Tiny 500 mA High-Speed Power MOSFET Driver

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 2007-2014 Microchip Technology Inc.

DS20002052D-page 1

MCP1401/02

Features

• High Peak Output Current: 500 mA (typical)

• Wide Input Supply Voltage Operating Range:

- 4.5V to 18V

• Low Shoot-Through/Cross-Conduction Current in 

Output Stage

• High Capacitive Load Drive Capability:

- 470 pF in 19 ns (typical)

- 1000 pF in 34 ns (typical)

• Short Delay Times: 35 ns (typical)

• Matched Rise/Fall Times

• Low Supply Current:

- With Logic ‘1’ Input – 0.85 mA (typical)

- With Logic ‘0’ Input – 0.1 mA (typical)

• Latch-Up Protected: Will Withstand 500 mA 

Reverse Current

• Logic Input Will Withstand Negative Swing up to 5V

• Space-Saving 5-Lead SOT-23 Package

Applications

• Switch Mode Power Supplies

• Pulse Transformer Drive

• Line Drivers

• Motor and Solenoid Drive

General Description

The MCP1401/02 are high-speed MOSFET drivers
capable of providing 500 mA of peak current. The
inverting or non-inverting single channel output is
directly controlled from either TTL or CMOS (3V to
18V). These devices also feature low shoot-through
current, matched rise/fall times and propagation delays
which make them ideal for high switching frequency
applications.

The MCP1401/02 devices operate from a single 4.5V
to 18V power supply and can easily charge and
discharge 470 pF gate capacitance in under 19 ns
(typical). They provide low enough impedances in both
the On and Off states to ensure the MOSFET’s
intended state will not be affected, even by large
transients.

These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the Ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current being forced back into their
outputs. All terminals are fully protected against
Electrostatic Discharge (ESD) up to 1 kV (HBM) and
300V (MM).

Package Types

4

1

2

3

5

V

DD

GND

IN

OUT

GND

OUT

GND

MCP1401 MCP1402

SOT-23

Tiny 500 mA, High-Speed Power MOSFET Driver

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MCP1401/02

DS20002052D-page 2

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Functional Block Diagram

Effective 

Input C = 25 pF

 
 

MCP1401 Inverting 
MCP1402 Non-inverting

Input

GND

V

DD

300 mV 

 

4.7V

Inverting

Non-inverting

850 µA 

Output

(Each Input) 

 

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DS20002052D-page 3

MCP1401/02

1.0

ELECTRICAL 
CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage ..................................................... +20V
Input Voltage .................... (V

DD

+ 0.3V) to (GND – 5V)

Input Current (V

IN

> V

DD

) ................................... 50 mA

Package Power Dissipation (T

A

= 50

o

C)

SOT-23-5 ........................................................ 0.39W

† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.

DC CHARACTERISTICS (

Note 2

)

Electrical Specifications: Unless otherwise indicated, T

A

= +25°C, with 4.5V

 V

DD

 18V.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Input

Logic ‘1’, High Input Voltage

V

IH

2.4

1.5

V

Logic ‘0’, Low Input Voltage

V

IL

1.3

0.8

V

Input Current

I

IN

-1

1

µA

0V

 V

IN

 V

DD

Input Voltage

V

IN

-5

V

DD

+ 0.3

V

Output

High Output Voltage

V

OH

V

DD

– 0.025

V

DC Test

Low Output Voltage

V

OL

0.025

V

DC Test

Output Resistance, High

R

OH

12

18

I

OUT

= 10 mA,  V

DD

= 18V

Output Resistance, Low

R

OL

10

16

I

OUT

= 10 mA,  V

DD

= 18V

Peak Output Current

I

PK

0.5

A

V

DD

 18V (

Note 2

)

Latch-Up Protection
Withstand Reverse Current

I

REV

> 0.5

A

Duty cycle

  2%, t  300 µs

Switching Time (

Note 1

)

Rise Time

t

R

19

25

ns

Figure 4-1

Figure 4-2

 

C

L

= 470 pF

Fall Time

t

F

15

20

ns

Figure 4-1

Figure 4-2

C

L

= 470 pF

Delay Time

t

D1

35

40

ns

Figure 4-1

Figure 4-2

Delay Time

t

D2

35

40

ns

Figure 4-1

Figure 4-2

Power Supply

Supply Voltage

V

DD

4.5

18.0

V

Power Supply Current

I

S

0.85

1.1

mA

V

IN

= 3V

I

S

0.10

0.20

mA

V

IN

= 0V

Note 1:

Switching times ensured by design.

2:

Tested during characterization, not production tested.

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MCP1401/02

DS20002052D-page 4

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DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)

Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V

 V

DD

 18V.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Input

Logic ‘1’, High Input Voltage

V

IH

2.4

V

Logic ‘0’, Low Input Voltage

V

IL

0.8

V

Input Current

I

IN

-10

+10

µA

0V

 V

IN

 V

DD

Input Voltage

V

IN

-5

V

DD

+ 0.3

V

Output

High Output Voltage

V

OH

V

DD

– 0.025

V

DC TEST

Low Output Voltage

V

OL

0.025

V

DC TEST

Output Resistance, High

R

OH

16

18

I

OUT

= 10 mA,  V

DD

= 18V

Output Resistance, Low

R

OL

16

19

I

OUT

= 10 mA,  V

DD

= 18V

Switching Time (

Note 1

)

Rise Time

t

R

20

30

ns

Figure 4-1

Figure 4-2

C

L

= 470 pF

Fall Time

t

F

18

28

ns

Figure 4-1

Figure 4-2

C

L

= 470 pF

Delay Time

t

D1

40

51

ns

Figure 4-1

Figure 4-2

 

Delay Time

t

D2

40

51

ns

Figure 4-1

Figure 4-2

Power Supply

Supply Voltage

V

DD

4.5

18.0

V

Power Supply Current

I

S

0.90

1.10

mA

V

IN

= 3V

0.11

0.20

mA

V

IN

= 0V

Note 1:

Switching times ensured by design.

2:

Tested during characterization, not production tested.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V

 V

DD

 18V.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Specified Temperature Range

T

A

-40

+125

°C

Maximum Junction Temperature

T

J

+150

°C

Storage Temperature Range

T

A

-65

+150

°C

Package Thermal Resistances

Thermal Resistance, 5L-SOT-23

JA

220.7

°C/W

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DS20002052D-page 5

MCP1401/02

2.0

TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, T

A

= +25°C with 4.5V

 V

DD

 18V.

FIGURE 2-1:

Rise Time vs. Supply 

Voltage.

FIGURE 2-2:

Rise Time vs. Capacitive 

Load.

FIGURE 2-3:

Rise and Fall Times vs. 

Temperature.

FIGURE 2-4:

Fall Time vs. Supply 

Voltage.

FIGURE 2-5:

Fall Time vs. Capacitive 

Load.

FIGURE 2-6:

Propagation Delay vs. Input 

Amplitude.

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0

50

100

150

200

250

300

350

4

6

8

10

12

14

16

18

Supply Voltage (V)

R

ise

 T

Ime 

(n

s)

3300 pF

470 pF

100 pF

1000 pF

0

50

100

150

200

250

100

1000

10000

Capacitive Load (pF)

Ri

se Ti

m

e

 (ns)

5V

18V

12V

10

14

18

22

26

30

34

-40 -25 -10

5

20

35

50

65

80

95 110 125

Temperature (

o

C)

Ti

m

e

 (

n

s)

C

LOAD

 = 470 pF

V

DD

 = 12V

t

FALL

t

RISE

0

50

100

150

200

250

300

350

4

6

8

10

12

14

16

18

Supply Voltage (V)

Fal

l Ti

m

e

 (

n

s)

3300 pF

470 pF

100 pF

1000 pF

0

50

100

150

200

250

100

1000

10000

Capacitve Load (pF)

Fal

l Ti

m

e

 (

n

s

)

5V

18V

12V

36

37

38

39

40

41

42

43

44

4

5

6

7

8

9

10

Input Amplitude (V)

P

ropagat

ion D

e

lay 

(n

s)

t

D2

t

D1

V

DD

= 12V

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MCP1401/02

DS20002052D-page 6

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Note: Unless otherwise indicated, T

A

= +25°C with 4.5V

 V

DD

 18V.

FIGURE 2-7:

Propagation Delay Time vs. 

Supply Voltage.

FIGURE 2-8:

Propagation Delay Time vs. 

Temperature.

FIGURE 2-9:

Quiescent Current vs. 

Supply Voltage.

FIGURE 2-10:

Quiescent Current vs. 

Temperature.

FIGURE 2-11:

Input Threshold vs. Supply 

Voltage.

FIGURE 2-12:

Input Threshold vs. 

Temperature.

Note: Unless otherwise indicated, T

A

= +25°C with 4.5V

 V

DD

 18V.

30

40

50

60

70

80

4

6

8

10

12

14

16

18

Supply Voltage (V)

P

ropagat

ion D

e

lay 

(n

s)

t

D2

t

D1

30

35

40

45

50

55

60

-40 -25 -10

5

20

35

50

65

80

95 110 125

Temperature (

o

C)

P

ropaga

ti

on

 D

e

la

y (

n

s)

V

DD

 = 12V

t

D2

t

D1

0.0

0.2

0.4

0.6

0.8

1.0

1.2

4

6

8

10

12

14

16

18

Supply Voltage (V)

Quie

scent

 C

u

rr

ent (

m

A

)

Input = 1

Input = 0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

-40 -25 -10

5

20 35

50

65

80

95 110 125

Temperature (

o

C)

Qui

e

s

cent Curre

nt 

(m

A

)

V

DD

 = 18V

Input = 1

Input = 0

1.5

1.6

1.7

1.8

1.9

2

2.1

2.2

4

6

8

10

12

14

16

18

Supply Voltage (V)

Input

 Threshol

(V

)

V

LO

V

HI

1.6

1.7

1.8

1.9

2

2.1

2.2

2.3

2.4

-40 -25 -10

5

20 35

50

65

80

95 110 125

Temperature (

o

C)

Input

 Threshol

(V

)

V

DD

 = 12V

V

LO

V

HI

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DS20002052D-page 7

MCP1401/02

FIGURE 2-13:

Supply Current vs. 

Capacitive Load.

FIGURE 2-14:

Supply Current vs. 

Capacitive Load.

FIGURE 2-15:

Supply Current vs. 

Capacitive Load.

FIGURE 2-16:

Supply Current vs. 

Frequency.

FIGURE 2-17:

Supply Current vs. 

Frequency.

FIGURE 2-18:

Supply Current vs. 

Frequency.

0

25

50

75

100

125

150

100

1000

10000

Capacitive Load (pF)

S

uppl

y

 C

u

rrent

 (

m

A

)

100 kHz

V

DD

 = 18V

2 MHz

1 MHz

200 kHz

50 kHz

0

10

20

30

40

50

60

70

100

1000

10000

Capacitive Load (pF)

S

uppl

y C

u

rre

nt

 (

m

A

)

100 kHz

V

DD

 = 12V

2 MHz

1 MHz

200 kHz

50 kHz

0

5

10

15

20

25

30

100

1000

10000

Capacitive Load (pF)

S

uppl

y C

u

rre

nt

 (

m

A

)

100 kHz

V

DD

 = 6V

2 MHz

1 MHz

200 kHz

50 kHz

0

10

20

30

40

50

60

70

80

10

100

1000

Frequency (kHz)

S

uppl

y C

u

rrent

 (

m

A

)

V

DD

 = 18V

6,800 pF

3,300 pF

1,000 pF

470 pF

100 pF

0

10

20

30

40

50

10

100

1000

Frequency (kHz)

S

uppl

y

 V

o

lt

age 

(V

)

V

DD

 = 12V

6,800 pF

3,300 pF

1,000 pF

470 pF

100 pF

0

5

10

15

20

25

10

100

1000

Frequency (kHz)

S

uppl

y C

u

rre

nt

 (

m

A

)

V

DD

 = 6V

6,800 pF

3,300 pF

1,000 pF

470 pF

100 pF

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MCP1401/02

DS20002052D-page 8

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Note: Unless otherwise indicated, T

A

= +25°C with 4.5V

 V

DD

 18V.

FIGURE 2-19:

Output Resistance (Output 

High) vs. Supply Voltage.

FIGURE 2-20:

Output Resistance (Output 

Low) vs. Supply Voltage.

FIGURE 2-21:

Crossover Energy vs. 

Supply Voltage.

0

10

20

30

40

50

60

4

6

8

10

12

14

16

18

R

OUT

-HI

Supply Voltage (V)

V

IN

= 0V (MCP1401)

V

IN

= 5V (MCP1402)

T

= +125

o

C

T

= +25

o

C

5

10

15

20

25

30

35

40

45

50

4

6

8

10

12

14

16

18

R

OUT

-LO

Supply Voltage (V)

V

IN

= 5V (MCP1401)

V

IN

= 0V (MCP1402)

T

= +125

o

C

T

= +25

o

C

1E-10

1E-9

1E-8

1E-7

4

6

8

10

12

14

16

18

Supply Voltage (V)

Cross

o

ver E

n

ergy (A*s

ec)

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DS20002052D-page 9

MCP1401/02

3.0

PIN DESCRIPTIONS

The description of the pins are listed in 

Table 3-1

.

3.1

Supply Input (V

DD

)

V

DD

 is the bias supply input for the MOSFET driver and

has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local capacitor. This bypass
capacitor provides a localized low-impedance path for
the peak currents that are to be provided to the load.

3.2

Control Input (IN)

The MOSFET driver input is a high-impedance, TTL/
CMOS-compatible input. The input also has hysteresis
between the high and low input levels, allowing them to
be driven from slow rising and falling signals and to
provide noise immunity.

3.3

Ground (GND)

Ground is the Device Return pin. The Ground pin
should have a low-impedance connection to the bias
supply source return. High peak currents will flow out
the Ground pin when the capacitive load is being
discharged.

3.4

Output (OUT, OUT)

The output is a CMOS push-pull output that is capable
of sourcing and sinking 0.5A of peak current
(V

DD

= 18V). The low output impedance ensures the

gate of the external MOSFET will stay in the intended
state even during large transients. This output also has
a reverse current latch-up rating of 0.5A.

TABLE 3-1:

 PIN FUNCTION TABLE

(

1

)    

Pin No.

MCP1401

MCP1402

Description

1

GND

GND

Ground

2

V

DD

V

DD

Supply Input

3

IN

IN

Control Input

4

GND

GND

Ground

5

OUT

OUT

Output

Note 1:

Duplicate pins must be connected for proper operation.

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MCP1401/02

DS20002052D-page 10

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4.0

APPLICATION INFORMATION

4.1

General Information

MOSFET drivers are high-speed, high-current devices
which are intended to source/sink high peak currents to
charge/discharge the gate capacitance of external
MOSFETs or IGBTs. In high-frequency switching power
supplies, the PWM controller may not have the drive
capability to directly drive the power MOSFET. A
MOSFET driver like the MCP1401/02 family can be
used to provide additional source/sink current
capability.

4.2

MOSFET Driver Timing

The ability of a MOSFET driver to transition from a fully-
off state to a fully-on state is characterized by the
driver’s rise time (t

R

), fall time (t

F

), and propagation

delays (t

D1

 and t

D2

). The MCP1401/02 family of drivers

can typically charge and discharge a 470 pF load
capacitance in 19 ns, along with a typical matched
propagation delay of 35 ns. 

Figures 4-1

 and

4-2

 show

the test circuit and timing waveform used to verify the
MCP1401/02 timing.

FIGURE 4-1:

Inverting Driver Timing 

Waveform.

FIGURE 4-2:

Non-Inverting Driver Timing 

Waveform.

4.3

Decoupling Capacitors

Careful layout and decoupling capacitors are highly
recommended when using MOSFET drivers. Large
currents are required to charge and discharge
capacitive loads quickly. For example, approximately
550 mA are needed to charge a 470 pF load with 18V
in 15 ns.

To operate the MOSFET driver over a wide frequency
range with low supply impedance, it is recommended to
place a ceramic and low ESR film capacitor in parallel
between the driver V

DD

 and GND. A 1.0 µF low ESR

film capacitor and a 0.1 µF ceramic capacitor placed
between pins 2 and 1 should be used. These
capacitors should be placed close to the driver to
minimize circuit board parasitics and provide a local
source for the required current.

4.4

PCB Layout Considerations

Proper Printed Circuit Board (PCB) layout is important
in a high-current, fast switching circuit to provide proper
device operation and robustness of design. PCB trace
loop area and inductance should be minimized by the
use of ground planes or trace under MOSFET gate
drive signals, separate analog and power grounds, and
local driver decoupling.

Placing a ground plane beneath the MCP1401/02 will
help as a radiated noise shield and it will provide some
heat sinking for power dissipated within the device.

0.1 µF

+5V

10%

90%

10%

90%

10%

90%

18V

1 µF

0V

0V

MCP1401

 C

L

= 470 pF

Input

Input

Output

t

D1

t

F

t

D2

Output

t

R

V

DD

= 18V

Ceramic

90%

Input

t

D1

t

F

t

D2

Output

t

R

10%

10%

10%

+5V

18V

0V

0V

90%

90%

0.1 µF

1 µF

MCP1402

 C

L

= 470 pF

Input

Output

V

DD

= 18V

Ceramic

Maker
Microchip Technology Inc.
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