DS21368C.book

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 2002-2012 Microchip Technology Inc.

DS21368C-page 1

TC1223/TC1224

Features

• Extremely Low Ground Current for Longer Battery 

Life

• Very Low Dropout Voltage
• Choice of 50mA and 100mA Output (TC1223, 

TC1224, Respectively)

• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power Saving Shutdown Mode

• Over Current and Over Temperature Protection
• Space-Saving 5-Pin SOT-23A Package
• Pin Compatible Upgrades for Bipolar Regulators

Applications

• Battery Operated Systems
• Portable Computers

• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers

Device Selection Table

NOTE: xx indicates output voltages

Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6,
4.0, 5.0.

Other output voltages are available. Please contact Microchip
Technology Inc. for details.

Package Type

General Description

The TC1223 and TC1224 are high accuracy (typically
±0.5%) CMOS upgrades for older (bipolar) low dropout
regulators such as the LP2980. Designed specifically
for battery-operated systems, the devices’ CMOS
construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 50

A at full load (20 to 60 times lower than

in bipolar regulators).

The devices’ key features include ultra low noise
operation; very low dropout voltage (typically 85mV,
TC1223 and 180mV, TC1224 at full load) and fast
response to step changes in load. Supply current is
reduced to 0.5

A (max) and V

OUT

 falls to zero when

the shutdown input is low. The devices incorporate both
over temperature and over current protection.

The TC1223 and TC1224 are stable with an output
capacitor of only 1

F and have a maximum output

current of 50mA and 100mA respectively. For higher
output current versions, please see the TC1107,
TC1108 and TC1173 (I

OUT

 = 300mA) data sheets.

Typical Application

Part Number

Package

Junction

Temp. Range

TC1223-xxVCT

5-Pin SOT-23A

-40°C to +125°C

TC1224-xxVCT

5-Pin SOT-23A

-40°C to +125°C

5-Pin SOT-23A

SHDN

5

TC1223
TC1224

1

3

4

2

V

IN

V

OUT

GND

NC

NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A)

TC1223
TC1224

V

OUT

SHDN

GND

NC

1

μF

+

V

IN

V

IN

V

OUT

1

5

2

4

3

Shutdown Control

(from Power Control Logic)

50mA and 100mA CMOS LDOs with Shutdown

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TC1223/TC1224

DS21368C-page 2

 2002-2012 Microchip Technology Inc.

1.0

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings*

Input Voltage .........................................................6.5V

Output Voltage........................... (-0.3V) to (V

IN

 + 0.3V)

Power Dissipation.............................. Internally Limited

Maximum Voltage on Any Pin  ........ V

IN

 +0.3V to -0.3V

Operating Temperature Range...... -40°C < T

J

 < 125°C

Storage Temperature..........................-65°C to +150°C

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.

TC1223/TC1224 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: V

IN

 = V

OUT

 + 1V, I

L

 = 100

A, C

L

 = 3.3

F, SHDN > V

IH

, T

A

 = 25°C, unless otherwise noted. Boldface 

type specifications apply for junction temperatures of -40°C to +125°C.

Symbol

Parameter

Min

Typ

Max

Units

Test Conditions

V

IN

Input Operating Voltage

 2.7

6.0

V

Note 8

I

OUT

MAX

Maximum Output Current

50

100



mA

TC1223
TC1224

V

OUT

Output Voltage

V

R

 – 2.5%  V

R

 ±0.5%

V

R

 + 2.5%

V

Note 1

TCV

OUT

V

OUT

 Temperature Coefficient


20
40


ppm/°C

Note 2

V

OUT

/

V

IN

Line Regulation

0.05

0.35

%

(V

R

 + 1V) 

V

IN

6V

V

OUT

/V

OUT

Load Regulation

0.5

2

%

I

L

 = 0.1mA to I

OUT

MAX

(Note 3)

V

IN

-V

OUT

Dropout Voltage

                                   TC1224




2

65
85

180


120
250

mV

I

L

 = 100

A

I

L

 = 20mA

I

L

 = 50mA

I

L

 = 100mA (Note 4)

I

IN

Supply Current

50

80

A

SHDN = V

IH

, I

L

 = 0 (Note 7)

I

INSD

Shutdown Supply Current

0.05

0.5

A

SHDN = 0V

PSRR

Power Supply Rejection Ratio

64

dB

F

RE 

1kHz

I

OUT

SC

Output Short Circuit Current

300

450

mA

V

OUT

 = 0V

V

OUT

/

P

D

Thermal Regulation

0.04

V/W

Notes 5, 6

T

SD

Thermal Shutdown Die Temperature

160

°C

T

SD

Thermal Shutdown Hysteresis

10

°C

eN

Output Noise

260

nV/

Hz I

L

 = I

OUT

MAX

SHDN Input

V

IH

SHDN Input High Threshold

45

%V

IN

V

IN

 = 2.5V to 6.5V

V

IL

SHDN Input Low Threshold

15

%V

IN

V

IN

 = 2.5V to 6.5V

Note

1:

V

R

 is the regulator output voltage setting. For example: V

R

 = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.

2:

3:

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range 
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal 
regulation specification. 

4:

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V 
differential.

5:

Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or 
line regulation effects. Specifications are for a current pulse equal to I

LMAX

 at V

IN

 = 6V for T = 10 msec.

6:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the 
thermal resistance from junction-to-air (i.e., T

A

, T

J

JA

). Exceeding the maximum allowable power dissipation causes the device to initiate 

thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.

7:

Apply for Junction Temperatures of -40°C to +85°C.

8:

The minimum V

IN

 has to justify the conditions: V

IN

 

 V

R

 + V

DROPOUT

 and V

IN

 

 2.7V for I

L

 = 0.1mA to I

OUT

MAX

.

TC V

OUT

 = (V

OUT

MAX

 – V

OUT

MIN

) x 10

6

V

OUT 

T

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 2002-2012 Microchip Technology Inc.

DS21368C-page 3

TC1223/TC1224

2.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1:

PIN FUNCTION TABLE

Pin No.

(5-Pin SOT-23A)

Symbol

Description

1

V

IN

Unregulated supply input.

2

GND

Ground terminal.

3

SHDN

Shutdown control input. The regulator is fully enabled when a  logic high is applied to this input. 
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output 
voltage falls to zero and supply current is reduced to 0.5

A (max).

4

NC

No connect.

5

V

OUT

Regulated voltage output.

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TC1223/TC1224

DS21368C-page 4

 2002-2012 Microchip Technology Inc.

3.0

DETAILED DESCRIPTION

The TC1223 and TC1224 are precision fixed output
voltage regulators. Unlike bipolar regulators, the
TC1223 and TC1224’s supply current does not
increase with load current. In addition, V

OUT

 remains

stable and within regulation over the entire 0mA to
I

OUT

MAX

 operating load current range, (an important

consideration in RTC and CMOS RAM battery back-up
applications). 

Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above V

IH

, and shutdown (disabled)

when SHDN is at or below V

IL

. SHDN may be

controlled by a CMOS logic gate, or I/O port of a micro-
controller. If the SHDN input is not required, it should be
connected directly to the input supply. While in
shutdown, supply current decreases to 0.05

A (typical)

and V

OUT

 falls to zero volts.

FIGURE 3-1:

TYPICAL APPLICATION
CIRCUIT

3.1

Output Capacitor

A 1

F (min) capacitor from V

OUT

 to ground is

recommended. The output capacitor should have an
effective series resistance greater than 0.1

 and less

than 5.0

, and a resonant frequency above 1MHz. A

1

F capacitor should be connected from V

IN

 to GND if

there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approxi-
mately -30°C, solid tantalums are recommended for
applications operating below -25°C.)  When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.

TC1223
TC1224

V

OUT

SHDN

GND

NC

1

μF

+

V

IN

V

OUT

Shutdown Control

(to CMOS Logic or Tie

to V

IN

 if unused)

1

μF

+

Battery

+

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 2002-2012 Microchip Technology Inc.

DS21368C-page 5

TC1223/TC1224

4.0

THERMAL CONSIDERATIONS

4.1

Thermal Shutdown 

Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.  

4.2

Power Dissipation 

The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:

EQUATION 4-1:

The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T

A

MAX

), the maximum allowable die temperature

(T

J

MAX

) and the thermal resistance from junction-to-air

(

JA

). The 5-Pin SOT-23A package has a 

JA

 of

approximately 220°C/Watt.

EQUATION 4-2:

Equation 4-1 can be used in conjunction with Equation
4-2  to ensure regulator thermal operation is within
limits. For example:

Given:

V

IN

MAX

 

= 3.0V ±10%

V

OUT

MIN

= 2.7V – 2.5%

I

LOAD

MAX

 = 40mA

T

J

MAX

= 125°C

 

T

A

MAX

= 55°C

 

Find:  1. Actual power dissipation
          2. Maximum allowable dissipation

Actual power dissipation:

P

D

 

 (V

IN

MAX

 – V

OUT

MIN

)I

LOAD

MAX

= [(3.0 x 1.1) – (2.7 x .975)]40 x 10

–3

= 26.7mW

Maximum allowable power dissipation:

In this example, the TC1223 dissipates a maximum of
26.7mW; below the allowable limit of 318mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.

4.3

Layout Considerations

The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower 

JA

  and therefore

increase the maximum allowable power dissipation
limit.

Where:

P

 (V

IN

MAX

 – V

OUT

MIN

)I

LOAD

MAX

P

D

V

IN

MAX

V

OUT

MIN

I

LOAD

MAX

= Worst case actual power dissipation

= Minimum regulator output voltage
= Maximum output (load) current

= Maximum voltage on V

IN

P

D

MAX

= (T

J

MAX

 – T

A

MAX

)

JA

Where all terms are previously defined.

P

D

MAX

 = (T

J

MAX

 – T

A

MAX

)

JA

= (125 – 55)

220

= 318mW

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TC1223/TC1224

DS21368C-page 6

 2002-2012 Microchip Technology Inc.

5.0

TYPICAL CHARACTERISTICS

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

0.000

0.002

0.004

0.006

0.008

0.010

0.012

0.014

0.016

0.018

0.020

-40

-20

0

20

50

70

125

DROPOUT VOLTAGE (V)

I

LOAD

 = 10mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

TEMPERATURE (

°C)

Dropout Voltage vs. Temperature (V

OUT

 

= 3.3V)

0.000

0.020

0.040

0.060

0.080

0.100

0.120

0.140

0.160

0.180

0.200

-40

-20

0

20

50

70

125

DROPOUT VOLTAGE (V)

I

LOAD

 = 100mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

TEMPERATURE (

°C)

Dropout Voltage vs. Temperature (V

OUT

 

= 3.3V)

0

10

20

30

40

50

60

70

80

90

GND CURRENT (

μ

A)

0   0.5  1  1.5   2   2.5   3   3.5   4  4.5    5   5.5  6   6.5   7   7.5

I

LOAD

 = 100mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

Ground Current vs. V

IN

 (V

OUT

 

= 3.3V)

V

IN

 (V)

0.000

0.010

0.020

0.030

0.040

0.050

0.060

0.070

0.080

0.090

0.100

-40

-20

0

20

50

70

125

DROPOUT VOLTAGE (V)

I

LOAD

 = 50mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

TEMPERATURE (

°C)

Dropout Voltage vs. Temperature (V

OUT

 

= 3.3V)

0

10

20

30

40

50

60

70

80

90

GND CURRENT (

μ

A)

0  0.5   1 1.5   2   2.5  3   3.5   4  4.5 5   5.5  6   6.5  7   7.5

I

LOAD

 = 10mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

Ground Current vs. V

IN

 (V

OUT

 

= 3.3V)

V

IN

 (V)

0

0.5

1

1.5

2

2.5

3

3.5

 0    0.5   1  1.5    2   2.5   3   3.5    4   4.5   5    5.5   6   6.5   7

I

LOAD

 = 0

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

V

IN

 (V)

 

V

OUT

 (V)

 

V

OUT

 vs. 

V

IN

 (V

OUT

 

= 3.3V)

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 2002-2012 Microchip Technology Inc.

DS21368C-page 7

TC1223/TC1224

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

(Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

I

LOAD

 = 100mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

0    0.5   1   1.5   2   2.5   3   3.5   4   4.5   5   5.5   6   6.5   7

V

IN

 (V)

 

V

OUT

 (V)

 

V

OUT

 vs. 

V

IN

 (V

OUT

 

= 3.3V)

4.985

4.990

4.995

5.000

5.005

5.010

5.015

5.020

5.025

-40

-20

-10

0

20

40

85

125

I

LOAD

 = 10mA

V

IN

 

= 6V

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

TEMPERATURE (

°C)

Output Voltage vs. Temperature (V

OUT

 

= 5V)

V

OUT

 (V)

 

3.275

3.280

3.285

3.290

3.295

3.300

3.305

3.310

3.315

3.320

-40

-20

-10

0

20

40

85

125

I

LOAD

 = 10mA

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

V

IN

 = 4.3V

TEMPERATURE (

°C)

V

OUT

 (V)

 

Output Voltage vs. Temperature (V

OUT

 

= 3.3V)

                                                                    

   

0

10

20

30

40

50

60

70

-40

-20

-10

0

20

40

85

125

GND CURRENT (

μ

A)

I

LOAD

 = 10mA

V

IN

 

= 6V

C

IN

 

= 1

μF

C

OUT

 

= 1

μF

TEMPERATURE (

°C)

Temperature 

vs. Quiescent Current (V

OUT

 

= 5V)

10.0

1.0

0.1

0.0

0.01K 0.1K

1K

10K

100K

1000K

FREQUENCY (Hz)

Output Noise vs. Frequency

NOISE (

μ

V/

Hz)

R

LOAD

 = 50

Ω 

C

OUT 

= 1

μF

C

IN

 = 1

μF

1000

100

10

1

0.1

0.01

0 10 20 30 40 50 60 70 80 90 100

LOAD CURRENT (mA)

Stability Region vs. Load Current

C

OUT 

ESR

 

(Ω

)

C

OUT

 = 1

μ

to 10

μF

Stable Region

Stable Region

-30

-35

-40

-45

-50

-60

-55

-65

-70

-75

-80

0.01K 0.1K

1K

10K

100K 1000K

FREQUENCY (Hz)

Power Supply Rejection Ratio

PSRR (dB)

I

OUT 

=

 

10mA

V

INDC 

=

 

4V

V

INAC 

=

 

100mVp-p

V

OUT 

=

 

3V

C

IN 

=

 

0

C

OUT 

=

 

1

μF

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TC1223/TC1224

DS21368C-page 8

 2002-2012 Microchip Technology Inc.

5.0

TYPICAL CHARACTERISTICS (CONTINUED)

V

OUT

V

SHDN

Measure Rise Time of 3.3V LDO

Conditions: C

IN

 = 1

μF, C

OUT

 = 1

μF, I

LOAD

 = 100mA, V

IN

 = 4.3V,

Temp = 25

°C, Fall Time = 184μS

V

SHDN

Measure Rise Time of 5.0V LDO

Conditions: C

IN

 = 1

μF, C

OUT

 = 1

μF, I

LOAD

 = 100mA, V

IN

 = 6V,

Temp = 25

°C, Fall Time = 192μS

V

OUT

Thermal Shutdown Response of 5.0V LDO

Conditions: V

IN

 = 6V, C

IN

 = 0

μF, C

OUT

 = 1

μF

I

LOAD

 was increased until temperature of die reached about 160

°C, at

which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160

°C. The regulator

remains off until die temperature drops to approximately 150

°C.

V

OUT

Measure Fall Time of 3.3V LDO

Conditions: C

IN

 = 1

μF, C

OUT

 = 1

μF, I

LOAD

 = 100mA, V

IN

 = 4.3V,

Temp = 25

°C, Fall Time = 52μS

V

OUT

V

SHDN

Measure Fall Time of 5.0V LDO

Conditions: C

IN

 = 1

μF, C

OUT

 = 1

μF, I

LOAD

 = 100mA, V

IN

 = 6V,

Temp = 25

°C, Fall Time = 88μS

V

OUT

V

SHDN

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 2002-2012 Microchip Technology Inc.

DS21368C-page 9

TC1223/TC1224

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

“1” & “2” = part number code + temperature range and

voltage

“3” represents year and quarter code

“4” represents lot ID number

6.2

Taping Form

(V)

TC1223

Code

TC1224

Code

2.5

L1

M1

2.7

L2

M2

2.8

LZ

MZ

2.85

L8

M8

3.0

L3

M3

3.3

L5

M5

3.6

L9

M9

4.0

L0

M0

5.0

L7

M7

Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices

 

Package 

Carrier Width (W) 

Pitch (P) 

Part Per Full Reel 

Reel Size

5-Pin SOT-23A 

8 mm 

4 mm 

3000 

7 in

Carrier Tape, Number of Components Per Reel and Reel Size
 

User Direction of Feed

Device

Marking

PIN 1

Standard Reel Component Orientation
TR Suffix Device
(Mark Right Side Up)

P

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TC1223/TC1224

DS21368C-page 10

 2002-2012 Microchip Technology Inc.

6.3

Package Dimensions

.071 (1.80)
.059 (1.50)

.122 (3.10)
.098 (2.50)

.075 (1.90)

REF.

.020 (0.50)
.012 (0.30)

PIN 1

.037 (0.95)

REF.

.122 (3.10)
.106 (2.70)

.057 (1.45)
.035 (0.90)

.006 (0.15)
.000 (0.00)

.024 (0.60)
.004 (0.10)

10

° MAX.

.010 (0.25)
.004 (0.09)

SOT-23A-5

Dimensions: inches (mm)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

Maker
Microchip Technology Inc.
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