Final_Datasheet_ISO1H801_V23.fm

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N e v e r   s t o p   t h i n k i n g .

 

I S O F A C E

T M

I S O 1 H 8 0 1 G

C o r e l e s s   T r a n s f o r m e r   I s o l a t e d  
D i g i t a l   O u t p u t   8   C h a n n e l   0 . 6 2 5 A  
H i g h - S i d e   S w i t c h

D a t a s h e e t ,   V e r s i o n   2 . 3 ,   S e p t e m b e r   2 0 0 9

P o w e r   M a n a g e m e n t   &   D r i v e s

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ISO1H801G

 

Revision History:

2009-09-16

Version 2.3

Previous Version:

V2.2

V2.0

Final Datasheet

V2.1

Final Datasheet

V2.2

Page 15 creepage, clearance distance and V

ISO

 adapted, 

V2.3

Diagnostic output discontinued

Edition 2009-09-16

Published by Infineon Technologies AG,

 

Am Campeon 1-12,

 

85579 Neubiberg, Germany

©

 Infineon Technologies AG 2009.

 

All Rights Reserved.

Attention please!

The information herein is given to describe certain components and shall not be considered as a guarantee of 
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding 
circuits, descriptions and charts stated herein.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest 
Infineon Technologies Office (

www.infineon.com

).

Warnings

Due to technical requirements components may contain dangerous substances. For information on the types in 
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written 
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure 
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support 
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain 
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may 
be endangered.

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Type

On-state Resistance

Package

ISO1H801G

200m

PG-DSO-36

Datasheet

3

Version 2.3, 2009-09-16

ISOFACE

TM

ISO1H801G

 

Coreless Transformer Isolated Digital 
Output 8 Channel 0.625A High-Side Switch

Product Highlights

Coreless transformer isolated data interface

Galvanic isolation

8 High-side output switches 0.625A

µC compatible 8-bit parallel peripheral

ISO1H801G

µC (i.e 

C166)

AD0

WR

P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7

P1.x

VCC

VCC

Parallel 

Interface

Control 

Unit

CT

Control 

Protectio

n Unit

CS

WR

D0
D1
D2
D3
D4
D5
D6
D7

DIS

VCC

GNDCC

GNDbb

GND

OUT7

Vbb

Vbb

OUT1

OUT0

Typical Application

reserved

Features

Interface 5V CMOS operation compatible

Parallel interface

Direct control mode

High common mode transient immunity

Short circuit protection

Maximum current internally limited

Overload protection

Overvoltage protection (including load dump)

Undervoltage shutdown with autorestart and 
hysteresis

Switching inductive loads

Common output disable pin

Thermal shutdown with restart

Thermal independence of separate channels

ESD protection

Loss of GNDbb and loss of V

bb

 protection

Reverse Output Voltage protection

Typical Application

Isolated switch for industrial applications (PLC)

All types of resistive, inductive and capacitive loads

µC compatible power switch for 24V DC 
applications

Driver for solenoid, relays and resistive loads

Description

The ISO1H801G is a galvanically isolated 8 bit data 
interface in PG-DSO-36 package that provides 8 fully 
protected high-side power switches that are able to 
handle currents up to 625 mA.

An 8 bit parallel µC compatible interface allows to 
connect the IC directly to a µC system. The input 
interface supports also a direct control mode and is 
designed to operate with 5V CMOS compatible levels.

The data transfer from input to output side is realized by 
the integrated Coreless Transformer Technology.

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ISOFACE™
ISO1H801G

Pin Configuration and Functionality

Datasheet

4

Version 2.3, 2009-09-16

1

Pin Configuration and Functionality

1.1

Pin Configuration

Pin

Symbol

Function

1

N.C.

Not connected

2

VCC

Positive 5V logic supply

3

DIS

Output disable

4

CS

Chip select

5

WR

Parallel write

6

D0

Data input bit0

7

D1

Data input bit1

8

D2

Data input bit2

9

D3

Data input bit3

10

D4

Data input bit4

11

D5

Data input bit5

12

D6

Data input bit6

13

D7

Data input bit7

14

reserved

-

15

GNDCC

Input logic ground

16

N.C.

Not connected

17

N.C.

Not connected

18

N.C.

Not connected

19

GNDbb

Output driver ground

20

N.C

Not connected

21

OUT7

High-side output of channel 7

22

OUT7

High-side output of channel 7

23

OUT6

High-side output of channel 6

24

OUT6

High-side output of channel 6

25

OUT5

High-side output of channel 5

26

OUT5

High-side output of channel 5

27

OUT4

High-side output of channel 4

28

OUT4

High-side output of channel 4

29

OUT3

High-side output of channel 3

30

OUT3

High-side output of channel 3

31

OUT2

High-side output of channel 2

32

OUT2

High-side output of channel 2

33

OUT1

High-side output of channel 1

34

OUT1

High-side output of channel 1

35

OUT0

High-side output of channel 0

36

OUT0

High-side output of channel 0

TAB

Vbb

Positive driver power supply voltage

VCC

D1

1

DIS

CS

WR

5

4

2
3

D3

D5

D2

D4

D0

6
7
8
9
10

D6

11

D7

12

reserved

13

GNDCC

14
15

N.C.

16
17
18

36

32

33

35
34

31
30
29
28
27
26
25
24
23
22
21
20
19

OUT0

OUT2

OUT0
OUT1
OUT1

OUT3

OUT4

OUT3

OUT4

OUT2

OUT5
OUT5
OUT6
OUT6

GNDbb

OUT7
OUT7
N.C.

N.C.

N.C.

N.C.

Vbb

Vbb

TAB

TAB

Figure 1

Power SO-36 (430mil)

.

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Datasheet

5

Version 2.3, 2009-09-16

 

ISOFACE™
ISO1H801G

Pin Configuration and Functionality

1.2

Pin Functionality

VCC (Positive 5V logic supply)

The VCC supplies the input interface that is 
galvanically isolated from the output driver stage. The 
input interface can be supplied with 5V.

DIS (Output disable)

The high-side outputs OUT0...OUT7 can be 
immediately switched off by means of the low active pin 

DIS that is an asynchronous signal. The input registers        
are also reset by the 

DIS signal. The Output remains         

switched off after low-high transition of DIS signal, till 
new information is written into the input register. 
Current Sink to GNDCC.

CS (Chip select)
The system microcontroller selects the ISO1H801G by 
means of the low active pin 

CS to activate the parallel          

interface. By connecting the 

CS pin and WR  pin  to         

ground the parallel direct control is activated. Current 
Source to VCC.

WR (Parallel write)
In parallel mode data at the input pins (D0 ... D7) are 
latched by means of the rising edge of the low active 
signal 

WR (write). Current Source to VCC.

D0 ... D7 (Data input bit0 ... bit7)

The present data can be latched on the rising edge of 
the write signal 

WR. D0 ... D7 control the corresponding         

output channels OUT0 ...OUT7. By connecting CS and 

WR to ground, the signals at D0 ... D7 directly control          
the outputs. Current Sink to GNDCC.

GNDCC (Ground for VCC domain)
This pin acts as the ground reference for the input 
interface that is supplied by VCC.

GNDbb (Output driver ground domain)
This pin acts as the ground reference for the output 
driver that is supplied by Vbb.

OUT0 ... OUT7 (High side output channel 0 ... 7)
The output high side channels are internally connected 
to Vbb and controlled by the corresponding data input 
pins D0 ... D7 in parallel mode.

TAB (Vbb, Positive supply for output driver)
The heatslug is connected to the positive supply port of 
the output interface.

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Datasheet

6

Version 2.3, 2009-09-16

 

ISOFACE™
ISO1H801G

Blockdiagram

2

Blockdiagram

Pa

ra

lle

In

pu

t I

nte

rf

ac

e

< D

0 -

D

>

D1

D2

D3

D4

D5

D6

D7

D0

WR

CS

O

ver

vo

ltag

e  

P

rot

ec

tion

U

nde

rv

ol

tage

 

S

hut

dow

n w

ith 

Re

st

ar

t

V

ol

ta

ge 

So

ur

ce

C

om

m

on 

D

iagn

os

tic

Ou

tp

ut

Se

ria

to

 

Pa

ra

lle

l

to

 Lo

gi

C

han

nel

 1 -

6

Temper

at

ur

e S

ens

or

OU

T0

O

ve

rload

 P

ro

tec

tion

C

ur

rent

 Li

m

ita

tion

Li

m

ita

tio

n of

 U

nc

lamped 

Indu

ct

iv

e Loa

d

Logi

c

C

har

ge 

Pu

m

p

Le

ve

l s

hi

fter

Re

ct

ifi

er

Hi

gh

-s

id

e Ch

an

n

el

 

0

Temper

at

ur

e S

ens

or

OU

T7

O

ve

rload

 P

ro

tec

tion

C

ur

rent

 Li

m

ita

tion

Li

m

ita

tio

n of

 U

nc

lamped 

Indu

ct

iv

e Loa

d

Logi

c

C

har

ge 

Pu

m

p

Le

ve

l S

hi

fte

r

Re

ct

ifi

er

Hi

gh

-s

id

e Ch

an

n

el

 

7

C

han

ne

l 1 

...

 6

fr

o

m

 

Tem

per

at

ur

e S

en

so

r

C

h

an

n

el

 1 -

6

to

 Lo

gi

c

C

ha

nne

l 1

 -

6

Vb

b

Logi

c

U

nde

rv

ol

tage

 

S

hut

dow

n w

ith 

Re

st

ar

t

Vb

b

G

NDb

b

VC

C

GN

D

C

C

Gal

vanic 

Isol

atio

n

DI

S

OU

T1

OU

T2

OU

T3

OU

T4

OU

T5

OU

T6

Ga

te

 

P

rot

ec

tion

Ga

te

 

P

rot

ec

tion

IS

O

1H

801

G

Di

re

ct

 

Mode

Co

nt

ro

l

re

se

rv

ed

Pa

ra

lle

l

to

 

Se

ria

l

CT

Figure 2

Blockdiagram

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ISOFACE™
ISO1H801G

Functional Description

Datasheet

7

Version 2.3, 2009-09-16

3

Functional Description

3.1

Introduction

The ISOFACE ISO1H801G includes 8 high-side power 
switches that are controlled by means of the integrated 
parallel interface. The interface is 8bit µC compatible. 
Furthermore a direct control mode can be selected that 
allows the direct control of the outputs OUT0...OUT7 by 
means of the inputs D0...D7 without any additional logic 
signal. The IC can replace 8 optocouplers and the 8 
high-side switches in conventional I/O-Applications as 
a galvanic isolation is implemented by means of the 
integrated coreless transformer technology. The µC 
compatible interfaces allow a direct connection to the 
ports of a microcontroller without the need for other 
components. Each of the 8 high-side power switches is 
protected against short to Vbb, overload, 
overtemperature and against overvoltage by an active 
zener clamp.

The diagnostic logic on the power chip recognizes the 
overtemperature information of each power transistor.

3.2

Power Supply

The IC contains 2 galvanic isolated voltage domains 
that are independent from each other. The input 
interface is supplied at VCC and the output stage is 
supplied at Vbb. The different voltage domains can be 
switched on at different time. The output stage is only 
enabled once the input stage enters a stable state.

3.3

Output Stage

Each channel contains a high-side vertical power FET 
that is protected by embedded protection functions.

The continous current for each channel is 625mA (all 
channels ON).

3.3.1

Output Stage Control

Each output is independently controlled by an output 
latch and a common reset line via the pin 

DIS  that          

disables all eight outputs and reset the latches. The 
parallel input data is transferred to the input latches 
with a high-to-low transition of the signal 

WR  (write)        

while the 

CS is logic low. A low-to-high transition of CS          

transfers then the data of the input latches to the output 
buffer.

3.3.2

Power Transistor Overvoltage 
Protection

Each of the eight output stages has it own zener clamp 
that causes a voltage limitation at the power transistor 

when solenoid loads are switched off. V

ON

 is then 

clamped to 47V (min.).

Vz

Vbb

GNDbb

OUTx

V

ON

Vbb

Figure 3

Inductive and overvoltage output 
clamp (each channel)

Energy is stored in the load inductance during an 
inductive load switch-off.

E

L

1 2

L I

L

2

×

×

=

E

L

GNDbb

V

bb

OUTx

E

R

L

R

L

E

Load

Z

L

Vbb

E

bb

E

AS

Dx

Figure 4

Inductive load switch-off energy 
dissipation (each channel)

While demagnetizing the load inductance, the energy 
dissipation in the DMOS is

E

AS

E

bb

E

L

E

R

V

ON CL

(

)

i

L

t

( )dt

×

=

+

=

with an approximate solution for R

L

 > 0

Ω:

E

AS

I

L

L

×

2 R

L

×

----------------

V

bb

V

ON CL

(

)

+

(

)

1

I

L

R

L

×

V

ON CL

(

)

-------------------------

+

ln

×

×

=

3.3.3

Power Transistor Overcurrent 
Protection

The outputs are provided with a current limitation that 
enters a repetitive switched mode after an initial peak 
current has been exceeded. The initial peak short 
circuit current limit is set to I

L(SCp)

. During the repetitive 

mode short circuit current the limit is set to I

L(SCr)

. If this 

operation leads to an overtemperature condition, a 
second protection level (T

j

 > 135°C) will change the 

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Datasheet

8

Version 2.3, 2009-09-16

 

ISOFACE™
ISO1H801G

Functional Description

output into a low duty cycle PWM (selective thermal 
shutdown with restart) to prevent critical chip 
temperatures.

IN

VOUT

T

J

t

t

t

Figure 5

Overtemperature detection

The following figures show the timing for a turn on into 
short circuit and a short circuit in on-state. Heating up 
of the chip may require several milliseconds, 
depending on external conditions.

IN

VOUT

I

L

t

t

t

Output short to GND

I

L(SCp)

I

L(SCr)

Figure 6

Turn on into short circuit, shut down by 
overtemperature, restart by cooling

IN

VOUT

I

L

t

t

t

Output short to GND

I

L(SCp)

I

L(SCr)

Normal 
operation

Figure 7

Short circuit in on-state, shut down 
down by overtemperature, restart by 
cooling

3.4

Reserved

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Datasheet

9

Version 2.3, 2009-09-16

 

ISOFACE™
ISO1H801G

Functional Description

3.5

Parallel Interface

The ISO1H801G contains a parallel interface that can 
be directly controlled by the microcontroller output 
ports. The parallel interface can also be switched over 
to a direct control that allows direct changes of the 
outputs OUT0 ... OUT7 by means of the corresponding 
inputs D0 ... D7 without additional logic signals. To 
activate the parallel direct control mode pin 

CS and pin         

WR have to be connected both to GNDCC. 

3.5.1

Parallel Interface Signal 
Description

CS - Chip select. The system microcontroller  selects       
the ISO1H801G by means of the 

CS pin. Whenever the         

pin is in a logic low state, data can be transferred from 
the µC.
CS High to low transition: 

Parallel input data can be written in from then on

CS Low to high transition: 

The data in the input latches is transferred to the 
output buffer

WR  -  Write.  The  system  controller  enables  the  write        
procedure in the ISO1H801G by means of the signal 

WR. A logic low state signal at pin WR writes the input           
data into the input latches when the 

CS pin is in a logic            

low state.
WR Logic low level: 

Parallel input data at the pins D0 - D7 is written into 
the input latches

WR Logic high level: 

The parallel input data is latched in the input 
latches. Any changes at the pins D0 - D7 after the 
low-to-high transition of 

WR do not affect the input        

latches.

D0 ... D7 - Parallel input. Parallel data bits are fed into 
the pins D0 ... D7. The data is written into the input 
latches when 

WR is logic low.

3.5.2

uC Control Mode

P

ar

al

lel

 Inter

fac

e

IC1

Output 
lines

µC (i.e 

C166)

CS
WR

AD0

WR

P0
P1
P2
P3
P4
P5
P6
P7

D0
D1
D2
D3
D4
D5
D6
D7
reserved

VCC

VCC

VCC

GNDCC

GND

Figure 8

Parallel bus configuration

3.5.3

Direct Control Mode

Beside the use of the parallel µC compatible interface a 
parallel direct control mode can be choosen. In this 
mode the output OUT0...OUT7 can be directly 
controlled via the inputs D0...D7 without the need for 
additional logic signals. To activate this mode pin 

CS        

and 

WR need to be connected to GNDCC.

.

P

ar

al

le

l In

te

rfa

ce

IC1

Output 
lines

Controller

P0
P1
P2
P3
P4
P5
P6
P7

D0
D1
D2
D3
D4
D5
D6
D7

VCC

VCC

VCC

CS
WR

reserved

GNDCC

GND

Figure 9

Parallel Direct Control

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Datasheet

10

Version 2.3, 2009-09-16

 

ISOFACE™
ISO1H801G

Functional Description

3.6

Parallel Interface Timing

CS

WR

DATA

t

WHCS

t

WRPW

D0 - D7

t

DS

t

DH

t

CSWR

t

CSD

OUT0 - OUT7

t

on/off

OUTPUT

Figure 10

Parallel input - output timing diagram

3.7

Transmission Failure Detection

There is a failure detection unit integrated to ensure also a stable functionality during the integrated coreless 
transformer transmission. This unit decides wether the transmitted data is valid or not. If four times serial data 
coming in from the internal registers is not accepted, the output stages are switched off until the next valid data is 
received. 

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