R F & P r o t e c t i o n D e v i c e s
D a t a S h e e t
Revision 3.1, 2013-01-31
B G A 7 1 3 N 7
Single-Band UMTS LNA (700, 800 MHz)
Edition 2013-01-31
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2013
Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (
www.infineon.com
).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
Data Sheet
3
Revision 3.1, 2013-01-31
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
BGA713N7 Single-Band UMTS LNA (700, 800 MHz)
Revision History: 2013-01-31, Revision 3.1
Previous Revision: 2012-10-31, Revision 3.0
Page
Subjects (major changes since last revision)
25
Footprint recommendation drawing added
26
Marking pattern drawing updated
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
Table of Contents
Data Sheet
4
Revision 3.1, 2013-01-31
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.1
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.2
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
ESD Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.5
Band Select / Gain Control Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.6
Switching Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.7
Supply Current and Power Gain Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8
Logic Signal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.9
Measured RF Characteristics UMTS Bands XII / XVII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.10
Measured RF Characteristics UMTS Bands XIII / XIV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.11
Measured RF Characteristics UMTS Band XX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.12
Measured Performance Band XIII High Gain Mode vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.13
Measured Performance Band XIII High Gain Mode vs. Temperature . . . . . . . . . . . . . . . . . . . . . . . . 16
2.14
Measured Performance Band XIII Low Gain Mode vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.15
Measured Performance Band XIII Low Gain Mode vs. Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 18
3
Application Circuit and Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1
UMTS Bands XII and XVII Application Circuit Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.2
UMTS Bands XIII and XIV Application Circuit Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.3
UMTS Bands XX Application Circuit Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.4
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.5
Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4
Physical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.1
Package Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
4.2
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
4.3
Product Marking Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table of Contents
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
List of Figures
Data Sheet
5
Revision 3.1, 2013-01-31
Figure 1
Block Diagram of Single-Band LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 3
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 4
Application Circuit with Chip Outline (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 5
Application Board Layout on 3-layer FR4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6
Cross-Section view of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 7
Detail of Application Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 8
Footprint Recommendation 1 for the TSNP-7-1 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 9
Footprint Recommendation 2 for the TSNP-7-1 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10
Package Outline (top, side and bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11
Tape & Reel Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 12
Marking Pattern (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
List of Figures
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
List of Tables
Data Sheet
6
Revision 3.1, 2013-01-31
Table 1
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 2
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 3
ESD Integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 4
DC Characteristics,
T
A
= 25 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 5
Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6
Typical switching times;
T
A
= -30 ... 85 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 7
Typical Characteristics 700 MHz Band,
T
A
= 25 °C,
V
CC
= 2.8 V,
R
REF
= 5.6 k
Ω . . . . . . . . . . . . . . 12
Table 8
Typical Characteristics 700 MHz Band,
T
A
= 25 °C,
V
CC
= 2.8 V,
R
REF
= 5.6 k
Ω . . . . . . . . . . . . . . 13
Table 9
Typical Characteristics 800 MHz Band,
T
A
= 25 °C,
V
CC
= 2.8 V,
R
REF
= 5.6 k
Ω . . . . . . . . . . . . . . 14
Table 10
Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 11
Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 12
Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 13
Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
List of Tables
Product Name
Package
Chip
Marking
BGA713N7
TSNP-7-1
T1533
B3
Single-Band UMTS LNA (700, 800 MHz)
BGA713N7
Data Sheet
7
Revision 3.1, 2013-01-31
1
Features
Main features:
•
Gain: 15.5 / -10 dB in high / low gain mode
•
Noise figure: 1.1 dB in high gain mode
•
Supply current: 4.8 / 0.5 mA in high / low gain mode
•
Standby mode (< 2
μA typ.)
•
Output internally matched to 50
Ω
•
Inputs pre-matched to 50
Ω
•
2 kV HBM ESD protection
•
Low external component count
•
Small leadless TSNP-7-1 package (2.0 x 1.3 x 0.39 mm)
•
Pb-free (RoHS compliant) package
Description
The BGA713N7 is a low current single-band low noise amplifier MMIC for UMTS bands XII, XIII, XIV, XVII and XX.
The LNA is based upon Infineon’s proprietary and cost-effective SiGe:C technology and comes in a low profile
TSNP-7-1 leadless green package. This document specifies electrical parameters, pinout, application circuit and
packaging of the chip.
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
Features
Data Sheet
8
Revision 3.1, 2013-01-31
Figure 1
Block Diagram of Single-Band LNA
BGA713N7_Chip_BlD.vsd
3
2
1
4
5
6
Biasing & Logic
Circuitry
RFOUT
RREF
VCC
RFIN
VEN
7
GND
VGS
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
Electrical Characteristics
Data Sheet
9
Revision 3.1, 2013-01-31
2
Electrical Characteristics
2.1
Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
2.2
Thermal Resistance
2.3
ESD Integrity
Table 1
Absolute Maximum Ratings
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Supply voltage
V
CC
-0.3
–
3.6
V
–
Supply current
I
CC
–
–
10
mA
–
Pin voltage
V
PIN
-0.3
–
V
CC
+0.3 V
All pins except RF input pins
Pin voltage RF input pins
V
RFIN
-0.3
–
0.9
V
–
RF input power
P
RFIN
–
–
4
dBm
–
Junction temperature
T
j
–
–
150
°C
–
Ambient temperature range
T
A
-30
–
85
°C
–
Storage temperature range
T
stg
-65
–
150
°C
–
Table 2
Thermal Resistance
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Thermal resistance junction to
soldering point
R
thJS
–
150
–
K/W
–
Table 3
ESD Integrity
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
ESD hardness HBM
1)
1) According to JESD22-A114
V
ESD-HBM
–
2000
–
V
All pins
BGA713N7
Single-Band UMTS LNA (700, 800 MHz)
Electrical Characteristics
Data Sheet
10
Revision 3.1, 2013-01-31
2.4
DC Characteristics
2.5
Band Select / Gain Control Truth Table
2.6
Switching Time
Table 4
DC Characteristics,
T
A
= 25 °C
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Supply voltage
V
CC
2.6
2.8
3.0
V
–
Supply current high gain
mode
I
CCHG
–
4.8
–
mA
–
Supply current low gain
mode
I
CCLG
–
0.50
–
mA
–
Supply current standby
mode
I
CCOFF
–
0.1
–
μA
–
Logic level high
V
HI
1.5
2.8
–
V
All logic pins
Logic level low
V
LO
–
0.0
0.5
V
Logic currents
I
HI
–
5.0
–
μA
All logic pins
I
LO
–
0.1
–
μA
Table 5
Truth Table
Control Voltage
State
Bands XII, XIII, XIV, XVII and XX
VEN
VGS
HG
LG
H
L
OFF
ON
H
H
ON
OFF
L
L
STANDBY
1)
1) In order to achieve minimum standby current it is encouraged to apply logic low-level at the VGS pin in standby mode
although this is not mandatory.
L
H
Table 6
Typical switching times;
T
A
= -30 ... 85 °C
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Settling time gainstep
t
GS
–
1
–
μs
Switching LG
↔ HG