CAP1166 Data Sheet

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 2015 Microchip Technology Inc.

DS00001621B-page 1

General Description

The CAP1166, which incorporates RightTouch

®

 

tech-

nology, is a multiple channel Capacitive Touch sensor
with multiple power LED drivers. It contains six (6) indi-
vidual capacitive touch sensor inputs with programma-
ble sensitivity for use in touch sensor applications.
Each sensor input automatically recalibrates to com-
pensate for gradual environmental changes. 

The CAP1166 also contains six (6) LED drivers that
offer full-on / off, variable rate blinking, dimness con-
trols, and breathing. Each of the LED drivers may be
linked to one of the sensor inputs to be actuated when
a touch is detected. As well, each LED driver may be
individually controlled via a host controller.

The CAP1166 includes Multiple Pattern Touch recogni-
tion that allows the user to select a specific set of but-
tons to be touched simultaneously. If this pattern is
detected, then a status bit is set and an interrupt gen-
erated.

Additionally, the CAP1166 includes circuitry and sup-
port for enhanced sensor proximity detection. 

The CAP1166 offers multiple power states operating at
low quiescent currents. In the Standby state of opera-
tion, one or more capacitive touch sensor inputs are
active and all LEDs may be used. If a touch is detected,
it will wake the system using the WAKE/SPI_MOSI pin.

Deep Sleep is the lowest power state available, draw-
ing 5uA (typical) of current. In this state, no sensor
inputs are active. Driving the WAKE/SPI_MOSI pin or
communications will wake the device.

Applications

• Desktop and Notebook PCs

• LCD Monitors

• Consumer Electronics

• Appliances

Features

• Six (6) Capacitive Touch Sensor Inputs

- Programmable sensitivity

- Automatic recalibration 

- Individual thresholds for each button

• Proximity Detection

• Multiple Button Pattern Detection

• Calibrates for Parasitic Capacitance

• Analog Filtering for System Noise Sources

• Press and Hold feature for Volume-like Applica-

tions

• Multiple Communication Interfaces

- SMBus / I

2

C compliant interface

- SPI communications

- Pin selectable communications protocol and 

multiple slave addresses (SMBus / I

2

C only)

• Low Power Operation

- 5uA quiescent current in Deep Sleep

- 50uA quiescent current in Standby (1 sensor 

input monitored)

- Samples one or more channels in Standby

• Six (6) LED Driver Outputs

- Open Drain or Push-Pull 

- Programmable blink, breathe, and dimness 

controls

- Can be linked to Capacitive Touch Sensor 

inputs

• Dedicated Wake output flags touches in low 

power state 

• System RESET pin 

• Available in 20-pin 4mm x 4mm QFN or 24-pin 

SSOP RoHS compliant package

CAP1166

6 Channel Capacitive Touch Sensor with 6 LED Drivers

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CAP1166

DS00001621B-page 2

 2015 Microchip Technology Inc.

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced. 

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at 

docerrors@microchip.com

. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. 
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; 

http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.

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 to receive the most current information on all of our products.

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 2015 Microchip Technology Inc.

DS00001621B-page 3

CAP1166

Table of Contents

1.0 Block Diagram ................................................................................................................................................................................. 4
2.0 Pin Description  ................................................................................................................................................................................ 5
3.0 Electrical Specifications .................................................................................................................................................................. 9
4.0 Communications  ........................................................................................................................................................................... 12
5.0 General Description  ...................................................................................................................................................................... 23
6.0 Register Description ...................................................................................................................................................................... 29
7.0 Package Information  ..................................................................................................................................................................... 67
Appendix A: Device Delta  ................................................................................................................................................................... 72
Appendix B: Data Sheet Revision History ........................................................................................................................................... 74
The Microchip Web Site  ...................................................................................................................................................................... 76
Customer Change Notification Service  ............................................................................................................................................... 76
Customer Support  ............................................................................................................................................................................... 76
Product Identification System  ............................................................................................................................................................. 77

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DS00001621B-page 4

CAP1166

1.0

BLOCK DIAGRAM

SMBus / 

BC-Link  or 

SPI Slave 

Protocol

SMCLK / BC_CLK / 
SPI_CLK
SMDATA BC_DATA / SPI_MSIO/ 
SPI_MISO

VDD

GND

ALERT# / BC_IRQ#

Capacitive Touch Sensing Algorithm

LED1

CS1

CS2

CS3

CS4

CS5

CS6

LED Driver, Breathe, and 

Dimness control

WAKE / SPI_MOSI

RESET

ADDR_COMM

SPI_CS#

LED2

LED3

LED4

LED5

LED6

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CAP1166

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 2015 Microchip Technology Inc.

2.0

PIN DESCRIPTION

 

FIGURE 2-1:

CAP1166 Pin Diagram (20-Pin QFN)

1

2

3

4

15

14

13

12

20

19

18

17

6

7

8

9

5

10

11

16

CAP1166

20 pin QFN 

GND

LE

D4

LE

D3

LE

D2

LE

D6

LE

D5

SMCLK / BC_CLK / SPI_CLK

WAKE / SPI_MOSI

SPI_CS#

LED1

SMDATA / BC_DATA / SPI_MSIO / 

SPI_MISO

CS

1

CS

2

CS

3

RE

SET

CS6

CS5

ADDR_COMM

CS4

ALERT# / BC_IRQ#

VD

D

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CAP1166

 

FIGURE 2-2:

CAP1166 Pin Diagram (24-pin SSOP)

TABLE 2-1:

PIN DESCRIPTION FOR CAP1166 

Pin 

Number

(QFN 20)

Pin 

Number 

(SSOP 24)

Pin Name

Pin Function

Pin Type

Unused 

Connection

1

4

SPI_CS#

Active low chip-select for SPI bus

DI (5V)

Connect to 

Ground

2

5

WAKE / SPI_-

MOSI

WAKE - Active high wake / interrupt output 

Standby power state - requires pull-down resistor 

WAKE - Active high wake input - requires pull-down 

resistor

Deep Sleep power state

DO 

Pull-down 

Resistor

DI

SPI_MOSI - SPI Master-Out-Slave-In port when used 

in normal mode 

DI (5V) 

Connect to 

GND

CAP1166 

24 SSOP

24

23

22

21

20

17

19

18

16

13

15

14

1

2

3

4

5

8

6

7

9

12

10

11

CS1

RESET

SPI_CS#

WAKE  / SPI_MOSI

SMDATA /SPI_MSIO /  SPI_MISO

SMCLK / SPI_CLK

LED1

LED2

LED3

GND

LED4

GND

LED5

LED6

ALERT# / BC_IRQ#

ADDR_COMM

CS6

CS5

CS4

CS3

CS2

VDD

N/C

N/C

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CAP1166

DS00001621B-page 7

 2015 Microchip Technology Inc.

3

6

SMDATA /  

SPI_MSIO / 

SPI_MISO

SMDATA - Bi-directional, open-drain SMBus data - 

requires pull-up resistor

DIOD (5V)

n/a

SPI_MSIO - SPI Master-Slave-In-Out bidirectional port 

when used in bi-directional mode 

DIO

SPI_MISO - SPI Master-In-Slave-Out port when used 

in normal mode

DO 

4

8

SMCLK /  

SPI_CLK

SMCLK - SMBus clock input - requires pull-up resistor 

DI (5V)

n/a

SPI_CLK - SPI clock input

DI (5V) 

5

9

LED1

Open drain LED 1 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 1 driver

DO

 leave open or 

connect to 

Ground

6

10

LED2

Open drain LED 2 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 2 driver

DO

 leave open or 

connect to 

Ground

7

11

LED3

Open drain LED 3 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 3 driver

DO

 leave open or 

connect to 

Ground

8

13

LED4

Open drain LED 4 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 4 driver

DO

 leave open or 

connect to 

Ground

9

15

LED5

Open drain LED 5 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 5 driver

DO

 leave open or 

connect to 

Ground

10

16

LED6

Open drain LED 6 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 6 driver

DO

 leave open or 

connect to 

Ground

TABLE 2-1:

PIN DESCRIPTION FOR CAP1166  (CONTINUED) 

Pin 

Number

(QFN 20)

Pin 

Number 

(SSOP 24)

Pin Name

Pin Function

Pin Type

Unused 

Connection

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DS00001621B-page 8

CAP1166

APPLICATION NOTE:  When the ALERT# pinis configured as an active low output, it will be open drain. When it is

configured as an active high output, it will be push-pull.

APPLICATION NOTE:  For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V

when the CAP1166 is unpowered. 

APPLICATION NOTE:  The SPI_CS# pin should be grounded when SMBus,  or I

2

C,communications are used.

The pin types are described in 

Table 2-2

. All pins labeled with (5V) are 5V tolerant.

11

17

ALERT# 

ALERT# - Active low alert / interrupt output for SMBus 

alert or SPI interrupt 

- requires pull-up resistor (default) 

OD (5V) 

Connect to 

GND

ALERT# - Active high push-pull alert / interrupt output 

for SMBus alert or SPI interrupt

DO High-Z

12

18

ADDR_ 

COMM

Address / communications select pin - pull-down resis-

tor determines address / communications mechanism

AI

n/a

13

19

CS6

Capacitive Touch Sensor Input 6

AIO

Connect to 

Ground

14

20

CS5

Capacitive Touch Sensor Input 5

AIO

Connect to 

Ground

15

21

CS4

Capacitive Touch Sensor Input 4

AIO

Connect to 

Ground

16

22

CS3

Capacitive Touch Sensor Input 3

AIO

Connect to 

Ground

17

23

CS2

Capacitive Touch Sensor Input 2

AIO

Connect to 

Ground

18

24

CS1

Capacitive Touch Sensor Input 1

AIO

Connect to 

Ground

19

1

VDD

Positive Power supply

Power

n/a

20

1

RESET

Active high soft reset for system - resets all registers to 

default values. If not used, connect to ground.

DI (5V)

Connect to 

Ground

Bottom Pad

12

GND

Ground

Power

n/a

14

GND

Ground

Power

n/a

TABLE 2-1:

PIN DESCRIPTION FOR CAP1166  (CONTINUED) 

Pin 

Number

(QFN 20)

Pin 

Number 

(SSOP 24)

Pin Name

Pin Function

Pin Type

Unused 

Connection

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CAP1166

DS00001621B-page 9

 2015 Microchip Technology Inc.

TABLE 2-2:

PIN TYPES

Pin Type

Description

Power

This pin is used to supply power or ground to the device.

DI

Digital Input - This pin is used as a digital input. This pin is 5V tolerant.

AIO

Analog Input / Output -This pin is used as an I/O for analog signals. 

DIOD

Digital Input / Open Drain Output - This pin is used as a digital I/O. When it is used as an out-
put, it is open drain and requires a pull-up resistor. This pin is 5V tolerant.

OD

Open Drain Digital Output - This pin is used as a digital output. It is open drain and requires a 
pull-up resistor. This pin is 5V tolerant.

DO

Push-pull Digital Output - This pin is used as a digital output and can sink and source current.

DIO

Push-pull Digital Input / Output - This pin is used as an I/O for digital signals. 

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CAP1166

3.0

ELECTRICAL SPECIFICATIONS

 

Note 3-1

Stresses above those listed could cause permanent damage to the device. This is a stress rating
only and functional operation of the device at any other condition above those indicated in the
operation sections of this specification is not implied. 

Note 3-2

For the 5V tolerant pins that have a pull-up resistor, the voltage difference between V

5VT_PIN

 and V

DD

must never exceed 3.6V. 

Note 3-3

The Package Power Dissipation specification assumes a recommended thermal via design consisting
of a 3x3 matrix of 0.3mm (12mil) vias at 1.0mm pitch connected to the ground plane with a 2.5 x
2.5mm thermal landing. 

Note 3-4

Junction to Ambient (

θ

JA

) is dependent on the design of the thermal vias. Without thermal vias and

a thermal landing, the 

θ

JA

 is approximately 60°C/W including localized PCB temperature increase. 

TABLE 3-1:

ABSOLUTE MAXIMUM RATINGS

Voltage on 5V tolerant pins (V

5VT_PIN

)

-0.3 to 5.5

V

Voltage on 5V tolerant pins (|V

5VT_PIN

 - V

DD

|) 

Note 3-2

0 to 3.6

V

Voltage on VDD pin 

-0.3 to 4

V

Voltage on any other pin to GND 

-0.3 to VDD + 0.3

V

Package Power Dissipation up to T

A

 = 85°C for 20 pin QFN

(see 

Note 3-3

)

0.9

W

Junction to Ambient (

θ

JA

) (see 

Note 3-4

)

58

°C/W

Operating Ambient Temperature Range

-40 to 125

°C

Storage Temperature Range

-55 to 150

°C

ESD Rating, All Pins, HBM

8000

V

Maker
Microchip Technology Inc.
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