2002-2012 Microchip Technology Inc.
DS21373C-page 1
TC1262
Features
• Very Low Dropout Voltage
• 500mA Output Current
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Over Current and Over Temperature Protection
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
Device Selection Table
NOTE: xx indicates output voltages.
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
Package Type
General Description
The TC1262 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed specif-
ically for battery-operated systems, the TC1262’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80
A at full load (20 to 60 times lower than
in bipolar regulators).
TC1262 key features include ultra low noise operation,
very low dropout voltage (typically 350mV at full load),
and fast response to step changes in load.
The TC1262 incorporates both over temperature and
over current protection. The TC1262 is stable with an
output capacitor of only 1
F and has a maximum
output current of 500mA. It is available in 3-Pin
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.
Typical Application
Part Number
Package
Junction
Temp. Range
TC1262-xxVDB
3-Pin SOT-223
-40°C to +125°C
TC1262-xxVAB
3-Pin TO-220
-40°C to +125°C
TC1262-xxVEB
3-Pin DDPAK
-40°C to +125°C
V
IN
V
IN
V
OUT
GND
G
ND
V
OU
T
Tab is GND
Front View
Front View
1
1
2
3
3
2
Tab is GND
TC1262
TC1262
V
IN
V
OUT
TC1262
3-Pin TO-220
Tab is GND
3-Pin SOT-223
3-Pin DDPAK
1
2
3
G
ND
TC1262
V
IN
V
OUT
C1
1
μF
GND
V
OUT
V
IN
+
500mA Fixed Output CMOS LDO
TC1262
DS21373C-page 2
2002-2012 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V
SS
– 0.3V) to (V
IN
+ 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ V
IN
+0.3V to -0.3V
Operating Temperature Range...... -40°C < T
J
< 125°C
Storage Temperature..........................-65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1262 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V
IN
= V
OUT
+ 1V, I
L
= 100
A, C
L
= 3.3
F, T
A
= 25°C, unless otherwise noted. Boldface type
specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
IN
Input Operating Voltage
2.7
—
6.0
V
Note 7
I
OUT
MAX
Maximum Output Current
500
—
—
mA
V
OUT
Output Voltage
—
V
R
– 2.5%
V
R
±0.5%
—
—
V
R
+ 2.5%
V
Note 1
V
OUT
/
T
V
OUT
Temperature Coefficient
—
40
—
ppm/°C
Note 2
V
OUT
/
V
IN
Line Regulation
—
.003
0.35
%/V
(V
R
+ 1V)
V
IN
6V
V
OUT
/V
OUT
Load Regulation
—
0.002
0.01
%/mA
I
L
= 0.1mA to I
OUT
MAX
(Note 3)
V
IN
-V
OUT
Dropout Voltage
—
—
—
20
60
200
350
30
130
390
650
mV
I
L
= 100
A
I
L
= 100mA
I
L
= 300mA
I
L
= 500mA (Note 4)
I
DD
Supply Current
—
80
130
A
I
L
= 0
PSRR
Power Supply Rejection Ratio
—
64
—
dB
F
RE
1kHz
I
OUT
SC
Output Short Circuit Current
—
1200
—
mA
V
OUT
= 0V
V
OUT
/
P
D
Thermal Regulation
—
0.04
—
V/W
Note 5
eN
Output Noise
—
260
—
nV/
Hz I
L
= I
OUT
MAX
, F
RE
= 10kHz
Note
1:
V
R
is the regulator output voltage setting.
2:
3:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4:
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
5:
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
L
MAX
at V
IN
= 6V for T = 10 msec.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
7:
The minimum V
IN
has to justify the conditions: V
IN
V
R
+ V
DROPOUT
and V
IN
2.7V for I
L
= 0.1mA to I
OUT
MAX
.
TC V
OUT
= (V
OUT
MAX
– V
OUT
MIN
) x 10
6
V
OUT
x
T
2002-2012 Microchip Technology Inc.
DS21373C-page 3
TC1262
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
3.0
DETAILED DESCRIPTION
The TC1262 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1262’s supply current does
not increase with load current. In addition, V
OUT
remains stable and within regulation over the entire
0mA to I
LOAD
MAX
load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
3.1
Output Capacitor
A 1
F (min) capacitor from V
OUT
to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1
and less than 5, and a
resonant frequency above 1MHz. A 1
F capacitor
should be connected from V
IN
to GND if there is more
than 10 inches of wire between the regulator and the
AC filter capacitor, or if a battery is used as the power
source. Aluminum electrolytic or tantalum capacitor
types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately -30°C, solid
tantalums are recommended for applications operating
below -25°C.) When operating from sources other than
batteries, supply-noise rejection and transient
response can be improved by increasing the value of
the input and output capacitors and employing passive
filtering techniques.
Pin No.
(3-Pin SOT-223)
(3-Pin TO-220)
(3-Pin DDPAK)
Symbol
Description
1
V
IN
Unregulated supply input.
2
GND
Ground terminal.
3
V
OUT
Regulated voltage output.
C1
1
μF
Battery
TC1262
V
IN
V
OUT
C2
1
μF
GND
V
OUT
+
+
+
–
TC1262
DS21373C-page 4
2002-2012 Microchip Technology Inc.
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
A
MAX
), the maximum allowable die temperature
(T
J
MAX
) and the thermal resistance from junction-to-air
(
JA
).
EQUATION 4-2:
Table 4-1 and Table 4-2 show various values of
JA
for
the TC1262 packages.
TABLE 4-1:
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
SOT-223 PACKAGE
*Tab of device attached to topside copper
TABLE 4-2:
THERMAL RESISTANCE
GUIDELINES FOR TC1262 IN
3-PIN DDPAK/TO-220
PACKAGE
*Tab of device attached to topside copper
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
IN
MAX
= 3.3V ± 10%
V
OUT
MIN
= 2.7V ± 0.5%
I
LOAD
MAX
= 275mA
T
J
MAX
= 125°C
T
A
MAX
= 95°C
JA
= 59°C/W (SOT-223)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
D
(V
IN
MAX
– V
OUT
MIN
)I
LOAD
MAX
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10
–3
= 260mW
Maximum allowable power dissipation:
In this example, the TC1262 dissipates a maximum of
260mW; below the allowable limit of 508mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
IN
, is found by sustituting the maximum allowable
power dissipation of 508mW into Equation 4-1, from
which V
IN
MAX
= 4.6V.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
JA
)
2500 sq mm
2500 sq mm 2500 sq mm
45°C/W
1000 sq mm
2500 sq mm 2500 sq mm
45°C/W
225 sq mm
2500 sq mm 2500 sq mm
53°C/W
100 sq mm
2500 sq mm 2500 sq mm
59°C/W
1000 sq mm
1000 sq mm 1000 sq mm
52°C/W
1000 sq mm
0 sq mm
1000 sq mm
55°C/W
Where:
P
D
(V
IN
MAX
– V
OUT
MIN
)I
LOAD
MAX
P
D
V
IN
MAX
V
OUT
MIN
I
LOAD
MAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
D
MAX
= (T
J
MAX
– T
A
MAX
)
JA
Where all terms are previously defined.
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board
Area
Thermal
Resistance
JA
)
2500 sq mm
2500 sq mm 2500 sq mm
25°C/W
1000 sq mm
2500 sq mm 2500 sq mm
27°C/W
125 sq mm
2500 sq mm 2500 sq mm
35°C/W
P
D
MAX
= (T
J
MAX
– T
A
MAX
)
JA
= (125 – 95)
59
= 508mW
2002-2012 Microchip Technology Inc.
DS21373C-page 5
TC1262
5.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Output Noise vs. Frequency
FREQUENCY (kHz)
NOISE (
μ
V/
√
Hz)
10.0
1.0
0.01
0.01
1
10
100
1000
0.1
0.0
R
LOAD
= 50μΩ
C
OUT
= 1
μF
0.020
0.018
0.016
0.012
0.010
0.008
0.006
0.004
0.002
0.000
0.014
TEMPERATURE (
°C)
Line Regulation vs. Temperature
LINE REGULATION (%)
-40
°C 0°C
25
°C 70°C
85
°C 125°C
-40
°C
0
°C
25
°C
70
°C
85
°C 125°C
0.0100
0.0090
0.0080
0.0070
0.0060
0.0050
0.0040
0.0030
0.0020
0.0010
0.0100
TEMPERATURE (
°C)
Load Regulation vs. Temperature
LOAD REGULATION (%/mA)
1mA to 500mA
1mA to 500mA
5V
2.5V
TEMPERATURE (
°C)
I
DD
(µ
A)
150
135
120
105
90
75
60
45
30
15
0
I
DD
vs. Temperature
5V
-40
°C 0°C
25
°C 70°C
85
°C 125°C
0
100
300
400
500
ILOAD (mA)
0
100
200
300
400
500
ILOAD (mA)
2.5V Dropout Voltage vs. I
LOAD
DROPOUT VOLTAGE (V)
2.5V
0.50
0.40
0.30
0.20
0.10
0.00
0.50
0.40
0.30
0.20
0.10
0.00
LOAD
D
ROPOUT VOLTAGE
(V
)
25
°C
-40
°C
-40
°C
0
°C
0
°C
70
°C
70
°C
85
°C
1
125
°C
85
°C
25
°C
125
°C
2.70
2.50
2.30
2.10
1.90
1.70
1.50
-40
°C
0
°C
25
°C
70
°C 85°C 125°C
TEMPERATURE (
°C)
2.5V V
OUT
vs. Temperature
I
L
= 0.1mA
I
L
A
= 300mA
III
L
A
A
= 500mA
5.20
5.10
5.00
4.90
4.80
4.70
4.60
4.50
4.40
4.30
4.20
4.10
4.00
-40
°C
0
°C
25
°C
70
°C 85°C 125°C
TEMPERATURE (
°C)
5.0V V
OUT
vs. Temperature
V
OUT
(V)
V
OUT
(V)
I
L
= 0.1mA
III
L
III
L
TC1262
DS21373C-page 6
2002-2012 Microchip Technology Inc.
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 3-Pin SOT-223 Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
Component Taping Orientation for 3-Pin DDPAK Devices
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
3-Pin DDPAK
24 mm
16 mm
750
13 in
Carrier Tape, Number of Components Per Reel and Reel Size
User Direction of Feed
Device
Marking
PIN 1
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
W
P
2002-2012 Microchip Technology Inc.
DS21373C-page 7
TC1262
6.3
Package Dimensions
.264 (6.70)
.248 (6.30)
.122 (3.10)
.114 (2.90)
.287 (7.30)
.264 (6.70)
.146 (3.70)
.130 (3.30)
.091 (2.30) TYP.
.071
(1.80)
MAX.
.181 (4.60) TYP.
.036 (0.91) MIN.
.041 (1.04)
.033 (0.84)
PIN 1
.013 (0.33)
.009 (0.24)
.031 (0.80)
.024 (0.60)
.004 (0.10)
.001 (0.02)
10
°
MAX.
3-Pin SOT-223
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC1262
DS21373C-page 8
2002-2012 Microchip Technology Inc.
Package Dimensions (Continued)
3-Pin TO-220
.205 (5.21)
.195 (4.95)
PIN 1
.113 (2.87)
.103 (2.62)
.410 (10.41)
.357 (9.06)
.156 (3.96)
.146 (3.71)
DIA.
.258 (6.55)
.230 (5.84)
.560 (14.22)
.518 (13.16)
.105 (2.67)
.095 (2.41)
.037 (0.94)
.027 (0.69)
.055 (1.40)
.045 (1.14)
.244 (6.20)
.234 (5.94)
.185 (4.70)
.165 (4.19)
.055 (1.40)
.045 (1.14)
.594 (15.09)
.569 (14.45)
.115 (2.92)
.095 (2.41)
.020 (0.51)
.012 (0.30)
3
°
- 7.5
°
5 PLCS.
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
.100 (2.54) TYP.
3-Pin DDPAK
.037 (0.94)
.026 (0.66)
.370 (9.40)
.330 (8.38)
.067 (1.70)
.045 (1.14)
.605 (15.37)
.549 (13.95)
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.055 (1.40)
.045 (1.14)
.010 (0.25)
.000 (0.00)
.110 (2.79)
.068 (1.72)
.026 (0.66)
.014 (0.36)
.051 (1.30)
.049 (1.24)
8
° MAX.
3
° - 7°
(5x)
PIN 1
Dimensions: inches (mm)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21373C-page 9
TC1262
7.0
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
TC1262
DS21373C-page 10
2002-2012 Microchip Technology Inc.
NOTES: