nonzero output voltage for a “zero” input code. This
is shown in Figure 10. The output voltage at V

OUT

A is:

V

OUT

A = V

BIAS

+ D

A

V

IN

where D

A

is a fractional representation of the digital

input word. Since AGND is common to all four DACs,
all outputs will be offset by V

BIAS

in the same manner.

Since AGND current is a function of the four DAC
codes, it should be driven by a low-impedance source.
V

BIAS

must be positive.

CMOS, Quad, Serial-Interface 
8-Bit DAC

10

______________________________________________________________________________________

DAC A

MAX500

4

14

AGND

2

V

OUT

A

DGND

V

SS

V

REF

A/B

V

DD

3

6

+

V

IN

-

+

V

BIAS

-

5

+15V

-5V (OR GND)

DIGITAL INPUTS NOT SHOWN

Figure 10.  AGND Bias Circuit

Table 3. Unipolar Code Table

Table 4. Bipolar Code Table

1 0 0 0

DAC CONTENTS

0 0 0 1

MSB

LSB

ANALOG

OUTPUT

1 1 1 1

1 1 1 1

127

+V

REF

(

––––

)

128

1

+V

REF

(

––––

)

128

1 0 0 0

0 0 0 0

0V

0 1 1 1

1 1 1 1

1

-V

REF

(

––––

)

128

0 0 0 0

0 0 0 0

128    

-V

REF

(

––––

)

= -V

REF

128

0 0 0 0

0 0 0 1

127

-V

REF

(

––––

)

128

1 0 0 0

DAC CONTENTS

0 0 0 1

MSB

LSB

ANALOG

OUTPUT

1 1 1 1

1 1 1 1

255

+V

REF

(

––––

)

256

129

+V

REF 

(

––––

)

256

1 0 0 0

0 0 0 0

128         V

REF

+V

REF

(

––––

)

= + 

––––

256            2

0 1 1 1

1 1 1 1

127

+V

REF

(

––––

)

256

0 0 0 0

0 0 0 0

0V

0 0 0 0

0 0 0 1

1

+V

REF

(

––––

)

256

1

Note:

1LSB = (V

REF

) (2

-8

) = +V

REF

(

–––

)

256

1

Note:

1LSB = (V

REF

) (2

-8

) = +V

REF

(

–––

)

256

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background image

Using an AC Reference

In applications where V

REF

has AC signal components,

the MAX500 has multiplying capability within the limits
of the V

REF

input range specifications. Figure 11 shows

a technique for applying a sine-wave signal to the refer-
ence input, where the AC signal is biased up before
being applied to V

REF

. Output distortion is typically less

than 0.1% with input frequencies up to 50kHz, and the
typical -3dB frequency is 700kHz. Note that V

REF

must

never be more negative than AGND.

Generating V

SS

The performance of the MAX500 is specified for both
dual and single-supply (V

SS

= 0V) operation. When the

improved performance of dual-supply operation is
desired, but only a single supply is available, a -5V V

SS

supply can be generated using an ICL7660 in one of
the circuits of Figure 12.

Digital Interface Applications

Figures 13 through 16 show examples of interfacing the
MAX500 to most popular microprocessors.

MAX500

CMOS, Quad, Serial-Interface 

8-Bit DAC

______________________________________________________________________________________

11

DAC B

MAX500

4

14

1 V

OUT

B

DGND

V

SS

V

REF

A/B

V

DD

3

6

-5V (OR GND)

DIGITAL INPUTS NOT SHOWN

AGND

V

OUT

B

+4V

-4V

AC

REFERENCE

INPUT

+15V

15k

10k

5

ICL7660

CAP+

CAP-

V+

GND

V

OUT

ICL7660

CAP+

CAP-

V+

GND

V

OUT

6V

ZENER

12V to 15V

10k

2N2222

10k

10

µ

F

8

3

2

10

µ

F

4

5

-5V

V

SS

 OUT

10

µ

F

+5V

LOGIC

SUPPLY

-5V

V

SS

 OUT

10

µ

F

8

3

4

5

10

µ

F

2

SCL

SDA

LDAC

LOAD*

80C51

P1.0

P1.1

P1.2

P1.3

CONNECT LOAD TO P1.3 FOR 3-WIRE MODE OR
CONNECT LOAD TO V

DD

 FOR 2-WIRE MODE

.  .  .  .  .  .  .

SRO

V

OUT

A

V

OUT

B

V

OUT

C

V

OUT

D

V

REF

A/B

V

REF

C

V

REF

D

MAX500

*

ADDRESS BUS

EN ADDRESS

CODE

B/A

DATA BUS

CONNECT LOAD TO P1.3 FOR 3-WIRE MODE OR
CONNECT LOAD TO V

DD

 FOR 2-WIRE MODE

C/D
CE

RD

INT
D7
D0

Z8420

B0

B1

B2

B3

A15

A0

Z80

I/O REQ

WR

INT

D7

D0

A1

A0

SCL

SDA

LDAC

LOAD*

.  .

MAX500

*

Figure 11.  AC Reference Input Circuit

Figure 12.  Generating -5V for V

SS

Figure 14.  Z-80 with Z8420 PIO Interface

Figure 13.  80C51 Interface

/var/www/html/datasheet/sites/default/files/pdfhtml_images/max500-html.html
background image

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

12

__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA  94086 (408) 737-7600

© 1996 Maxim Integrated Products 

Printed USA

is a registered trademark of Maxim Integrated Products.

MAX500

CMOS, Quad, Serial-Interface, 
8-Bit DAC

___________________Chip Topography

____Pin Configurations (continued)

CONNECT LOAD TO P1.3 FOR 3-WIRE MODE OR
CONNECT LOAD TO V

DD

 FOR 2-WIRE MODE

*

A15

A8

8085/

8088

WR

ALE

AD7
AD0

EN LATCH

ADDRESS BUS

ADDRESS

DECODE

ADDRESS AND DATA BUS

A0

CS

WR

D7

D0

SCL

SDA

LDAC

LOAD*

82C55

PA0

PA1

PA2

PA3

MAX500

.  .

A1

CONNECT LOAD TO P1.3 FOR 3-WIRE MODE OR
CONNECT LOAD TO V

DD

 FOR 2-WIRE MODE

*

A15

A0

6809/

6502

R/W

Θ

 OR E

7

D0

ADDRESS BUS

ADDRESS

DECODE

DATA BUS

C32
R/W

DB7

DB0

6821
6521 PA0

PA1

PA2

PA3 .  .

E

SCL

SDA

LDAC

LOAD*

MAX500

Figure 15.  8085/8088 with Programmable Peripheral Interface

Figure 16.  6809/6502 Interface

V

REF

C

SRO

V

REF

D

 V

REF

B

 AGND

 V

REF

A

Vss V

OUT

A

V

OUT

B

V

DD

SCL

LOAD

LDAC 

DGND

SDA

0.159"

(4.039mm)

0.150"

(3.810mm)

V

OUT

C

V

OUT

D

14

15

16

17

18

4

5

6

7

8

3

2

1

20

19

9

10

11

12

13

MAX500

V

SS

V

REF

A/B

AGND

N.C.

N.C.

V

DD

V

REF

C

V

REF

D

SRO

N.C.

V

OUT

A

V

OUT

B

N.C.

V

OUT

C

V

OUT

D

DGND

LDAC

SDA

LOAD

SCL

LCC

TOP VIEW

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