CAP1128 Data Sheet

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 2015 Microchip Technology Inc.

DS00001622B-page 1

General Description

The CAP1128, which incorporates RightTouch

®

 

tech-

nology, is a multiple channel Capacitive Touch sensor
with multiple power LED drivers. It contains eight (8)
individual capacitive touch sensor inputs with program-
mable sensitivity for use in touch sensor applications.
Each sensor input automatically recalibrates to com-
pensate for gradual environmental changes. 

The CAP1128 also contains two (2) LED drivers that
offer full-on / off, variable rate blinking, dimness con-
trols, and breathing. Each of the LED drivers may be
linked to one of the sensor inputs to be actuated when
a touch is detected. As well, each LED driver may be
individually controlled via a host controller.

The CAP1128 includes Multiple Pattern Touch recogni-
tion that allows the user to select a specific set of but-
tons to be touched simultaneously. If this pattern is
detected, then a status bit is set and an interrupt gen-
erated.

Additionally, the CAP1128 includes circuitry and sup-
port for enhanced sensor proximity detection. 

The CAP1128 offers multiple power states operating at
low quiescent currents. In the Standby state of opera-
tion, one or more capacitive touch sensor inputs are
active and all LEDs may be used. If a touch is detected,
it will wake the system using the WAKE/SPI_MOSI pin.

Deep Sleep is the lowest power state available, draw-
ing 5uA (typical) of current. In this state, no sensor
inputs are active. Driving the WAKE/SPI_MOSI pin or
communications will wake the device.

Applications

• Desktop and Notebook PCs

• LCD Monitors

• Consumer Electronics

• Appliances

Features

• Eight (8) Capacitive Touch Sensor Inputs

- Programmable sensitivity

- Automatic recalibration 

- Individual thresholds for each button

• Proximity Detection

• Multiple Button Pattern Detection

• Calibrates for Parasitic Capacitance

• Analog Filtering for System Noise Sources

• Press and Hold feature for Volume-like Applica-

tions

• Multiple Communication Interfaces

- SMBus / I

2

C compliant interface

- SPI communications

- Pin selectable communications protocol and 

multiple slave addresses (SMBus / I

2

C only)

• Low Power Operation

- 5uA quiescent current in Deep Sleep

- 50uA quiescent current in Standby (1 sensor 

input monitored)

- Samples one or more channels in Standby

• Two (2) LED Driver Outputs 

- Open Drain or Push-Pull 

- Programmable blink, breathe, and dimness 

controls

- Can be linked to Capacitive Touch Sensor 

inputs

• Dedicated Wake output flags touches in low 

power state 

• System RESET pin 

• Available in 20-pin 4mm x 4mm QFN RoHS com-

pliant package

CAP1128

8 Channel Capacitive Touch Sensor with 2 LED Drivers

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CAP1128

DS00001622B-page 2

 2015 Microchip Technology Inc.

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced. 

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at 

docerrors@microchip.com

. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. 
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; 

http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.

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 to receive the most current information on all of our products.

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 2015 Microchip Technology Inc.

DS00001622B-page 3

CAP1128

Table of Contents

1.0 Block Diagram ................................................................................................................................................................................. 4
2.0 Pin Description  ................................................................................................................................................................................ 5
3.0 Electrical Specifications .................................................................................................................................................................. 9
4.0 Communications  ........................................................................................................................................................................... 12
5.0 General Description  ...................................................................................................................................................................... 23
6.0 Register Description ...................................................................................................................................................................... 29
7.0 Package Information  ..................................................................................................................................................................... 67
Appendix A: Device Delta  ................................................................................................................................................................... 72
Appendix B: Data Sheet Revision History ........................................................................................................................................... 74
The Microchip Web Site  ...................................................................................................................................................................... 76
Customer Change Notification Service  ............................................................................................................................................... 76
Customer Support  ............................................................................................................................................................................... 76
Product Identification System  ............................................................................................................................................................. 77

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CAP1128

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 2015 Microchip Technology Inc.

1.0

BLOCK DIAGRAM

SMBus  / 

BC-Link  / 
SPI Slave 

Protocol

SMCLK/ BC_CLK  / 
SPI_CLK
SMDATA / BC_DATA/  SPI_MSIO / 
SPI_MISO

VDD

GND

ALERT# / BC_IRQ#

Capacitive Touch  Sensing Algorithm

LED1

CS1

CS2

CS3

CS4

CS5

CS6

LED Driver, Breathe, 

and Dimness control

WAKE / SPI_MOSI

CS7

CS8

RESET

ADDR_COMM

SPI_CS#

LED2

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DS00001622B-page 5

CAP1128

2.0

PIN DESCRIPTION

 

 

FIGURE 2-1:

CAP1128 Pin Diagram (20-Pin QFN)

TABLE 2-1:

PIN DESCRIPTION FOR CAP1128 

Pin 

Number

Pin Name

Pin Function

Pin Type

Unused 

Connection

1

SPI_CS#

Active low chip-select for SPI bus

DI (5V)

Connect to 

Ground

2

WAKE / SPI_-

MOSI

WAKE - Active high wake / interrupt output 

Standby power state - requires pull-down resistor 

DO 

Pull-down 

Resistor

WAKE - Active high wake input - requires pull-down 

resistor

Deep Sleep power state

DI

SPI_MOSI - SPI Master-Out-Slave-In port when used in 

normal mode 

DI (5V) 

Connect to 

Ground

1

2

3

4

 

15

14

13

12

20

19

18

17

6

7

8

9

GND

AL

ERT#  

/ BC_

IRQ#

WAKE / SPI_MOSI

SPI_CS#

SMCLK / BC_CLK / SPI_CLK

SMDAT / BC_DATA / SPI_MSIO / 

SPI_MISO

CS7

RESET

CS5

CS6

5

10

11

16

VDD

CS1

CS2

CS4

CS8

CS3

N/C

*

LE

D2

LE

D1

ADDR_COMM

CAP1128

20 pin QFN

N/C

*

*

N/C pins must be connected to ground

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CAP1128

DS00001622B-page 6

 2015 Microchip Technology Inc.

3

SMDATA /  

SPI_MSIO / 

SPI_MISO

SMDATA - Bi-directional, open-drain SMBus data - 

requires pull-up resistor

DIOD (5V)

n/a

SPI_MSIO - SPI Master-Slave-In-Out bidirectional port 

when used in bi-directional mode 

DIO

SPI_MISO - SPI Master-In-Slave-Out port when used in 

normal mode

DO 

4

SMCLK / SPI_-

CLK

SMCLK - SMBus clock input - requires pull-up resistor 

DI (5V)

n/a

SPI_CLK - SPI clock input

DI (5V) 

5

N/C

Not Internally Connected

n/a

Connect to 

Ground

6

LED1

Open drain LED 1 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 1 driver

DO

 leave open or 

connect to 

Ground

7

LED2

Open drain LED 2 driver (default)

OD (5V)

Connect to 

Ground

 Push-pull LED 2 driver

DO

 leave open or 

connect to 

Ground

8

N/C

Not Internally Connected

n/a

Connect to 

Ground

9

RESET

Active high soft reset for system - resets all registers to 

default values. If not used, connect to ground.

DI (5V)

Connect to 

Ground

10

ALERT# 

ALERT# - Active low alert / interrupt output for SMBus 

alert or SPI interrupt 

OD (5V) 

Connect to 

Ground

ALERT# - Active high push-pull alert / interrupt output 

for SMBus alert or SPI interrupt

DO leave 

open

11

ADDR_COMM

Address / communications select pin - pull-down resis-

tor determines address / communications mechanism

AI

n/a

12

CS8

Capacitive Touch Sensor Input 8

AIO

Connect to 

Ground

13

CS7

Capacitive Touch Sensor Input 7

AIO

Connect to 

Ground 

14

CS6

Capacitive Touch Sensor Input 6

AIO

Connect to 

Ground 

15

CS5

Capacitive Touch Sensor Input 5

AIO

Connect to 

Ground 

16

CS4

Capacitive Touch Sensor Input 4

AIO

Connect to 

Ground 

TABLE 2-1:

PIN DESCRIPTION FOR CAP1128  (CONTINUED) 

Pin 

Number

Pin Name

Pin Function

Pin Type

Unused 

Connection

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DS00001622B-page 7

CAP1128

APPLICATION NOTE:  When the ALERT# pinis configured as an active low output, it will be open drain. When it is

configured as an active high output, it will be push-pull.

APPLICATION NOTE:  For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V

when the CAP1128 is unpowered. 

APPLICATION NOTE:  The SPI_CS# pin should be grounded when SMBus,  or I

2

C,communications are used.

The pin types are described in 

Table 2-2

. All pins labeled with (5V) are 5V tolerant.

17

CS3

Capacitive Touch Sensor Input 3

AIO

Connect to 

Ground 

18

CS2

Capacitive Touch Sensor Input 2

AIO

Connect to 

Ground 

19

CS1

Capacitive Touch Sensor Input 1

AIO

Connect to 

Ground 

20

VDD

Positive Power supply

Power

n/a

Bottom Pad

GND

Ground

Power

n/a

TABLE 2-2:

PIN TYPES

Pin Type

Description

Power

This pin is used to supply power or ground to the device.

DI

Digital Input - This pin is used as a digital input. This pin is 5V tolerant.

AIO

Analog Input / Output -This pin is used as an I/O for analog signals. 

DIOD

Digital Input / Open Drain Output - This pin is used as a digital I/O. When it is used as an out-
put, it is open drain and requires a pull-up resistor. This pin is 5V tolerant.

OD

Open Drain Digital Output - This pin is used as a digital output. It is open drain and requires a 
pull-up resistor. This pin is 5V tolerant.

DO

Push-pull Digital Output - This pin is used as a digital output and can sink and source current.

DIO

Push-pull Digital Input / Output - This pin is used as an I/O for digital signals. 

TABLE 2-1:

PIN DESCRIPTION FOR CAP1128  (CONTINUED) 

Pin 

Number

Pin Name

Pin Function

Pin Type

Unused 

Connection

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CAP1128

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 2015 Microchip Technology Inc.

3.0

ELECTRICAL SPECIFICATIONS

 

Note 3-1

Stresses above those listed could cause permanent damage to the device. This is a stress rating
only and functional operation of the device at any other condition above those indicated in the
operation sections of this specification is not implied. 

Note 3-2

For the 5V tolerant pins that have a pull-up resistor, the voltage difference between V

5VT_PIN

 and V

DD

must never exceed 3.6V. 

Note 3-3

The Package Power Dissipation specification assumes a recommended thermal via design consisting
of a 3x3 matrix of 0.3mm (12mil) vias at 1.0mm pitch connected to the ground plane with a 2.5 x
2.5mm thermal landing. 

Note 3-4

Junction to Ambient (

θ

JA

) is dependent on the design of the thermal vias. Without thermal vias and

a thermal landing, the 

θ

JA

 is approximately 60°C/W including localized PCB temperature increase. 

TABLE 3-1:

ABSOLUTE MAXIMUM RATINGS

Voltage on 5V tolerant pins (V

5VT_PIN

)

-0.3 to 5.5

V

Voltage on 5V tolerant pins (|V

5VT_PIN

 - V

DD

|) 

Note 3-2

0 to 3.6

V

Voltage on VDD pin 

-0.3 to 4

V

Voltage on any other pin to GND 

-0.3 to VDD + 0.3

V

Package Power Dissipation up to T

A

 = 85°C for 20 pin QFN

(see 

Note 3-3

)

0.9

W

Junction to Ambient (

θ

JA

) (see 

Note 3-4

)

58

°C/W

Operating Ambient Temperature Range

-40 to 125

°C

Storage Temperature Range

-55 to 150

°C

ESD Rating, All Pins, HBM

8000

V

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DS00001622B-page 9

CAP1128

 

TABLE 3-2:

ELECTRICAL SPECIFICATIONS

V

DD

 = 3V to 3.6V, T

A

 = 0°C to 85°C, all typical values at T

A

 = 27°C unless otherwise noted.

Characteristic

Symbol

Min

Typ

Max

Unit

Conditions

DC Power

Supply Voltage 

V

DD

3.0

3.3

3.6

V

Supply Current

I

STBY

120

170

uA

Standby state active 

1 sensor input monitored

No LEDs active

Default conditions (8 avg, 70ms 

cycle time)

I

STBY

50

uA

Standby state active

1 sensor input monitored

No LEDs active

1 avg, 140ms cycle time,

I

DSLEEP

5

15

uA

Deep Sleep state active

LEDs at 100% or 0% Duty Cycle

No communications

T

A

 < 40°C

3.135 < V

DD 

< 3.465V 

I

DD

500

600

uA

Capacitive Sensing Active

No LEDs active

Capacitive Touch Sensor Inputs

Maximum Base 

Capacitance

C

BASE

50

pF

Pad untouched

Minimum Detectable 

Capacitive Shift

Δ

C

TOUCH

20

fF

Pad touched - default conditions (1 

avg, 35ms cycle time, 1x sensitiv-

ity) 

Recommended Cap 

Shift

Δ

C

TOUCH

0.1

2

pF

Pad touched - Not tested

Power Supply Rejec-

tion

PSR

±3

±10

counts / 

V

Untouched Current Counts 

Base Capacitance 5pF - 50pF

Maximum sensitivity

Negative Delta Counts disabled

All other parameters default

Timing 

RESET Pin Delay

t

RST_DLY

10

ms

Time to communica-

tions ready

t

COMM_DLY

15

ms

Time to first conver-

sion ready

t

CONV_DLY

170

200

ms

LED Drivers 

Duty Cycle

DUTY

LED

0

100

%

Programmable

Drive Frequency

f

LED

2

kHz

Sinking Current

I

SINK

24

mA

V

OL

 = 0.4

Sourcing Current

I

SOURCE

24

mA

V

OH

 = V

DD

 - 0.4

Leakage Current

I

LEAK

±5

uA

powered or unpowered

TA < 85°C

pull-up voltage < 3.6V if unpowered

I/O Pins

Output Low Voltage

V

OL

0.4

V

I

SINK_IO

 = 8mA

Output High Voltage

V

OH

V

DD

 - 0.4

V

I

SOURCE_IO

 = 8mA

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CAP1128

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Note 3-5

The ALERT pin will not glitch high or low at power up if connected to VDD or another voltage. 

Note 3-6

The SMCLK and SMDATA pins will not glitch low at power up if connected to VDD or another voltage. 

Input High Voltage

V

IH

2.0

V

Input Low Voltage

V

IL

0.8

V

Leakage Current

I

LEAK

±5

uA

powered or unpowered

T

A

 < 85°C

pull-up voltage < 3.6V if unpowered

RESET Pin Release 

to conversion ready

t

RESET

170

200

ms

SMBus Timing

Input Capacitance

C

IN

5

pF

Clock Frequency

f

SMB

10

400

kHz

Spike Suppression

t

SP

50

ns

Bus Free Time Stop to 

Start

t

BUF

1.3

us

Start Setup Time

t

SU:STA

0.6

us

Start Hold Time

t

HD:STA

0.6

us

Stop Setup Time

t

SU:STO

0.6

us

Data Hold Time

t

HD:DAT

0

us

When transmitting to the master

Data Hold Time

t

HD:DAT

0.3

us

When receiving from the master

Data Setup Time

t

SU:DAT

0.6

us

Clock Low Period

t

LOW

1.3

us

Clock High Period

t

HIGH

0.6

us

Clock / Data Fall Time

t

FALL

300

ns

Min = 20+0.1C

LOAD

 ns

Clock / Data Rise 

Time

t

RISE

300

ns

Min = 20+0.1C

LOAD

 ns

Capacitive Load

C

LOAD

400

pF

per bus line

SPI Timing

Clock Period 

t

P

250

ns

Clock Low Period

t

LOW

0.4 x t

P

0.6 x t

P

ns

Clock High Period

t

HIGH

0.4 x t

P

0.6 x t

P

ns

Clock Rise / Fall time

t

RISE

 / t

FALL

0.1 x t

P

ns

Data Output Delay

t

D:CLK

10

ns

Data Setup Time

t

SU:DAT

20

ns

Data Hold Time

t

HD:DAT

20

ns

SPI_CS# to SPI_CLK 

setup time

t

SU:CS

0

ns

Wake Time

t

WAKE

10

20

us

SPI_CS# asserted to CLK assert

TABLE 3-2:

ELECTRICAL SPECIFICATIONS (CONTINUED) 

V

DD

 = 3V to 3.6V, T

A

 = 0°C to 85°C, all typical values at T

A

 = 27°C unless otherwise noted.

Characteristic

Symbol

Min

Typ

Max

Unit

Conditions

Maker
Microchip Technology Inc.
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